Sputter-deposited, nanocrystalline Cu-Ag thin films produced across a broad compositional and deposition-parameter space were evaluated to unravel the process-structure-property relationships important for creating hard, conductive electrical contacts and coatings. Combinatorial deposition involving pulsed direct current magnetron sputtering of elemental targets enabled swift examination of nearly the full range of alloy compositions and a relevant portion of deposition atomistics. Several high-throughput characterization modalities were employed to evaluate the chemistry, structure, and properties of the films. The resultant hardness, modulus, film density, crystal texture, and resistivity were analyzed in terms of key deposition characteristics (incident atom kinetic energy and incidence angle) predicted by binary-collision, kinematic Monte Carlo simulations. The study revealed improved hardness, parabolic resistivity dependence on composition, and compositional and process dependencies of film tarnishing. The results are discussed in the context of variations in microstructure and film density. Transmission electron microscopy and X-ray diffraction demonstrate several forms of compositional variation including solute segregation to grain boundaries as well as periodic, intragranular compositional modulations. Annealing of a Cu-rich alloy film exhibiting grain boundary segregation showed that this as-deposited, compositional variation is not stable above 100 °C. Finally, the Cu-Ag system is shown to have potential for hard, conductive, tarnish-resistant and room temperature-stable nanocrystalline thin films across the composition space.
BeyondFingerprinting was a 2021-2024 Sandia Grand Challenge LDRD exploring the potential to develop new resilient materials and manufacturing processes by taking an artificial-intelligence (AI)-guided approach that integrates human-subject-matter expertise with algorithms enriched with physics-based constraints to unearth process-structure-property correlations. Such algorithms, trained on high-throughput experiments and simulations, are shown to serve as surrogate models that efficiently detect key “fingerprints” in materials data, prognose material performance, and guide effective process improvements. To accelerate broader adoption across mission areas, this AI-guided approach was demonstrated with three complex process-centric exemplars: electroplating, physical vapor deposition, and laser powder bed fusion. Together, these exemplars impact nearly every hardware component relevant to DOE and NNSA national security missions.
Sputter-deposited Pt-Au thin films have been reported to develop a hard, stable, nanocrystalline structure, yet little is known about how these characteristics vary with PtxAu1-x composition and process conditions. Toward this end, this document describes an extensive, combinatorial Pt-Au thin film library including characterized film compositions, structure, and properties. Complemented by kinematic Monte Carlo simulations of codeposition, a broad range of PtxAu1-x compositions (from x ~ 0.02 to 0.93) was first established by sputtering with varied magnetron powers and gun tilt angles. Further, the produced films were subsequently interrogated using automated nanoindentation, x-ray reflectivity, x-ray diffraction, atomic force microscopy, surface profilometry, four-point probe sheet resistance techniques, and wavelength dispersive spectroscopy in order to determine how hardness, modulus, density, surface roughness, structure, and resistivity vary with film stoichiometry and process parameters. Combinatorial films displayed an assortment of properties with the hardness of some films exceeding values reported previously for this material system. High hardness, high modulus, and low resistivity were generally attained when using increased deposition energy and reduced angle-of-incidence processes. Overall, the research identified promising, new PtxAu1-x compositions for future study and pinpointed strategies for improved deposition.
Materials simulations based on direct numerical solvers are accurate but computationally expensive for predicting materials evolution across length- and time-scales, due to the complexity of the underlying evolution equations, the nature of multiscale spatiotemporal interactions, and the need to reach long-time integration. We develop a method that blends direct numerical solvers with neural operators to accelerate such simulations. This methodology is based on the integration of a community numerical solver with a U-Net neural operator, enhanced by a temporal-conditioning mechanism to enable accurate extrapolation and efficient time-to-solution predictions of the dynamics. We demonstrate the effectiveness of this hybrid framework on simulations of microstructure evolution via the phase-field method. Such simulations exhibit high spatial gradients and the co-evolution of different material phases with simultaneous slow and fast materials dynamics. We establish accurate extrapolation of the coupled solver with large speed-up compared to DNS depending on the hybrid strategy utilized. This methodology is generalizable to a broad range of materials simulations, from solid mechanics to fluid dynamics, geophysics, climate, and more.
