Publications

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Thermal analysts address a wide variety of applications requiring the simulation of radiation heat transfer phenomena. There are gaps in the currently available modeling capabilities. Addressing these gaps would allow for the consideration of additional physics and increase confidence in simulation predictions. This document outlines a five year plan to address the current and future needs of the analyst community with regards to modeling radiation heat transfer processes. This plan represents a significant multi-year effort that must be supported on an ongoing basis.

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Temperature measurements are very important in shock and ramp type dynamic materials experiments. In particular, accurate temperature measurements can provide stringent additional constraints on determining the equation of state for materials at high pressure. The key to providing these constraints is to develop diagnostic techniques that can determine the temperature with sufficient accuracy. To enable such measurements, we are working to improve our diagnostic capability with three separate techniques, each of which has specific applicability in a particular temperature range. To improve our capability at low temperatures (< 1 eV) we are working on a technique that takes advantage of the change in reflectivity of Au as the temperature is increased. This is most applicable to ramp type experiments. In the intermediate range (~1 eV < T< 5-10 eV) we are improving our optical pyrometry diagnostic by adding the capability of doing an absolute calibration as part of the diagnostic procedure for the shock or shock ramp dynamic materials experiment. This will enable more accurate temperature measurements for shock and shock ramp type experiments. For higher temperatures that occur in very high-pressure shock experiments, above 10 eV, we are developing the capability of doing x-ray Thomson scattering measurements. Such measurements will enable us to characterize strongly shocked or warm dense matter materials. Work on these diagnostic approaches is summarized in this report.

This report presents a specification for the Portals 4 network programming interface. Portals 4 is intended to allow scalable, high-performance network communication between nodes of a parallel computing system. Portals 4 is well suited to massively parallel processing and embedded systems. Portals 4 represents an adaption of the data movement layer developed for massively parallel processing platforms, such as the 4500-node Intel TeraFLOPS machine. Sandia's Cplant cluster project motivated the development of Version 3.0, which was later extended to Version 3.3 as part of the Cray Red Storm machine and XT line. Version 4 is targeted to the next generation of machines employing advanced network interface architectures that support enhanced offload capabilities.

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The ThermalDiffusion class was created to simulate one-dimensional thermal diffusion across one or more material layers. Each layer is assumed to have constant conductivity K and diffusivity κ . Interface conductance between layers may be specified. Internal heating as a function of position and time is also supported. The ThermalDiffusion class is included in the SMASH package [1] as part of the PDE (Partial Differential Equation) subpackage.