Publications

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A sensitive volume is developed using pulsed laser-induced collected charge for two bias conditions in an epitaxial silicon diode. These sensitive volumes show good agreement with experimental two photon absorption laser-induced collected charge at a variety of focal positions and pulse energies. When compared to ion-induced collected charge, the laser-based sensitive volume over predicts the experimental collected charge at low bias and agrees at high bias. Here, a sensitive volume based on ion-induced collected charge adequately describes the ion experimental results at both biases. Differences in the amount of potential modulation explain the differences between the ion-and laser-based sensitive volumes at the lower bias. Truncation of potential modulation by the highly doped substrate at the higher bias results in similar sensitive volumes.

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We present heavy ion and proton data on AlGaN high-voltage HEMTs showing single event burnout (SEB), total ionizing dose, and displacement damage responses. These are the first such data for materials of this type. Two different designs of the epitaxial structure were tested for SEB. The default layout design showed burnout voltages that decreased rapidly with increasing LET, falling to about 25% of nominal breakdown voltage for ions with LET of about 34 MeV · cm2/mg for both structures. Samples of the device structure with lower AlN content were tested with varying gate-drain spacing and revealed an improved robustness to heavy ions, resulting in burnout voltages that did not decrease up to at least 33.9 MeV · cm2/mg. Failure analysis showed that there was consistently a point, location random, where gate and drain had been shorted. Oscilloscope traces of terminal voltages and currents during burnout events lend support to the hypothesis that burnout events begin with a heavy ion strike in the vulnerable region between gate and drain. This subsequently initiates a cascade of events resulting in damage that is largely manifested elsewhere in the device. This hypothesis also suggests a path for greatly improving the susceptibility to SEB as development of this technology goes forward. Testing with 2.5-MeV protons showed only minor changes in device characteristics.

In this paper, we present heavy ion and proton data on AlGaN highvoltage HEMTs showing Single Event Burnout, Total Ionizing Dose, and Displacement Damage responses. These are the first such data for materials of this type. Two different designs of the epitaxial structure were tested for Single Event Burnout (SEB). The default layout design showed burnout voltages that decreased rapidly with increasing LET, falling to about 25% of nominal breakdown voltage for ions with LET of about 34 MeV·cm2/mg for both structures. Samples of the device structure with lower AlN content were tested with varying gate-drain spacing and revealed an improved robustness to heavy ions, resulting in burnout voltages that did not decrease up to at least 33.9 MeV·cm2/mg. Failure analysis showed there was consistently a point, location random, where gate and drain had been shorted. Oscilloscope traces of terminal voltages and currents during burnout events lend support to the hypothesis that burnout events begin with a heavy ion strike in the vulnerable region between gate and drain. This subsequently initiates a cascade of events resulting in damage that is largely manifested elsewhere in the device. This hypothesis also suggests a path for greatly improving the susceptibility to SEB as development of this technology goes forward. Lastly, testing with 2.5 MeV protons showed only minor changes in device characteristics.

State of the art semiconductor processes have created high performance and low power consumption technologies. There is a drive to use these technologies for commercial space, defense, and infrastructure.

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A system is presented that is capable of measuring subnanosecond reverse recovery times of diodes in wide-bandgap materials over a wide range of forward biases (0 - 1 A) and reverse voltages (0 - 10 kV). The system utilizes the step recovery technique and comprises a cable pulser based on a silicon (Si) Photoconductive Semiconductor Switch (PCSS) triggered with an Ultrashort Pulse Laser, a pulse charging circuit, a diode biasing circuit, and resistive and capacitive voltage monitors. The PCSS-based cable pulser transmits a 130 ps rise time pulse down a transmission line to a capacitively coupled diode, which acts as the terminating element of the transmission line. The temporal nature of the pulse reflected by the diode provides the reverse recovery characteristics of the diode, measured with a high bandwidth capacitive probe integrated into the cable pulser. This system was used to measure the reverse recovery times (including the creation and charging of the depletion region) for two Avogy gallium nitride diodes; the initial reverse recovery time was found to be 4 ns and varied minimally over reverse biases of 50-100 V and forward current of 1-100 mA.

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Radiation responses of high-voltage, vertical gallium-nitride (GaN) diodes were investigated using Sandia National Laboratories’ nuclear microprobe. Effects of the ionization and the displacement damage were studied using various ion beams. We found that the devices show avalanche effect for heavy ions operated under bias well below the breakdown voltage. The displacement damage experiments showed a surprising effect for moderate damage: the charge collection efficiency demonstrated an increase instead of a decrease for higher bias voltages.

