Sputter-deposited, nanocrystalline Cu-Ag thin films produced across a broad compositional and deposition-parameter space were evaluated to unravel the process-structure-property relationships important for creating hard, conductive electrical contacts and coatings. Combinatorial deposition involving pulsed direct current magnetron sputtering of elemental targets enabled swift examination of nearly the full range of alloy compositions and a relevant portion of deposition atomistics. Several high-throughput characterization modalities were employed to evaluate the chemistry, structure, and properties of the films. The resultant hardness, modulus, film density, crystal texture, and resistivity were analyzed in terms of key deposition characteristics (incident atom kinetic energy and incidence angle) predicted by binary-collision, kinematic Monte Carlo simulations. The study revealed improved hardness, parabolic resistivity dependence on composition, and compositional and process dependencies of film tarnishing. The results are discussed in the context of variations in microstructure and film density. Transmission electron microscopy and X-ray diffraction demonstrate several forms of compositional variation including solute segregation to grain boundaries as well as periodic, intragranular compositional modulations. Annealing of a Cu-rich alloy film exhibiting grain boundary segregation showed that this as-deposited, compositional variation is not stable above 100 °C. Finally, the Cu-Ag system is shown to have potential for hard, conductive, tarnish-resistant and room temperature-stable nanocrystalline thin films across the composition space.
BeyondFingerprinting was a 2021-2024 Sandia Grand Challenge LDRD exploring the potential to develop new resilient materials and manufacturing processes by taking an artificial-intelligence (AI)-guided approach that integrates human-subject-matter expertise with algorithms enriched with physics-based constraints to unearth process-structure-property correlations. Such algorithms, trained on high-throughput experiments and simulations, are shown to serve as surrogate models that efficiently detect key “fingerprints” in materials data, prognose material performance, and guide effective process improvements. To accelerate broader adoption across mission areas, this AI-guided approach was demonstrated with three complex process-centric exemplars: electroplating, physical vapor deposition, and laser powder bed fusion. Together, these exemplars impact nearly every hardware component relevant to DOE and NNSA national security missions.
Sputter-deposited Pt-Au thin films have been reported to develop a hard, stable, nanocrystalline structure, yet little is known about how these characteristics vary with PtxAu1-x composition and process conditions. Toward this end, this document describes an extensive, combinatorial Pt-Au thin film library including characterized film compositions, structure, and properties. Complemented by kinematic Monte Carlo simulations of codeposition, a broad range of PtxAu1-x compositions (from x ~ 0.02 to 0.93) was first established by sputtering with varied magnetron powers and gun tilt angles. Further, the produced films were subsequently interrogated using automated nanoindentation, x-ray reflectivity, x-ray diffraction, atomic force microscopy, surface profilometry, four-point probe sheet resistance techniques, and wavelength dispersive spectroscopy in order to determine how hardness, modulus, density, surface roughness, structure, and resistivity vary with film stoichiometry and process parameters. Combinatorial films displayed an assortment of properties with the hardness of some films exceeding values reported previously for this material system. High hardness, high modulus, and low resistivity were generally attained when using increased deposition energy and reduced angle-of-incidence processes. Overall, the research identified promising, new PtxAu1-x compositions for future study and pinpointed strategies for improved deposition.
Multimodal datasets of materials are rich sources of information which can be leveraged for expedited discovery of process–structure–property relationships and for designing materials with targeted structures and/or properties. For this data descriptor article, we provide a multimodal dataset of magnetron sputter-deposited molybdenum (Mo) thin films, which are used in a variety of industries including high temperature coatings, photovoltaics, and microelectronics. In this dataset we explored a process space consisting of 27 unique combinations of sputter power and Ar deposition pressure. Here, the phase, structure, surface morphology, and composition of the Mo thin films were characterized by x-ray diffraction, scanning electron microscopy, atomic force microscopy, and Rutherford backscattering spectrometry. Physical properties—namely, thickness, film stress and sheet resistance—were also measured to provide additional film characteristics and behaviors. Additionally, nanoindentation was utilized to obtain mechanical load-displacement data. The entire dataset consists of 2072 measurements including scalar values (e.g., film stress values), 2D linescans (e.g., x-ray diffractograms), and 3D imagery (e.g., atomic force microscopy images). An additional 1889 quantities, including film hardness, modulus, electrical resistivity, density, and surface roughness, were derived from the experimental datasets using traditional methods. Minimal analysis and discussion of the results are provided in this data descriptor article to limit the authors’ preconceived interpretations of the data. Overall, the data modalities are consistent with previous reports of refractory metal thin films, ensuring that a high-quality dataset was generated. The entirety of this data is committed to a public repository in the Materials Data Facility.
