Publications

Abstract not provided.

Abstract not provided.

This project investigated a recently patented Sandia technology known as visible light Laser Voltage Probing (LVP). In this effort we carefully prepared well understood and characterized samples for testing. These samples were then operated across a range of configurations to minimize the possibility of superposition of multiple photon carrier interactions as data was taken with conventional and visible light LVP systems. Data consisted of LVP waveforms and Laser Voltage Images (LVI). Visible light (633 nm) LVP data was compared against 1319 nm and 1064 nm conventional LVP data to better understand the similarities and differences in mechanisms for all wavelengths of light investigated. The full text can be obtained by reaching the project manager, Ed Cole or the Cyber IA lead, Justin Ford.

We present a new, non-destructive electrical technique, Power Spectrum Analysis (PSA). PSA as described here uses off-normal biasing, an unconventional way of powering microelectronics devices. PSA with off-normal biasing can be used to detect subtle differences between microelectronic devices. These differences, in many cases, cannot be detected by conventional electrical testing. In this paper, we highlight PSA applications related to aging and counterfeit detection.

We present a new, non-destructive electrical technique, Power Spectrum Analysis (PSA). PSA as described here uses off-normal biasing, an unconventional way of powering microelectronics devices. PSA with off-normal biasing can be used to detect subtle differences between microelectronic devices. These differences, in many cases, cannot be detected by conventional electrical testing. In this paper, we highlight PSA applications related to aging and counterfeit detection.

Abstract not provided.

Abstract not provided.

Visible light laser voltage probing (LVP) for improved backside optical spatial resolution is demonstrated on ultrathinned bulk Si samples. A prototype system for data acquisition, a method to produce ultra-thinned bulk samples as well as LVP signal, imaging, and waveform acquisition are described on bulk Si devices. Spatial resolution and signal comparison with conventional, infrared LVP analysis is discussed.

Abstract not provided.

Visible light laser voltage probing (LVP) for improved backside optical spatial resolution is demonstrated on ultra-thinned samples. A prototype system for data acquisition, a method to produce ultra-thinned SOI samples, and LVP signal, imaging, and waveform acquisition are described on early and advanced SOI technology nodes. Spatial resolution and signal comparison with conventional, infrared LVP analysis is discussed.