Materials simulations based on direct numerical solvers are accurate but computationally expensive for predicting materials evolution across length- and time-scales, due to the complexity of the underlying evolution equations, the nature of multiscale spatiotemporal interactions, and the need to reach long-time integration. We develop a method that blends direct numerical solvers with neural operators to accelerate such simulations. This methodology is based on the integration of a community numerical solver with a U-Net neural operator, enhanced by a temporal-conditioning mechanism to enable accurate extrapolation and efficient time-to-solution predictions of the dynamics. We demonstrate the effectiveness of this hybrid framework on simulations of microstructure evolution via the phase-field method. Such simulations exhibit high spatial gradients and the co-evolution of different material phases with simultaneous slow and fast materials dynamics. We establish accurate extrapolation of the coupled solver with large speed-up compared to DNS depending on the hybrid strategy utilized. This methodology is generalizable to a broad range of materials simulations, from solid mechanics to fluid dynamics, geophysics, climate, and more.
We present a high-level architecture for how artificial intelligences might advance and accumulate scientific and technological knowledge, inspired by emerging perspectives on how human intelligences advance and accumulate such knowledge. Agents advance knowledge by exercising a technoscientific method—an interacting combination of scientific and engineering methods. The technoscientific method maximizes a quantity we call “useful learning” via more-creative implausible utility (including the “aha!” moments of discovery), as well as via less-creative plausible utility. Society accumulates the knowledge advanced by agents so that other agents can incorporate and build on to make further advances. The proposed architecture is challenging but potentially complete: its execution might in principle enable artificial intelligences to advance and accumulate an equivalent of the full range of human scientific and technological knowledge.
Characterizing and quantifying microstructure evolution is critical to forming quantitative relationships between material processing conditions, resulting microstructure, and observed properties. Machine-learning methods are increasingly accelerating the development of these relationships by treating microstructure evolution as a pattern recognition problem, discovering relationships explicitly or implicitly. These methods often rely on identifying low-dimensional microstructural fingerprints as latent variables. However, using inappropriate latent variables can lead to challenges in learning meaningful relationships. In this work, we survey and discuss the ability of various linear and nonlinear dimensionality reduction methods including principal component analysis, autoencoders, and diffusion maps to quantify and characterize the learned latent space microstructural representations and their time evolution. We characterize latent spaces by their ability to represent high-dimensional microstructural data in terms of compression achieved as a function of the number of latent dimensions required to represent the data accurately, their accuracy based on their reconstruction performance, and the smoothness of the microstructural trajectories in latent dimension. We quantify these metrics for common microstructure evolution problems in material science including spinodal decomposition of a binary metallic alloy, thin film deposition of a binary metallic alloy, dendritic growth, and grain growth in a polycrystal. This study provides considerations and guidelines for choosing dimensionality reduction methods when considering materials problems that involve high dimensional data and a variety of features over a range of lengths and time scales.
Machine learning is on a bit of a tear right now, with advances that are infiltrating nearly every aspect of our lives. In the domain of materials science, this wave seems to be growing into a tsunami. Yet, there are still real hurdles that we face to maximize its benefit. This Matter of Opinion, crafted as a result of a workshop hosted by researchers at Sandia National Laboratories and attended by a cadre of luminaries, briefly summarizes our perspective on these barriers. By recognizing these problems in a community forum, we can share the burden of their resolution together with a common purpose and coordinated effort.
The burgeoning field of materials informatics necessitates a focus on educating the next generation of materials scientists in the concepts of data science, artificial intelligence (AI), and machine learning (ML). In addition to incorporating these topics in undergraduate and graduate curricula, regular hands-on workshops present the most effective medium to initiate researchers to informatics and have them start applying the best AI/ML tools to their own research. With the help of the Materials Research Society (MRS), members of the MRS AI Staging Committee, and a dedicated team of instructors, we successfully conducted workshops covering the essential concepts of AI/ML as applied to materials data, at both the Spring and Fall Meetings in 2022, with plans to make this a regular feature in future meetings. Here, in this article, we discuss the importance of materials informatics education via the lens of these workshops, including details such as learning and implementing specific algorithms, the crucial nuts and bolts of ML, and using competitions to increase interest and participation.
Designing next generation thin films, tailor-made for specific applications, relies on the availability of robust processing-structure-property relationships. Traditional structure zone diagrams are limited to low-dimensional mappings, with machine-learning methods only recently attempting to relate multiple processing parameters to the final microstructure. Despite this progress, structure-processing relationships are unknown for processing conditions that vary during thin-film deposition, limiting the range of microstructures and properties achievable. In this project, we employed a phase-field computational model combined with a genetic algorithm (GA) to identify and design time-dependent processing protocols that achieve tailor-made microstructures. We simulate the physical vapor deposition of a binary-alloy thin film by employing a phase-field model, where deposition rates and diffusivities are controlled via the genetic algorithm. Our GA-guided protocols achieve targeted microstructures with lateral and vertical concentration modulations, as well as more complex, hierarchical microstructures previously not described in simple structure zone diagrams. Our algorithm provides insight to experimentalists looking for additional avenues to design novel thin-film microstructures.