Publications

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A complementary metal oxide semiconductor (CMOS) compatible fabrication method for creating three-dimensional (3D) meta-films is presented. In contrast to metasurfaces, meta-films possess structural variation throughout the thickness of the film and can possess a sub-wavelength scale structure in all three dimensions. Here we use this approach to create 2D arrays of cubic silicon nitride unit cells with plasmonic inclusions of elliptical metallic disks in horizontal and vertical orientations with lateral array-dimensions on the order of millimeters. Fourier transform infrared (FTIR) spectroscopy is used to measure the infrared transmission of meta-films with either horizontally or vertically oriented ellipses with varying eccentricity. Shape effects due to the ellipse eccentricity, as well as localized surface plasmon resonance (LSPR) effects due to the effective plasmonic wavelength are observed in the scattering response. The structures were modeled using rigorous coupled wave analysis (RCWA), finite difference time domain (Lumerical), and frequency domain finite element (COMSOL). The silicon nitride support structure possesses a complex in-plane photonic crystal slab band structure due to the periodicity of the unit cells. We show that adjustments to the physical dimensions of the ellipses can be used to control the coupling to this band structure. The horizontally oriented ellipses show narrow, distinct plasmonic resonances while the vertically oriented ellipses possess broader resonances, with lower overall transmission amplitude for a given ellipse geometry. We attribute this difference in resonance behavior to retardation effects. The ability to couple photonic slab modes with plasmonic inclusions enables a richer space of optical functionality for design of metamaterial-inspired optical components.

State of the art grating fabrication currently limits the maximum source energy that can be used in lab based x-ray phase contrast imaging (XPCI) systems. In order to move to higher source energies, and image high density materials or image through encapsulating barriers, new grating fabrication methods are needed. In this work we have analyzed a new modality for grating fabrication that involves precision alignment of etched gratings on both sides of a substrate, effectively doubling the thickness of the grating. We have achieved a front-to-backside feature alignment accuracy of 0.5 µm demonstrating a methodology that can be applied to any grating fabrication approach extending the attainable aspect ratios allowing higher energy lab based XPCI systems.

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The manufacturing tolerances of a stencil-lithography variant, membrane projection lithography, were investigated. In the first part of this work, electron beam lithography was used to create stencils with a range of linewidths. These patterns were transferred into the stencil membrane and used to pattern metallic lines on vertical silicon faces. Only the largest lines, with a nominal width of 84 nm, were resolved, resulting in 45 ± 10 nm (average ± standard deviation) as deposited with 135-nm spacing. Although written in the e-beam write software file as 84-nm in width, the lines exhibited linewidth bias. This can largely be attributed to nonvertical sidewalls inherent to dry etching techniques that cause proportionally larger impact with decreasing feature size. The line edge roughness can be significantly attributed to the grain structure of the aluminum nitride stencil membrane. In the second part of this work, the spatial uniformity of optically defined (as opposed to e-beam written) metamaterial structures over large areas was assessed. A Fourier transform infrared spectrometer microscope was used to collect the reflection spectra of samples with optically defined vertical split ring from 25 spatially resolved 300 × 300 μm regions in a 1-cm2 area. The technique is shown to provide a qualitative measure of the uniformity of the inclusions.

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A unique, micro-scale architecture is proposed to create a novel hybrid concentrated photovoltaic system. Micro-scale (sub-millimeter wide), multi-junction cells are attached to a large-area silicon cell backplane (several inches wide) that can optimally collect both direct and diffuse light. By using multi- junction III-V cells, we can get the highest possible efficiency of the direct light input. In addition, by collecting the diffuse light in the large-area silicon cell, we can produce power on cloudy days when the concentrating cells would have minimal output. Through the use of micro-scale cells and lenses, the overall assembly will provide higher efficiency than conventional concentrators and flat plates, while keeping the form factor of a flat plate module. This report describes the hybrid concept, the design of a prototype, including the PV cells and optics, and the experimental results.

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A method for patterning on vertical silicon surfaces in high aspect ratio silicon topography is presented. A Faraday cage is used to direct energetic reactive ions obliquely through a patterned suspended membrane positioned over the topography. The technique is capable of forming high-fidelity pattern (100 nm) features, adding an additional fabrication capability to standard top-down fabrication approaches.

