Publications

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Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power of power electronics beyond current devices based on silicon (Si). However, the increased operating power densities and reduced areal footprints of WBG device technologies result in significant levels of self-heating that can ultimately restrict device operation through performance degradation, reliability issues, and failure. Typically, self-heating in WBG devices is studied using a single measurement technique while operating the device under steady-state direct current measurement conditions. However, for switching applications, this steady-state thermal characterization may lose significance since the high power dissipation occurs during fast transient switching events. Therefore, it can be useful to probe the WBG devices under transient measurement conditions in order to better understand the thermal dynamics of these systems in practical applications. In this work, the transient thermal dynamics of an AlGaN/GaN high electron mobility transistor (HEMT) were studied using thermoreflectance thermal imaging and Raman thermometry. Also, the proper use of iterative pulsed measurement schemes such as thermoreflectance thermal imaging to determine the steady-state operating temperature of devices is discussed. These studies are followed with subsequent transient thermal characterization to accurately probe the self-heating from steady-state down to submicrosecond pulse conditions using both thermoreflectance thermal imaging and Raman thermometry with temporal resolutions down to 15 ns.

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Proper edge termination is required to reach large blocking voltages in vertical power devices. Limitations in selective area p-type doping in GaN restrict the types of structures that can be used for this purpose. A junction termination extension (JTE) can be employed to reduce field crowding at the junction periphery where the charge in the JTE is designed to sink the critical electric field lines at breakdown. One practical way to fabricate this structure in GaN is by a step-etched single-zone or multi-zone JTE where the etch depths and doping levels are used to control the charge in the JTE. The multi-zone JTE is beneficial for increasing the process window and allowing for more variability in parameter changes while still maintaining a designed percentage of the ideal breakdown voltage. Impact ionization parameters reported in literature for GaN are compared in a simulation study to ascertain the dependence on breakdown performance. Two 3-zone JTE designs utilizing different impact ionization coefficients are compared. Simulations confirm that the choice of impact ionization parameters affects both the predicted breakdown of the device as well as the fabrication process variation tolerance for a multi-zone JTE. Regardless of the impact ionization coefficients utilized, a step-etched JTE has the potential to provide an efficient, controllable edge termination design.

High-temperature optical analysis of three different InGaN/GaN multiple quantum well (MQW) light-emitting diode (LED) structures (peak wavelength λp = 448, 467, and 515 nm) is conducted for possible integration as an optocoupler emitter in high-density power electronic modules. The commercially available LEDs, primarily used in the display (λp = 467 and 515 nm) and lighting (λp = 448 nm) applications, are studied and compared to evaluate if they can satisfy the light output requirements in the optocouplers at high temperatures. The temperature- and intensity-dependent electroluminescence (T-IDEL) measurement technique is used to study the internal quantum efficiency (IQE) of the LEDs. All three LEDs exhibit above 70% IQE at 500 K and stable operation at 800 K without flickering or failure. At 800 K, a promising IQE of above 40% is observed for blue for display (BD) (λp = 467 nm) and green for display (GD) (λp = 515 nm) samples. The blue for light (BL) (λp = 448 nm) sample shows 24% IQE at 800 K.

Advances in FinFET design and fabrication enable manufacturing of denser, more compact integrated circuits (ICs) with substantially reduced leakage while shortening the channel-lengths. The same stress-induced leakage and breakdown degradation mechanisms that affect planar transistors also impact FinFET devices. Reliability concerns such as Bias Temperature Instability (BTI), Time Dependent Dielectric Breakdown (TDDB), and Hot Carrier Injection (HCI) become very important with changes to transistor geometry and fin sidewall crystal orientation. Recent testing has shown that FinFETs respond differently to radiation (radiation effects such as total ionizing dose) when compared to planar transistors. These reliability and radiation effects issues become very important when changing transistor geometry and scaling FinFETs towards smaller feature sizes (22-nm, 16-nm, 14- nm, 10-nm, and smaller critical dimensions). The comparable 2019 state of the art transistor densities in current high-volume manufacturing silicon-based foundries is 7-nm (ISMC, Samsung) and 10-nm (Intel) [www.anandtech.com,fuse.wikichip.org]. Released products include supporting components for the cellphone and commercial microprocessor markets respectively. Extensive development in the foundry industry is driving to a 5-nm technology node in late 2020.

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High‐temperature optical analysis of three different InGaN/GaN multiple quantum well (MQW) light‐emitting diode (LED) structures (peak wavelength λ _p  = 448, 467, and 515 nm) is conducted for possible integration as an optocoupler emitter in high‐density power electronic modules. The commercially available LEDs, primarily used in the display ( λ _p  = 467 and 515 nm) and lighting ( λ _p  = 448 nm) applications, are studied and compared to evaluate if they can satisfy the light output requirements in the optocouplers at high temperatures. The temperature‐ and intensity‐dependent electroluminescence (T‐IDEL) measurement technique is used to study the internal quantum efficiency (IQE) of the LEDs. All three LEDs exhibit above 70% IQE at 500 K and stable operation at 800 K without flickering or failure. At 800 K, a promising IQE of above 40% is observed for blue for display (BD) ( λ _p  = 467 nm) and green for display (GD) ( λ _p  = 515 nm) samples. The blue for light (BL) ( λ _p  = 448 nm) sample shows 24% IQE at 800 K.

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Commercial light emitting diode (LED) materials - blue (i.e., InGaN/GaN multiple quantum wells (MQWs) for display and lighting), green (i.e., InGaN/GaN MQWs for display), and red (i.e., Al0.05Ga0.45In0.5P/Al0.4Ga0.1In0.5P for display) are evaluated in range of temperature (77–800) K for future applications in high density power electronic modules. The spontaneous emission quantum efficiency (QE) of blue, green, and red LED materials with different wavelengths was calculated using photoluminescence (PL) spectroscopy. The spontaneous emission QE was obtained based on a known model so-called the ABC model. This model has been recently used extensively to calculate the internal quantum efficiency and its droop in the III-nitride LED. At 800 K, the spontaneous emission quantum efficiencies are around 40% for blue for lighting and blue for display LED materials, and it is about 44.5% for green for display LED materials. The spontaneous emission QE is approximately 30% for red for display LED material at 800 K. The advance reported in this paper evidences the possibility of improving high temperature optocouplers with an operating temperature of 500 K and above.

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