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Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

CLEO: Science and Innovations, CLEO:S and I 2023

Wood, Michael G.; Bahr, Matthew; Serkland, Darwin K.; Gutierrez, Jordan E.; Anderson, Evan M.; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Bays, Nathan R.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex T.; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon T.; Shank, Josh; Chumney, Daniel R.; Looker, Quinn M.

We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

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TYPE Conference Presentation YEAR 2023
DOIOSTIScopus

Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Wood, Michael G.; Bahr, Matthew; Gutierrez, Jordan E.; Anderson, Evan; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Bays, Nathan R.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex T.; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon; Shank, Josh; Chumney, Daniel R.; Looker, Quinn M.

Abstract not provided.

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TYPE Conference Proceeding YEAR 2022
DOIOSTI
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