Emerging nano-photonic and nano-opto-mechanical applications benefit from fabrication of complex three-dimensional structures. Creation of micrometer scale and sub-micrometer scale structures can be performed either additively, or subtractively. Additive techniques, where material is deposited, such as direct laser write, interferometric lithography, nano-origami and colloidal self-assembly have been used to create a wide array of complex sub-micrometer structures. Example of subtractive fabrication of three-dimensional structures, where material is removed, are less common.

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Microsystems Enabled Photovoltaics (MEPV) is a relatively new field that uses microsystems tools and manufacturing techniques familiar to the semiconductor industry to produce microscale photovoltaic cells. The miniaturization of these PV cells creates new possibilities in system designs that can be used to reduce costs, enhance functionality, improve reliability, or some combination of all three. In this article, we introduce analytical tools and techniques to estimate the costs associated with a hybrid concentrating photovoltaic system that uses multi-junction microscale photovoltaic cells and miniaturized concentrating optics for harnessing direct sunlight, and an active c-Si substrate for collecting diffuse sunlight. The overall model comprises components representing costs and profit margin associated with the PV cells, concentrating optics, balance of systems, installation, and operation. This article concludes with an analysis of the component costs with particular emphasis on the microscale PV cell costs and the associated tradeoffs between cost and performance for the hybrid CPV design.

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After years in the field, many materials suffer degradation, off-gassing, and chemical changes causing build-up of measurable chemical atmospheres. Stand-alone embedded chemical sensors are typically limited in specificity, require electrical lines, and/or calibration drift makes data reliability questionable. Along with size, these "Achilles' heels" have prevented incorporation of gas sensing into sealed, hazardous locations which would highly benefit from in-situ analysis. We report on development of an all-optical, mid-IR, fiber-optic based MEMS Photoacoustic Spectroscopy solution to address these limitations. Concurrent modeling and computational simulation are used to guide hardware design and implementation.

Microsystems-enabled photovoltaics (MEPV) has great potential to meet the increasing demands for light-weight, photovoltaic solutions with high power density and efficiency. This paper describes effective failure analysis techniques to localize and characterize nonfunctional or underperforming MEPV cells. The defect localization methods such as electroluminescence under forward and reverse bias, as well as optical beam induced current using wavelengths above and below the device band gap, are presented. The current results also show that the MEPV has good resilience against degradation caused by reverse bias stresses. © 2013 IEEE.

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Microsystems-enabled photovoltaic (MEPV) technology is a promising approach to lower the cost of solar energy to competitive levels. This paper describes current development efforts to leverage existing silicon integrated circuit (IC) failure analysis (FA) techniques to study MEPV devices. Various FA techniques such as light emission microscopy and laser-based fault localization were used to identify and characterize primary failure modes after fabrication and packaging. The FA results provide crucial information used in provide corrective actions and improve existing MEPV fabrication techniques. © 2013 IEEE.

Back-contacted, ultrathin (<10 μm), and submillimeter-sized solar cells made with microsystem tools are a new type of cell that has not been optimized for performance. The literature reports efficiencies up to 15% using thicknesses of 14 μm and cell sizes of 250 μm. In this paper, we present the design, conditions, and fabrication parameters necessary to optimize these devices. The optimization was performed using commercial simulation tools from the microsystems arena. A systematic variation of the different parameters that influence the performance of the cell was accomplished. The researched parameters were resistance, Shockley-Read-Hall (SRH) lifetime, contact separation, implant characteristics (size, dosage, energy, and ratio between the species), contact size, substrate thickness, surface recombination, and light concentration. The performance of the cell was measured with efficiency, open-circuit voltage, and short-circuit current. Among all the parameters investigated, surface recombination and SRH lifetime proved to be the most important. Through completing the simulations, an optimized concept solar cell design was introduced for two scenarios: high and low quality materials/passivation. Simulated efficiencies up to 23.4% (1 sun) and 26.7% (100 suns) were attained for 20-μm-thick devices. Copyright © 2012 John Wiley & Sons, Ltd. Back-contacted, ultrathin (<10 μm), and submillimeter-sized solar cells made with microsystem tools are a new type of cell that has not been optimized for performance. In this paper, we present the design conditions and fabrication parameters necessary to optimize these devices via simulations. Through completing the simulations, an optimized concept solar cell design was introduced for two scenarios: high and low quality materials/passivation. Simulated efficiencies up to 23.4% (1 sun) and 26.7% (100 suns) were attained for 20-μm-thick devices. Copyright © 2012 John Wiley & Sons, Ltd.