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Devices based on GaN have shown great promise for high power electronics, including their potential use as radiation tolerant components. An important step to realizing high power diodes is the design and implementation of an edge termination to mitigate field crowding, which can lead to premature breakdown. However, little is known about the effects of radiation on edge termination functionality. We experimentally examine the effects of proton irradiation on multiple field ring edge terminations in high power vertical GaN pin diodes using in operando imaging with electron beam induced current (EBIC). We find that exposure to proton irradiation influences field spreading in the edge termination as well as carrier transport near the anode. By using depth-dependent EBIC measurements of hole diffusion length in homoepitaxial n-GaN we demonstrate that the carrier transport effect is due to a reduction in hole diffusion length following proton irradiation.

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Total ionizing dose results are provided, showing the effects of different threshold adjust implant processes and irradiation bias conditions of 14-nm FinFETs. Minimal radiation-induced threshold voltage shift across a variety of transistor types is observed. Off-state leakage current of nMOSFET transistors exhibits a strong gate bias dependence, indicating electrostatic gate control of the sub-fin region and the corresponding parasitic conduction path are the largest concern for radiation hardness in FinFET technology. The high-Vth transistors exhibit the best irradiation performance across all bias conditions, showing a reasonably small change in off-state leakage current and Vth, while the low-Vth transistors exhibit a larger change in off-state leakage current. The "worst-case" bias condition during irradiation for both pull-down and pass-gate nMOSFETs in static random access memory is determined to be the on-state (Vgs = Vdd). We find the nMOSFET pull-down and pass-gate transistors of the SRAM bit-cell show less radiation-induced degradation due to transistor geometry and channel doping differences than the low-Vth transistor. Near-threshold operation is presented as a methodology for reducing radiation-induced increases in off-state device leakage current. In a 14-nm FinFET technology, the modeling indicates devices with high channel stop doping show the most robust response to TID allowing stable operation of ring oscillators and the SRAM bit-cell with minimal shift in critical operating characteristics.

Here, total ionizing dose results are provided, showing the effects of different threshold adjust implant processes and irradiation bias conditions of 14-nm FinFETs. Minimal radiation-induced threshold voltage shift across a variety of transistor types is observed. Off-state leakage current of nMOSFET transistors exhibits a strong gate bias dependence, indicating electrostatic gate control of the sub-fin region and the corresponding parasitic conduction path are the largest concern for radiation hardness in FinFET technology. The high-Vth transistors exhibit the best irradiation performance across all bias conditions, showing a reasonably small change in off-state leakage current and Vth, while the low-Vth transistors exhibit a larger change in off-state leakage current. The “worst-case” bias condition during irradiation for both pull-down and pass-gate nMOSFETs in static random access memory is determined to be the on-state (Vgs = Vdd). We find the nMOSFET pull-down and pass-gate transistors of the SRAM bit-cell show less radiation-induced degradation due to transistor geometry and channel doping differences than the low-Vth transistor. Near-threshold operation is presented as a methodology for reducing radiation-induced increases in off-state device leakage current. In a 14-nm FinFET technology, the modeling indicates devices with high channel stop doping show the most robust response to TID allowing stable operation of ring oscillators and the SRAM bit-cell with minimal shift in critical operating characteristics.

Electrical performance and characterization of deep levels in vertical GaN P-i-N diodes grown on low threading dislocation density (∼104 - 106cm-2) bulk GaN substrates are investigated. The lightly doped n drift region of these devices is observed to be highly compensated by several prominent deep levels detected using deep level optical spectroscopy at Ec-2.13, 2.92, and 3.2 eV. A combination of steady-state photocapacitance and lighted capacitance-voltage profiling indicates the concentrations of these deep levels to be Nt = 3 × 1012, 2 × 1015, and 5 × 1014cm-3, respectively. The Ec-2.92 eV level is observed to be the primary compensating defect in as-grown n-type metal-organic chemical vapor deposition GaN, indicating this level acts as a limiting factor for achieving controllably low doping. The device blocking voltage should increase if compensating defects reduce the free carrier concentration of the n drift region. Understanding the incorporation of as-grown and native defects in thick n-GaN is essential for enabling large VBD in the next-generation wide-bandgap power semiconductor devices. Thus, controlling the as-grown defects induced by epitaxial growth conditions is critical to achieve blocking voltage capability above 5 kV.

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