Publications

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

We present progress on the synthesis of semimetal Cd₃As₂ by metal–organic chemical-vapor deposition (MOCVD). Specifically, we have optimized the growth conditions needed to obtain technologically useful growth rates and acceptable thin-film microstructures, with our studies evaluating the effects of varying the temperature, pressure, and carrier-gas type for MOCVD of Cd₃As₂ when performed using dimethylcadmium and tertiary-butylarsine precursors. In the course of the optimization studies, exploratory Cd₃As₂ growths are attempted on GaSb substrates, strain-relaxed InAs buffer layers grown on GaSb substrates, and InAs substrates. Notably, only the InAs-terminated substrate surfaces yield desirable results. Extensive microstructural studies of Cd₃As₂ thin films on InAs are performed by using multiple advanced imaging microscopies and x-ray diffraction modalities. The studied films are 5–75 nm in thickness and consist of oriented, coalesced polycrystals with lateral domain widths of 30–80 nm. The most optimized films are smooth and specular, exhibiting a surface roughness as low as 1.0 nm rms. Under cross-sectional imaging, the Cd₃As₂-InAs heterointerface appears smooth and abrupt at a lower film thickness, ~30 nm, but becomes quite irregular as the average thickness increases to ~55 nm. The films are strain-relaxed with a residual biaxial tensile strain (ϵ_xx = +0.0010) that opposes the initially compressive lattice-mismatch strain of Cd₃As₂ coherent on InAs (ϵ_xx = - 0.042). Importantly, phase-identification studies find a thin-film crystal structure consistent with the P4₂/nbc space group, placing MOCVD-grown Cd₃As₂ among the Dirac semimetals of substantial interest for topological quantum materials studies.

Abstract not provided.

This work provides the first demonstration of vertical GaN Junction Barrier Schottky (JBS) rectifiers fabricated by etch and regrowth of p-GaN. A reverse blocking voltage near 1500 V was achieved at 1 mA reverse leakage, with a sub 1 V turn-on and a specific on-resistance of 10 mΩ-cm2. This result is compared to other reported JBS devices in the literature and our device demonstrates the lowest leakage slope at high reverse bias. A large initial leakage current is present near zero-bias which is attributed to a combination of inadequate etch-damage removal and passivation induced leakage current.

This paper describes the development of vertical GaN PN diodes for high-voltage applications. A centerpiece of this work is the creation of a foundry effort that incorporates epitaxial growth, wafer metrology, device design, processing, and characterization, and reliability evaluation and failure analysis. A parallel effort aims to develop very high voltage (up to 20 kV) GaN PN diodes for use as devices to protect the electric grid against electromagnetic pulses.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.