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We present ultra-thin single crystal mini-modules built with specific power of 450 W/kg capable of voltages of >1000 V/cm2. These modules are also ultra-flexible with tight bending radii down to 1 mm. The module is composed of hundreds of back contact microcells with thicknesses of approximately 20 μm and diameters between 500-720 μm. The cells are interconnected to a flexible circuit through solder contacts. We studied the characteristics of several mini-modules through optical inspection, evaluation of quantum efficiency, measurement of current-voltage curves, and temperature dependence. Major efficiency losses are caused by missing cells or non-interconnected cells. Secondarily, damage incurred during separation of 500 μm cells from the substrate caused material detachment. The detachment induced higher recombination and low performance. Modules made with the larger cells (720 μm) performed better due to having no missing cells, no material detachment and optimized AR coatings. The conversion efficiency of the best mini module was 13.75% with a total Voc = 7.9 V. © 2013 IEEE.

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Microsystem technologies have the potential to significantly improve the performance, reduce the cost, and extend the capabilities of solar power systems. These benefits are possible due to a number of significant beneficial scaling effects within solar cells, modules, and systems that are manifested as the size of solar cells decrease to the sub-millimeter range. To exploit these benefits, we are using advanced fabrication techniques to create solar cells from a variety of compound semiconductors and silicon that have lateral dimensions of 250 - 1000 μm and are 1 - 20 μm thick. These fabrication techniques come out of relatively mature microsystem technologies such as integrated circuits (IC) and microelectromechanical systems (MEMS) which provide added supply chain and scale-up benefits compared to even incumbent PV technologies. © The Electrochemical Society.

We present ultra-thin single crystal mini-modules built with specific power of 450 W/kg capable of voltages of >1000 V/cm2. These modules are also ultra-flexible with tight bending radii down to 1 mm. The module is composed of hundreds of back contact microcells with thicknesses of approximately 20 μm and diameters between 500-720 μm. The cells are interconnected to a flexible circuit through solder contacts. We studied the characteristics of several mini-modules through optical inspection, evaluation of quantum efficiency, measurement of current-voltage curves, and temperature dependence. Major efficiency losses are caused by missing cells or non-interconnected cells. Secondarily, damage incurred during separation of 500 μm cells from the substrate caused material detachment. The detachment induced higher recombination and low performance. Modules made with the larger cells (720 μm) performed better due to having no missing cells, no material detachment and optimized AR coatings. The conversion efficiency of the best mini module was 13.75% with a total Voc = 7.9 V. © 2013 IEEE.

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We report on the application of MEMS and other microsystem technologies to photovoltaic (PV) cells, modules, and systems, taking advantage of several, significant benefits that are realized as the size of solar cells decrease to sub-mm length scales. To demonstrate these effects, we have developed both crystalline silicon and III-V PV cells. These cells are from 2 to 20 microns thick and from 250 microns to one millimeter across. We have demonstrated conversion efficiencies of up to 14.9% for a 14 micron thick crystalline silicon PV cell. This work contributes to two broad PV applications: 1) highly flexible PV modules with conversion efficiencies greater than 20%, and 2) commercial/utility scale PV systems using moderate concentration flat plate modules with simple single-axis or coarse dual-axis tracking. Cost models indicate that systems based on these technologies can achieve unsubsidized energy costs of less than $0.10/kWh. © The Electrochemical Society.

