Passive, Capacitive, Interdigitated Comb Sensors: Towards a Data-Driven, Mechanistic Understanding of Surface Insulation Resistance
Abstract not provided.
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Jump to search filtersUnlocking the Process-Structure-Properties-Performance Paradigm for Accelerated Discovery of Innovative Materials
Abstract not provided.
Towards a Mechanistic Understanding of Surface Insulation Resistance
Abstract not provided.
AI for Technoscientific Discovery: A Human-Inspired Architecture
Journal of Creativity (Online)
We present a high-level architecture for how artificial intelligences might advance and accumulate scientific and technological knowledge, inspired by emerging perspectives on how human intelligences advance and accumulate such knowledge. Agents advance knowledge by exercising a technoscientific method—an interacting combination of scientific and engineering methods. The technoscientific method maximizes a quantity we call “useful learning” via more-creative implausible utility (including the “aha!” moments of discovery), as well as via less-creative plausible utility. Society accumulates the knowledge advanced by agents so that other agents can incorporate and build on to make further advances. The proposed architecture is challenging but potentially complete: its execution might in principle enable artificial intelligences to advance and accumulate an equivalent of the full range of human scientific and technological knowledge.
Dry Electropolishing - Preparing Metal Surfaces for Characterization
Abstract not provided.
Dry electrolyte polishing of as-printed additively manufactured stainless steel
Abstract not provided.
Plasma Focused Ion Beam Nanothermometry
In this report we detail demonstration of temperature dependent effects on grayscale intensity imaged in Focused Ion Beam (FIB) microscope, as well as secondary electron (SE) dependence on temperature in the Auger Electron Spectroscopy (AES) and a Scanning Electron Microscope (SEM). In each instrument an intrinsic silicon sample is imaged at multiple temperatures over the course of each experiment. The grayscale intensity is shown to scale with sample temperature. Sample preparation procedures are discussed, along with hypothesized explanations for unsuccessful trials. Anticipated outcomes and future directions for these measurements are also detailed.
Ex-Situ, Surface and Bulk Investigations of Defluxing Chemistry Effects on Solder Mask
Abstract not provided.
Systematic Investigation of SIR Testing Phenomena with Constant Capacitance Interdigitated Comb Patterns
Abstract not provided.
Systematic Investigation of SIR Testing Phenomena with Constant Capacitance Interdigitated Comb Patterns
Abstract not provided.
Die Attach Epoxy Characterization for Electronic Assemblies
Abstract not provided.
Identifying process-structure-property correlations related to the development of stress in metal thin films by high-throughput characterization and simulation-based methods
High Energy X-ray Photoelectron Spectroscopy of COTS Electronics Interfacial Failure Modes
Abstract not provided.
Effect of Bias Voltage on Surface Insulation Resistance Measurements
Abstract not provided.
Effect of Voltage Bias on SIR Measurements
Abstract not provided.
Die Attach Epoxy Characterization for Electronic Assemblies
Abstract not provided.
A New Paradigm in Metal Surface Preparation for High-Throughput Materials Characterization
Abstract not provided.
Morphology and Electrochemistry Drive Corrosion of Electroless Nickel Immersion Gold Films: A Multi-Technique Analysis
Abstract not provided.
Applications of Force Tensiometry for Characterizing Complex Materials Surfaces
Abstract not provided.
Dry Electropolishing - A Novel Way to Prepare Metal Surfaces for Characterization
Abstract not provided.
Impedance Spectroscopy for Quality Testing of Interdigitated Circuits
Abstract not provided.
Impedance Spectroscopy for Quality Testing of Interdigitated Circuits
Abstract not provided.
Challenges of Interpreting and Applying New IPC-J-STD-001 Cleanliness Standards in High- Reliability Applications
Abstract not provided.
Standardizing Inter-Agency SMT Cleanliness Analysis in Ultra-High Reliability Applications
Abstract not provided.
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