Publications

We demonstrate piezo-optomechanical phase control in a c-band silicon-photonic resonator using CMOS-compatible AlN microactuators. We achieve a frequency tuning response of 26.91 ± 0.77 MHz/V DC, operating at picowatt to nanowatt power levels.

TFLN/silicon photonic modulators featuring active silicon photonic components are reported with a Vπ of 3.6 Vcm. This hybrid architecture utilizes the bottom of the buried oxide as the bonding surface which features minimum topology.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Metasurface lenses are fabricated using membrane projection lithography following a CMOS-compatible process flow. The lenses are 10-mm in diameter and employ 3-dimensional unit cells designed to function in the mid-infrared spectral range.

We demonstrate an optical waveguide device capable of supporting the optical power necessary for trapping a single atom or a cold-atom ensemble with evanescent fields. Our photonic integrated platform successfully manages optical powers of ~30mW.

Abstract not provided.

We demonstrate an optical waveguide device, capable of supporting the high, invacuum, optical power necessary for trapping a single atom or a cold atom ensemble with evanescent fields. Our photonic integrated platform, with suspended membrane waveguides, successfully manages optical powers of 6 mW (500 μm span) to nearly 30 mW (125 μm span) over an un-tethered waveguide span. This platform is compatible with laser cooling and magnetooptical traps (MOTs) in the vicinity of the suspended waveguide, called the membrane MOT and the needle MOT, a key ingredient for efficient trap loading. We evaluate two novel designs that explore critical thermal management features that enable this large power handling. This work represents a significant step toward an integrated platform for coupling neutral atom quantum systems to photonic and electronic integrated circuits on silicon.

Abstract not provided.

Abstract not provided.

Abstract not provided.

A complementary metal oxide semiconductor (CMOS) compatible fabrication method for creating three-dimensional (3D) meta-films is presented. In contrast to metasurfaces, meta-films possess structural variation throughout the thickness of the film and can possess a sub-wavelength scale structure in all three dimensions. Here we use this approach to create 2D arrays of cubic silicon nitride unit cells with plasmonic inclusions of elliptical metallic disks in horizontal and vertical orientations with lateral array-dimensions on the order of millimeters. Fourier transform infrared (FTIR) spectroscopy is used to measure the infrared transmission of meta-films with either horizontally or vertically oriented ellipses with varying eccentricity. Shape effects due to the ellipse eccentricity, as well as localized surface plasmon resonance (LSPR) effects due to the effective plasmonic wavelength are observed in the scattering response. The structures were modeled using rigorous coupled wave analysis (RCWA), finite difference time domain (Lumerical), and frequency domain finite element (COMSOL). The silicon nitride support structure possesses a complex in-plane photonic crystal slab band structure due to the periodicity of the unit cells. We show that adjustments to the physical dimensions of the ellipses can be used to control the coupling to this band structure. The horizontally oriented ellipses show narrow, distinct plasmonic resonances while the vertically oriented ellipses possess broader resonances, with lower overall transmission amplitude for a given ellipse geometry. We attribute this difference in resonance behavior to retardation effects. The ability to couple photonic slab modes with plasmonic inclusions enables a richer space of optical functionality for design of metamaterial-inspired optical components.

Abstract not provided.

State of the art grating fabrication currently limits the maximum source energy that can be used in lab based x-ray phase contrast imaging (XPCI) systems. In order to move to higher source energies, and image high density materials or image through encapsulating barriers, new grating fabrication methods are needed. In this work we have analyzed a new modality for grating fabrication that involves precision alignment of etched gratings on both sides of a substrate, effectively doubling the thickness of the grating. We have achieved a front-to-backside feature alignment accuracy of 0.5 µm demonstrating a methodology that can be applied to any grating fabrication approach extending the attainable aspect ratios allowing higher energy lab based XPCI systems.

Abstract not provided.

Abstract not provided.

Abstract not provided.

The manufacturing tolerances of a stencil-lithography variant, membrane projection lithography, were investigated. In the first part of this work, electron beam lithography was used to create stencils with a range of linewidths. These patterns were transferred into the stencil membrane and used to pattern metallic lines on vertical silicon faces. Only the largest lines, with a nominal width of 84 nm, were resolved, resulting in 45 ± 10 nm (average ± standard deviation) as deposited with 135-nm spacing. Although written in the e-beam write software file as 84-nm in width, the lines exhibited linewidth bias. This can largely be attributed to nonvertical sidewalls inherent to dry etching techniques that cause proportionally larger impact with decreasing feature size. The line edge roughness can be significantly attributed to the grain structure of the aluminum nitride stencil membrane. In the second part of this work, the spatial uniformity of optically defined (as opposed to e-beam written) metamaterial structures over large areas was assessed. A Fourier transform infrared spectrometer microscope was used to collect the reflection spectra of samples with optically defined vertical split ring from 25 spatially resolved 300 × 300 μm regions in a 1-cm2 area. The technique is shown to provide a qualitative measure of the uniformity of the inclusions.