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We present an approach to create ultrathin (<20μm) and highly flexible crystalline silicon sheets on inexpensive substrates. We have demonstrated silicon sheets capable of bending at a radius of curvature as small as 2mm without damaging the silicon structure. Using microsystem tools, we created a suspended submillimeter honeycomb-segmented silicon structure anchored to the wafer only by small tethers. This structure is created in a standard thickness wafer enabling compatibility with common processing tools. The procedure enables all the high-temperature steps necessary to create a solar cell to be completed while the cells are on the wafer. In the transfer process, the cells attach to an adhesive flexible substrate which, when pulled away from the wafer, breaks the tethers and releases the honeycomb structure. We have previously demonstrated that submillimeter and ultrathin silicon segments can be converted into highly efficient solar cells, achieving efficiencies up to 14.9% at a thickness of 14μm. With this technology, achieving high efficiency (>15%) and highly flexible photovoltaic (PV) modules should be possible. © 2011 IEEE.

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Microsystem-Enabled Photovoltaic (MEPV) cells allow solar PV systems to take advantage of scaling benefits that occur as solar cells are reduced in size. We have developed MEPV cells that are 5 to 20 microns thick and down to 250 microns across. We have developed and demonstrated crystalline silicon (c-Si) cells with solar conversion efficiencies of 14.9%, and gallium arsenide (GaAs) cells with a conversion efficiency of 11.36%. In pursuing this work, we have identified over twenty scaling benefits that reduce PV system cost, improve performance, or allow new functionality. To create these cells, we have combined microfabrication techniques from various microsystem technologies. We have focused our development efforts on creating a process flow that uses standard equipment and standard wafer thicknesses, allows all high-temperature processing to be performed prior to release, and allows the remaining post-release wafer to be reprocessed and reused. The c-Si cell junctions are created using a backside point-contact PV cell process. The GaAs cells have an epitaxially grown junction. Despite the horizontal junction, these cells also are backside contacted. We provide recent developments and details for all steps of the process including junction creation, surface passivation, metallization, and release.

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We present a newly developed microsystem enabled, back-contacted, shade-free GaAs solar cell. Using microsystem tools, we created sturdy 3 {micro}m thick devices with lateral dimensions of 250 {micro}m, 500 {micro}m, 1 mm, and 2 mm. The fabrication procedure and the results of characterization tests are discussed. The highest efficiency cell had a lateral size of 500 {micro}m and a conversion efficiency of 10%, open circuit voltage of 0.9 V and a current density of 14.9 mA/cm{sup 2} under one-sun illumination.

Thin and small form factor cells have been researched lately by several research groups around the world due to possible lower assembly costs and reduced material consumption with higher efficiencies. Given the popularity of these devices, it is important to have detailed information about the behavior of these devices. Simulation of fabrication processes and device performance reveals some of the advantages and behavior of solar cells that are thin and small. Three main effects were studied: the effect of surface recombination on the optimum thickness, efficiency, and current density, the effect of contact distance on the efficiency for thin cells, and lastly the effect of surface recombination on the grams per Watt-peak. Results show that high efficiency can be obtained in thin devices if they are well-passivated and the distance between contacts is short. Furthermore, the ratio of grams per Watt-peak is greatly reduced as the device is thinned.

Technologies that have been developed for microelectromechanical systems (MEMS) have been applied to the fabrication of field desorption arrays. These techniques include the use of thick films for enhanced dielectric stand-off, as well as an integrated gate electrode. The increased complexity of MEMS fabrication provides enhanced design flexibility over traditional methods.

We present a newly developed microsystem enabled, back-contacted, shade-free GaAs solar cell. Using microsystem tools, we created sturdy 3 {micro}m thick devices with lateral dimensions of 250 {micro}m, 500 {micro}m, 1 mm, and 2 mm. The fabrication procedure and the results of characterization tests are discussed. The highest efficiency cell had a lateral size of 500 {micro}m and a conversion efficiency of 10%, open circuit voltage of 0.9 V and a current density of 14.9 mA/cm{sup 2} under one-sun illumination.

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Acoustic sensing systems are critical elements in detection of sniper events. The microphones developed in this project enable unique sensing systems that benefit significantly from the enhanced sensitivity and extremely compact foot-print. Surface and bulk micromachining technologies developed at Sandia have allowed the design, fabrication and characterization of these unique sensors. We have demonstrated sensitivity that is only available in 1/2 inch to 1 inch studio reference microphones--with our devices that have only 1 to 2mm diameter membranes in a volume less than 1cm{sup 3}.

