Publications

8 Results

Search results

Jump to search filters

Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications

Martinez, William M.; Anderson, Evan M.; Wood, Michael G.; Friedmann, Thomas A.; Arterburn, Shawn C.; Reyna, Robert; Gutierrez, Jordan E.; Harris, Christian A.; Kotula, Paul G.; Cummings, Damion P.; Bahr, Matthew N.; Patel, Victor J.; Muhowski, Aaron; Hawkins, Samuel D.; Long, Christopher M.; Klem, John F.; Shank, Joshua; Wygant, Melissa L.

Abstract not provided.

Wide bandwidth TM tunable vernier rings for heterogeneously integrated lasers

2024 Conference on Lasers and Electro-Optics, CLEO 2024

Henry, Nathan C.; Martinez, William M.; Sovinec, Courtney L.H.; Friedmann, Thomas A.; Arterburn, Shawn C.; Starbuck, Andrew L.; Dallo, Christina M.; Pomerene, Andrew; Kodigala, Ashok

We present a novel design of a III-V-on-silicon heterogeneously integrated tunable ring laser, achieving >80 nanometers of tuning bandwidth, the widest conceived using only two rings, fostering many applications such as spectroscopy and beam steering.

More Details

Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

2023 Conference on Lasers and Electro Optics CLEO 2023

Wood, Michael G.; Bahr, Matthew N.; Gutierrez, Jordan E.; Anderson, Evan M.; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Foulk, James W.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex T.; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon T.; Shank, Joshua; Chumney, Daniel R.; Looker, Quinn M.

We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

More Details

Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

CLEO: Science and Innovations, CLEO:S and I 2023

Wood, Michael G.; Bahr, Matthew N.; Serkland, Darwin K.; Gutierrez, Jordan E.; Anderson, Evan M.; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Foulk, James W.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex T.; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon T.; Shank, Joshua; Chumney, Daniel R.; Looker, Quinn M.

We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

More Details

NIR Ring Mirror Laser Utilizing Low Loss Silicon Nitride Photonic Platform

CLEO: Fundamental Science, CLEO:FS 2023

Starbuck, Andrew L.; Trotter, Douglas C.; Dallo, Christina M.; Martinez, William M.; Chow, Weng W.; Skogen, Erik J.; Gehl, Michael

Low loss silicon nitride ring resonator reflectors provide feedback to a III/V gain chip, achieving single-mode lasing at 772nm. The Si3N4 is fabricated in a CMOS foundry compatible process that achieves loss values of 0.036dB/cm.

More Details
8 Results
8 Results