Sandia National Laboratories is developing a way to visualize molecular changes that indicate penetration of a tamper-indicating enclosure (TIE). Such "bleeding" materials (analogous to visually obvious, colorful bruised skin that doesn't heal) allows inspectors to use simple visual observation to readily recognize that penetration into a material used as a TIE has been attempted, without providing adversaries the ability to repair damage. Such a material can significantly enhance the current capability for TIEs, used to support treaty verification regimes. Current approaches rely on time-consuming and subjective visual assessment by an inspector, external equipment, such as eddy current or camera devices, or active approaches that may be limited due to application environment. The complexity of securing whole volumes includes: (1) enclosures that are non-standard in size/shape; (2) enclosures that may be inspectorate- or facility-owned; (3) tamper attempts that are detectable but difficult or timely for an inspector to locate; (4) the requirement for solutions that are robust regarding reliability and environment (including facility handling); and (5) the need for solutions that prevent adversaries from repairing penetrations. The approach is based on a transition metal ion solution within a microsphere changing color irreversibly when the microsphere is ruptured. Investigators examine 3D printing of the microspheres as well as the spray coating formulation. The anticipated benefits of this work are passive, flexible, scalable, cost-effective TIEs with obvious and robust responses to tamper attempts. This results in more efficient and effective monitoring, as inspectors will require little or no additional equipment and will be able to detect tamper without extensive time-consuming visual examination. Applications can include custom TIEs (cabinets or equipment enclosures), spray-coating onto facility-owned items, spray-coating of walls or structures, spray-coatings of circuit boards, and 3D-printed seal bodies. The paper describes research to-date on the sensor compounds and microspheres.
Maximum power handling, spike leakage, and failure mechanisms have been characterized for limiters based on the thermally triggered metal-insulator transition of vanadium dioxide. These attributes are determined by properties of the metal-insulator material such as on/off resistance ratio, geometric properties that determine the film resistance and the currentcarrying capability of the device, and thermal properties such as heatsinking and thermal coupling. A limiter with greater than 10 GHz of bandwidth demonstrated 0.5 dB loss, 27 dBm threshold power, 8 Watts blocking power, and 0.4 mJ spike leakage at frequencies near 2 GHz. A separate limiter optimized for high power blocked over 60 Watts of incident power with leakage less than 25 dBm after triggering. The power handling demonstrates promise for these limiter devices, and device optimization presents opportunities for additional improvement in spike leakage, response speed, and reliability.
Maximum power handling, spike leakage, and failure mechanisms have been characterized for limiters based on the thermally triggered metal-insulator transition of vanadium dioxide. These attributes are determined by properties of the metal-insulator material such as on/off resistance ratio, geometric properties that determine the film resistance and the currentcarrying capability of the device, and thermal properties such as heatsinking and thermal coupling. A limiter with greater than 10 GHz of bandwidth demonstrated 0.5 dB loss, 27 dBm threshold power, 8 Watts blocking power, and 0.4 mJ spike leakage at frequencies near 2 GHz. A separate limiter optimized for high power blocked over 60 Watts of incident power with leakage less than 25 dBm after triggering. The power handling demonstrates promise for these limiter devices, and device optimization presents opportunities for additional improvement in spike leakage, response speed, and reliability.
Containment/Surveillance (C/S) measures are critical to any verification regime in order to maintain Continuity of Knowledge (CoK). The Ceramic Seal project is research into the next generation technologies to advance C/S, in particular improving security and efficiency. The Ceramic Seal is a small form factor loop seal with improved tamper-indication including a frangible seal body, tamper planes, external coatings, and electronic monitoring of the seal body integrity. It improves efficiency through a self-securing wire and in-situ verification with a handheld reader. Sandia National Laboratories (SNL) and Savannah River National Laboratory (SRNL), under sponsorship from the U.S. National Nuclear Security Administration (NNSA) Office of Defense Nuclear Nonproliferation Research and Development (DNN R&D), have previously designed and have now fabricated and tested Ceramic Seals. Tests have occurred at both SNL and SRNL, with different types of tests occurring at each facility. This interim report will describe the Ceramic Seal prototype, the design and development of a handheld standalone reader and an interface to a data acquisition system, fabrication of the seals, and results of initial testing.
