Publications

Results 1–25 of 32

Search results

Jump to search filters

A flexible polymer-based luminescent ink for combined thermographic phosphors and digital image correlation (TP+DIC)

Optical Materials

Hansen, Linda E.; Fitzgerald, Kaitlynn; Jones, Elizabeth M.; Ruggles, Timothy R.; Gilliland, W.G.; Jauregui, Luis J.; Murray, Shannon E.; Westphal, Eric R.; Winters, Caroline W.; Huertas, N.A.

Recent work on the development of integrated thermographic phosphors and digital image correlation (TP+DIC) for combined thermal–mechanical measurements has revealed the need for a flexible, stretchable phosphor coating for metal surfaces. Herein, we coat stainless steel substrates with a polymer-based phosphor ink in a DIC speckle pattern and demonstrate that the ink remains well bonded under substrate deformation. In contrast, a binderless phosphor DIC coating produced via aerosol deposition (AD) partially debonded from the substrate. DIC calculations reveal that the strain on the ink coating matches the strain on the substrate within 4% error at the highest substrate loads (0.05 mm/mm applied substrate strain), while the strain on the AD coating remains near 0 mm/mm as the substrate deforms. Spectrally resolved emission from the phosphor is measured through the transparent binder throughout testing, and the ratio method is used to infer temperature with an uncertainty of 1.7 °C. This phosphor ink coating will allow for accurate, non-contact strain and temperature measurements of a deforming surface.

More Details

Understanding Phase and Interfacial Effects of Spall Fracture in Additively Manufactured Ti-5Al-5V-5Mo-3Cr

Branch, Brittany A.; Ruggles, Timothy R.; Miers, John C.; Massey, Caroline E.; Moore, David G.; Brown, Nathan B.; Duwal, Sakun D.; Silling, Stewart A.; Mitchell, John A.; Specht, Paul E.

Additive manufactured Ti-5Al-5V-5Mo-3Cr (Ti-5553) is being considered as an AM repair material for engineering applications because of its superior strength properties compared to other titanium alloys. Here, we describe the failure mechanisms observed through computed tomography, electron backscatter diffraction (EBSD), and scanning electron microscopy (SEM) of spall damage as a result of tensile failure in as-built and annealed Ti-5553. We also investigate the phase stability in native powder, as-built and annealed Ti-5553 through diamond anvil cell (DAC) and ramp compression experiments. We then explore the effect of tensile loading on a sample containing an interface between a Ti-6Al-V4 (Ti-64) baseplate and additively manufactured Ti-5553 layer. Post-mortem materials characterization showed spallation occurred in regions of initial porosity and the interface provides a nucleation site for spall damage below the spall strength of Ti-5553. Preliminary peridynamics modeling of the dynamic experiments is described. Finally, we discuss further development of Stochastic Parallel PARticle Kinteic Simulator (SPPARKS) Monte Carlo (MC) capabilities to include the integration of alpha (α)-phase and microstructural simulations for this multiphase titanium alloy.

More Details

Microstructural Analysis of Cadmium Whiskers on Long-Term-Used Hardware

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

White, Rachel W.; Ghanbari, Zahra G.; Susan, D.F.; Dickens, Sara D.; Ruggles, Timothy R.; Perry, Daniel L.

A survey of cadmium plated field return hardware showed ubiquitous cadmium whisker growth. The most worn and debris-covered hardware showed the densest whisker growth. Whiskers were often found growing in agglomerates of nodules and whiskers. The hardware was rinsed with alcohol to transfer whiskers and debris from the hardware to a flat stub. Fifty whiskers were studied individually by scanning electron microscopy (SEM), including energy dispersive spectroscopy (EDS) and electron backscatter diffraction (EBSD). Most of the whiskers were single crystal, though three were found to contain grain boundaries at kinks. The whiskers ranged from 5 to 600 μm in length and 80 pct showed a <1 ¯ 2 1 ¯ 0> type growth direction. This growth direction facilitates the development of low energy side faces of the whisker, (0001) and {1010}.

More Details
Results 1–25 of 32
Results 1–25 of 32