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Recent world events have underscored the need for a satellite based persistent global surveillance capability. To be useful, the satellite must be able to continuously monitor objects the size of a person anywhere on the globe and do so at a low cost. One way to satisfy these requirements involves a constellation of satellites in low earth orbit capable of resolving a spot on the order of 20 cm. To reduce cost of deployment, such a system must be dramatically lighter than a traditional satellite surveillance system with a high spatial resolution. The key to meeting this requirement is a lightweight optics system with a deformable primary and secondary mirrors and an adaptive optic subsystem correction of wavefront distortion. This proposal is concerned with development of MEMS micromirrors for correction of aberrations in the primary mirror and improvement of image quality, thus reducing the optical requirements on the deployable mirrors. To meet this challenge, MEMS micromirrors must meet stringent criteria on their performance in terms of flatness, roughness and resolution of position. Using Sandia's SUMMIT foundry which provides the world's most sophisticated surface MEMS technology as well as novel designs optimized by finite element analysis will meet severe requirements on mirror travel range and accuracy.

The use of sulfuric acid based chemistries for the removal of photoresist ashing residue was investigated. Samples were prepared by ion-implanting patterned, UV-hardened photoresist. The efficacy of post-ash cleaning was determined by measuring organic, metallic, and particulate surface concentrations. Sulfuric-nitric mixtures and sulfuric-hydrogen peroxide mixtures were highly effective for the removal of metallic contaminants. Neither chemistry was very effective for particulate and organic residue. Highly effective overall cleaning was observed when a sulfuric acid based clean was followed with an RCA-type process sequence. Redundant cleans provided no additional benefits. Post-ash cleaning may be simplified by either reducing the number of sulfuric acid based cleans, or for certain post-ash applications, by replacing them with RCA-type processes.

The use of dilute SC-1 (NH40H:H202:H20) chemistry cleaning processes for particle removal from silicon surfaces has been investigated. Dilute chemistries can be highly effective, especially when high- frequency acoustic energy (megasonics) is applied. The high particle removal efficacy of the dilute chemistry processes presumably arises due to increased double layer effects caused by reduced ionic strength. Dilute chemistry SC- I solutions exhibit somewhat reduced efficacy for removal of certain light organics; however, when dilute SC-1 is used along with other pre-gate cleaning steps (e.g. HF, SC-2, and piranha), then the overall cleaning sequence is quite effective. In addition to providing robust cleaning processes, dilute chemistries also result in significantly lower chemical and rinse water usage. Waste water treatment requirements are also lessened when dilute chemistry cleaning solutions are employed.

Recent research has shown that dilute SC-1 chemistries, when combined with high frequency sonication (megasonics) can be highly effective for particle removal. The mechanism by which the SC-1 chemistry facilitates particle removal remains unclear. Experiments were performed under extremely dilute conditions in order to help elucidate a cleaning mechanism. Results indicate that hydrogen peroxide, under extremely dilute conditions, is not necessary for effective particle removal. The increase in haze commonly attributed to increased surface roughness is not observed when sufficiently dilute ammonium hydroxide (e.g., 1:2700) is used. The role of hydrogen peroxide, when more concentrated chemistries are used, may be simply to mitigate surface etching and roughening, rather than to play an active role in particle removal.

Particulate contamination during IC fabrication is generally acknowledged as a major contributor to yield loss. In particular, plasma processes have the potential for generating copious quantities of process induced particulates. Ideally, in order to effectively control process generated particulate contamination, a fundamental understanding of the particulate generation and transport is essential. Although a considerable amount of effort has been expended to study particles in laboratory apparatus, only a limited amount of work has been performed in production line equipment with production processes. In these experiments, a Drytek Quad Model 480 single wafer etcher was used to etch blanket thermal SiO{sub 2} films on 150 mm substrates in fluorocarbon discharges. The effects of rf power, reactor pressure, and feed gas composition on particle production rates were evaluated. Particles were measured using an HYT downstream particle flux monitor. Surface particle deposition was measured using a Tencor Surfscan 4500, as well as advanced ex situ techniques. Particle morphology and composition were also determined ex situ. Response surface methodology was utilized to determine the process conditions under which particle generation was most pronounced. The use of in situ and ex situ techniques has provided some insight into the mechanisms involved for particle generation and particle dynamics within the plasma during oxide etching.