Optical waveguide propagation loss due to sidewall roughness, material impurity and inhomogeneity has been the focus of many studies in fabricating planar lightwave circuits (PLC's)1,2,3 In this work, experiments were carried out to identify the best fabrication process for reducing propagation loss in single mode waveguides comprised of silicon nitride core and silicon dioxide cladding material. Sidewall roughness measurements were taken during the fabrication of waveguide devices for various processing conditions. Several fabrication techniques were explored to reduce the sidewall roughness and absorption in the waveguides. Improvements in waveguide quality were established by direct measurement of waveguide propagation loss. The lowest linear waveguide loss measured in these buried channel waveguides was 0.1 dB/cm at a wavelength of 1550 nm. This low propagation loss along with the large refractive index contrast between silicon nitride and silicon dioxide enables high density integration of photonic devices and small PLC's for a variety of applications in photonic sensing and communications.
We report a fully integrated high-Q factor micro-ring resonator using silicon nitride/dioxide on a silicon wafer. The micro-ring resonator is critically coupled to a low loss straight waveguide. An intrinsic quality factor of 2.4 x 10{sup 5} has been measured.
This report describes the research accomplishments achieved under the LDRD Project 'Radiation Hardened Optoelectronic Components for Space-Based Applications.' The aim of this LDRD has been to investigate the radiation hardness of vertical-cavity surface-emitting lasers (VCSELs) and photodiodes by looking at both the effects of total dose and of single-event upsets on the electrical and optical characteristics of VCSELs and photodiodes. These investigations were intended to provide guidance for the eventual integration of radiation hardened VCSELs and photodiodes with rad-hard driver and receiver electronics from an external vendor for space applications. During this one-year project, we have fabricated GaAs-based VCSELs and photodiodes, investigated ionization-induced transient effects due to high-energy protons, and measured the degradation of performance from both high-energy protons and neutrons.
This report describes the research accomplishments achieved under the LDRD Project ''High-Bandwidth Optical Data Interconnects for Satellite Applications.'' The goal of this LDRD has been to address the future needs of focal-plane-array (FPA) sensors by exploring the use of high-bandwidth fiber-optic interconnects to transmit FPA signals within a satellite. We have focused primarily on vertical-cavity surface-emitting laser (VCSEL) based transmitters, due to the previously demonstrated immunity of VCSELs to total radiation doses up to 1 Mrad. In addition, VCSELs offer high modulation bandwidth (roughly 10 GHz), low power consumption (roughly 5 mW), and high coupling efficiency (greater than -3dB) to optical fibers. In the first year of this LDRD, we concentrated on the task of transmitting analog signals from a cryogenic FPA to a remote analog-to-digital converter. In the second year, we considered the transmission of digital signals produced by the analog-to-digital converter to a remote computer on the satellite. Specifically, we considered the situation in which the FPA, analog-to-digital converter, and VCSEL-based transmitter were all cooled to cryogenic temperatures. This situation requires VCSELs that operate at cryogenic temperature, dissipate minimal heat, and meet the electrical drive requirements in terms of voltage, current, and bandwidth.
Many MEMS-based components require optical monitoring techniques using optoelectronic devices for converting mechanical position information into useful electronic signals. While the constituent piece-parts of such hybrid opto-MEMS components can be separately optimized, the resulting component performance, size, ruggedness and cost are substantially compromised due to assembly and packaging limitations. GaAs MOEMS offers the possibility of monolithically integrating high-performance optoelectronics with simple mechanical structures built in very low-stress epitaxial layers with a resulting component performance determined only by GaAs microfabrication technology limitations. GaAs MOEMS implicitly integrates the capability for radiation-hardened optical communications into the MEMS sensor or actuator component, a vital step towards rugged integrated autonomous microsystems that sense, act, and communicate. This project establishes a new foundational technology that monolithically combines GaAs optoelectronics with simple mechanics. Critical process issues addressed include selectivity, electrochemical characteristics, and anisotropy of the release chemistry, and post-release drying and coating processes. Several types of devices incorporating this novel technology are demonstrated.