We present a high-level architecture for how artificial intelligences might advance and accumulate scientific and technological knowledge, inspired by emerging perspectives on how human intelligences advance and accumulate such knowledge. Agents advance knowledge by exercising a technoscientific method—an interacting combination of scientific and engineering methods. The technoscientific method maximizes a quantity we call “useful learning” via more-creative implausible utility (including the “aha!” moments of discovery), as well as via less-creative plausible utility. Society accumulates the knowledge advanced by agents so that other agents can incorporate and build on to make further advances. The proposed architecture is challenging but potentially complete: its execution might in principle enable artificial intelligences to advance and accumulate an equivalent of the full range of human scientific and technological knowledge.
Characterizing and quantifying microstructure evolution is critical to forming quantitative relationships between material processing conditions, resulting microstructure, and observed properties. Machine-learning methods are increasingly accelerating the development of these relationships by treating microstructure evolution as a pattern recognition problem, discovering relationships explicitly or implicitly. These methods often rely on identifying low-dimensional microstructural fingerprints as latent variables. However, using inappropriate latent variables can lead to challenges in learning meaningful relationships. In this work, we survey and discuss the ability of various linear and nonlinear dimensionality reduction methods including principal component analysis, autoencoders, and diffusion maps to quantify and characterize the learned latent space microstructural representations and their time evolution. We characterize latent spaces by their ability to represent high-dimensional microstructural data in terms of compression achieved as a function of the number of latent dimensions required to represent the data accurately, their accuracy based on their reconstruction performance, and the smoothness of the microstructural trajectories in latent dimension. We quantify these metrics for common microstructure evolution problems in material science including spinodal decomposition of a binary metallic alloy, thin film deposition of a binary metallic alloy, dendritic growth, and grain growth in a polycrystal. This study provides considerations and guidelines for choosing dimensionality reduction methods when considering materials problems that involve high dimensional data and a variety of features over a range of lengths and time scales.
Machine learning is on a bit of a tear right now, with advances that are infiltrating nearly every aspect of our lives. In the domain of materials science, this wave seems to be growing into a tsunami. Yet, there are still real hurdles that we face to maximize its benefit. This Matter of Opinion, crafted as a result of a workshop hosted by researchers at Sandia National Laboratories and attended by a cadre of luminaries, briefly summarizes our perspective on these barriers. By recognizing these problems in a community forum, we can share the burden of their resolution together with a common purpose and coordinated effort.
The burgeoning field of materials informatics necessitates a focus on educating the next generation of materials scientists in the concepts of data science, artificial intelligence (AI), and machine learning (ML). In addition to incorporating these topics in undergraduate and graduate curricula, regular hands-on workshops present the most effective medium to initiate researchers to informatics and have them start applying the best AI/ML tools to their own research. With the help of the Materials Research Society (MRS), members of the MRS AI Staging Committee, and a dedicated team of instructors, we successfully conducted workshops covering the essential concepts of AI/ML as applied to materials data, at both the Spring and Fall Meetings in 2022, with plans to make this a regular feature in future meetings. Here, in this article, we discuss the importance of materials informatics education via the lens of these workshops, including details such as learning and implementing specific algorithms, the crucial nuts and bolts of ML, and using competitions to increase interest and participation.
Designing next generation thin films, tailor-made for specific applications, relies on the availability of robust processing-structure-property relationships. Traditional structure zone diagrams are limited to low-dimensional mappings, with machine-learning methods only recently attempting to relate multiple processing parameters to the final microstructure. Despite this progress, structure-processing relationships are unknown for processing conditions that vary during thin-film deposition, limiting the range of microstructures and properties achievable. In this project, we employed a phase-field computational model combined with a genetic algorithm (GA) to identify and design time-dependent processing protocols that achieve tailor-made microstructures. We simulate the physical vapor deposition of a binary-alloy thin film by employing a phase-field model, where deposition rates and diffusivities are controlled via the genetic algorithm. Our GA-guided protocols achieve targeted microstructures with lateral and vertical concentration modulations, as well as more complex, hierarchical microstructures previously not described in simple structure zone diagrams. Our algorithm provides insight to experimentalists looking for additional avenues to design novel thin-film microstructures.
