Direct bond interconnect (DBI) processes enable chip to chip, low resistivity electrical connections for 2.5-D scaling of electrical circuits and heterogenous integration. This work describes SiO2/Cu DBI technology with Cu interconnect performance investigated over a range of inter-die Cu gap heights and post-bond annealing temperatures. Chemical mechanical polishing (CMP) generates wafers with a controlled Cu recess relative to the SiO2 surface, yielding die pairs with inter-die Cu gap heights ranging between 9 and 47 nm. Bonded die with different gap heights show similar per-connection resistance after annealing at 400 degrees Celsius but annealing at lower temperatures between 250 and 350 degrees Celsius results in failing or high-resistance interconnects with intermediate gaps showing lowest resistance. Cross-section scanning electron microscope (SEM) image analysis shows that the microstructure is largely independent of post-bond annealing temperature, suggesting that the temperature behavior is due to nanoscale scale interfacial effects not observable by SEM. The bond strength is affirmed by successful step-wise mechanical and chemical removal of the handle silicon layer to reveal metal from both die. This work demonstrates a 2.5-D integration method using a 3 micron Cu DBI process on a 7.5 micron pitch with electrical contacts ranging between 3.8 and 4.8 Ohms per contact plug.
Electric field-based frequency tuning of acoustic resonators at the material level provides an enabling technology for building complex tunable filters. Tunable acoustic resonators were fabricated in thin plates (h/λ ∼ 0.05) of X-cut lithium niobate (90°, 90°, ψ = 170°). Lithium niobate is known for its large electromechanical coupling (SH: K2 40%) and thus applicability for low-insertion loss and wideband filter applications. We demonstrate the effect of a DC bias to shift the resonant frequency by 0.4% by directly tuning the resonator material. The mechanism is based on the nonlinearities that exist in the piezoelectric properties of lithium niobate. Devices centered at 332 MHz achieved frequency tuning of 12 kHz/V through application of a DC bias.
We demonstrate doubly resonant second harmonic generation from 1550 to 775 nm in microdisks fabricated from lithium niobate on insulator wafers. We use a novel phase matching technique to achieve a conversion efficiency of 0.167%/mW.
Understanding the physics of phonon transport at small length scales is increasingly important for basic research in nanoelectronics, optoelectronics, nanomechanics, and thermoelectrics. We conducted several studies to develop an understanding of phonon behavior in very small structures. This report describes the modeling, experimental, and fabrication activities used to explore phonon transport across and along material interfaces and through nanopatterned structures. Toward the understanding of phonon transport across interfaces, we computed the Kapitza conductance for {Sigma}29(001) and {Sigma}3(111) interfaces in silicon, fabricated the interfaces in single-crystal silicon substrates, and used picosecond laser pulses to image the thermal waves crossing the interfaces. Toward the understanding of phonon transport along interfaces, we designed and fabricated a unique differential test structure that can measure the proportion of specular to diffuse thermal phonon scattering from silicon surfaces. Phonon-scale simulation of the test ligaments, as well as continuum scale modeling of the complete experiment, confirmed its sensitivity to surface scattering. To further our understanding of phonon transport through nanostructures, we fabricated microscale-patterned structures in diamond thin films.