We have used selective AlGaAs oxidation, dry-etching, and high-gain semiconductor laser simulation to create new in-plane lasers with interconnecting passive waveguides for use in high-density photonic circuits and future integration of photonics with electronics. Selective oxidation and doping of semiconductor heterostructures have made vertical cavity surface emitting lasers (VCSELs) into the world's most efficient low-power lasers. We apply oxidation technology to improve edge-emitting lasers and photonic-crystal waveguides, making them suitable for monolithic integrated microsystems. Two types of lasers are investigated: (1) a ridge laser with resonant coupling to an output waveguide; (2) a selectively-oxidized laser with a low active volume and potentially sub-milliAmp threshold current. Emphasis is on development of high-performance lasers suited for monolithic integration with photonic circuit elements.
Current copper backplane technology has reached the technical limits of clock speed and width for systems requiring multiple boards. Currently, bus technology such as VME and PCI (types of buses) will face severe limitations are the bus speed approaches 100 MHz. At this speed, the physical length limit of an unterminated bus is barely three inches. Terminating the bus enables much higher clock rates but at drastically higher power cost. Sandia has developed high bandwidth parallel optical interconnects that can provide over 40 Gbps throughput between circuit boards in a system. Based on Sandia's unique VCSEL (Vertical Cavity Surface Emitting Laser) technology, these devices are compatible with CMOS (Complementary Metal Oxide Semiconductor) chips and have single channel bandwidth in excess of 20 GHz. In this project, we are researching the use of this interconnect scheme as the physical layer of a greater ATM (Asynchronous Transfer Mode) based backplane. There are several advantages to this technology including small board space, lower power and non-contact communication. This technology is also easily expandable to meet future bandwidth requirements in excess of 160 Gbps sometimes referred to as UTOPIA 6. ATM over optical backplane will enable automatic switching of wide high-speed circuits between boards in a system. In the first year we developed integrated VCSELs and receivers, identified fiber ribbon based interconnect scheme and a high level architecture. In the second year, we implemented the physical layer in the form of a PCI computer peripheral card. A description of future work including super computer networking deployment and protocol processing is included.
Sandia has established a foundational technology in photonic integrated circuits (PICs) based on the (Al,Ga,In)As material system for optical communication, radar control and testing, and network switching applications at the important 1.3{mu}m/1.55{mu}m wavelengths. We investigated the optical, electrooptical, and microwave performance characteristics of the fundamental building-block PIC elements designed to be as simple and process-tolerant as possible, with particular emphasis placed on reducing optical insertion loss. Relatively conventional device array and circuit designs were built using these PIC elements: (1) to establish a baseline performance standard; (2) to assess the impact of epitaxial growth accuracy and uniformity, and of fabrication uniformity and yield; (3) to validate our theoretical and numerical models; and (4) to resolve the optical and microwave packaging issues associated with building fully packaged prototypes. Novel and more complex PIC designs and fabrication processes, viewed as higher payoff but higher risk, were explored in a parallel effort with the intention of meshing those advances into our baseline higher-yield capability as they mature. The application focus targeted the design and fabrication of packaged solitary modulators meeting the requirements of future wideband and high-speed analog and digital data links. Successfully prototyped devices are expected to feed into more complex PICs solving specific problems in high-performance communications, such as optical beamforming networks for phased array antennas.
Using molecular beam epitaxy (MBE) and lattice engineering techniques, the feasibility of combining photonic devices applicable to the 1.3 to 1.55 {micro}m wavelength range and monolithic microwave (or mm-wave) integrated circuits (MMICs) on GaAs is demonstrated. A key factor in the MBE growth is incorporation of an InGaAs active layer having an indium arsenide mole fraction of 0.35 or greater and its lattice compatibility with the underlying semi-insulating GaAs substrate. The InGaAs layer used for the photonic devices, can also serve as the active channel for the high electron mobility transistors (HEMTs) for application in MMICs. Several examples of active and passive photonic devices grown by MBE are presented including an optical ridge waveguide, and a photodetector for detection of light in the 1.3 {micro}m range. The material structure includes a 3-layer AlGaAs/GaAs/AlGaAs optical waveguide and a thin InGaAs absorbing layer situated directly above the optical waveguide. Metal-semiconductor-metal (MSM) photodetectors are formed on the top surface of the InGaAs layer for collection of the photo-induced carriers. The optical ridge waveguide is designed for lateral incidence of the light to enhance the MSM photodetector responsivity. Initial measurements on the optical waveguide and photodetector are presented.