ALD Platinum Surface Preparation and Copper Electrodeposition in Blind Mesoscale Through-Silicon-Vias
Menk, Lyle A.; Arrington, Christian L.; Bauer, Todd B.; Blain, Matthew G.; Dominguez, Jason J.; Dyer, Isaac D.; Goeke, Ronald S.; Han, Sang S.; Heller, Edwin J.; Hollowell, Andrew E.; Jarecki, Robert L.; Loviza, Becky G.; McClain, Jaime L.; Pillars, Jamin R.; Resnick, Paul J.; St John, Christopher S.; Timon, Robert P.
Abstract not provided.