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Microstructural evolution of thin polycrystalline metallic films under extreme conditions

Abdeljawad, Fadi F.

Thin films are materials systems that are widely used in applications ranging from electronics and optical devices to industrial and biomedical ones. However, these systems are unstable against various homogenization processes and aging mechanisms (grain growth, coarsening, surface evolution, and diffusion of species) even at low service temperatures. In this work, we examine the role of various aspects of microstructure (grain boundary types and characters, free surfaces, surface diffusion, and thermal grooves) on the thermal aging of such systems. Existing experimental tools will be leveraged to characterize thin films, i.e., in-situ quantitative thermal annealing, and provide direct comparisons to predications emerging from a recently developed meso-scale model via Precession Electron Diffraction (PED). Parametric studies will be conducted to gain insights on the role of each of the aforementioned aspects of microstructure on the dynamics. Herein, we will focus on “hard” gold thin films (with alloying elements like Co, Ni, or Fe) as they are materials of choice in a wide range of applications at Sandia. Initially, pure gold systems are examined and future studies will focus on microstructure evolution in the presence of alloying elements and second-phase particles.

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TYPE Other Report YEAR 2019
DOIOSTI

Fatigue-driven acceleration of abnormal grain growth in nanocrystalline wires

Modelling and Simulation in Materials Science and Engineering

Foiles, Stephen M.; Abdeljawad, Fadi F.; Moore, Alexander M.; Boyce, Brad B.

Molecular dynamics simulations were employed to simulate the mechanical response and grain evolution in a Ni nanowire for both static and cyclic loading conditions at both 300 and 500 K for periods of 40 ns. The loading conditions included thermal annealing with no deformation, constant 1% extension (creep loading) and cyclic loading with strain amplitudes of 0.5% and 1% for 200 cycles. Under cyclic loading, the stress-strain response showed permanent deformation and cyclic hardening behavior. At 300 K, modest grain evolution was observed at all conditions within the 40 ns simulations. At 500 K, substantial grain growth is observed in all cases, but is most pronounced under cyclic loading. This may result mechanistically from a net motion of the boundaries associated with boundary ratcheting. There is a striking qualitative consistency between the present simulation results and the experimental observation of abnormal grain growth in nanocrystalline metals as a precursor to fatigue crack initiation.

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TYPE Journal Article YEAR 2019
DOIOSTIScopus

Changing the Engineering Design & Qualification Paradigm in Component Design & Manufacturing (Born Qualified)

Roach, R.A.; Bishop, Joseph E.; Jared, Bradley H.; Keicher, David M.; Cook, Adam W.; Whetten, Shaun R.; Forrest, Eric C.; Stanford, Joshua S.; Boyce, Brad B.; Johnson, Kyle J.; Rodgers, Theron R.; Ford, Kurtis R.; Martinez, Mario J.; Moser, Daniel M.; van Bloemen Waanders, Bart G.; Chandross, M.; Abdeljawad, Fadi F.; Allen, Kyle M.; Stender, Michael S.; Beghini, Lauren L.; Swiler, Laura P.; Lester, Brian T.; Argibay, Nicolas A.; Brown-Shaklee, Harlan J.; Kustas, Andrew K.; Sugar, Joshua D.; Kammler, Daniel K.; Wilson, Mark A.

Abstract not provided.

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TYPE Presentation YEAR 2018
OSTIOSTI
Results 1–25 of 91
Results 1–25 of 91