THERMO-MECHANICAL RELIABILITY AND ELECTRICAL PERFORMANCE OF INDIUM INTERCONNECTS AND UNDER BUMP METALLIZATION Leger, Jon-Claude Abstract not provided. More Details TYPE Thesis or Dissertation YEAR 2016 OSTI
3D Reversible Interconnect Okoro, J.; Lavin, Judith M.; Foulk, James W.; Cook, Adam; Keicher, David; Leger, Jon-Claude Abstract not provided. More Details TYPE Conference Poster YEAR 2015 OSTI
3D Reversible Interconnect Lavin, Judith M.; Cook, Adam; Keicher, David; Sanchez, Carlos A.; Jensen, Sara E.; Okoro, J.; Leger, Jon-Claude; Foulk, James W.; Mani, Seethambal Abstract not provided. More Details TYPE Conference Poster YEAR 2015 OSTI
Reversible Electrical Bonding For Large Area Device Verification Young, Nathan P.; Sanchez, Carlos A.; Leger, Jon-Claude; Bauer, Todd M.; Jensen, Sara E. Abstract not provided. More Details TYPE Conference YEAR 2013 OSTI
Optical Deformation Chamber using Digital Image Correlation Leger, Jon-Claude; Young, Nathan P.; Shaner, Eric A. Abstract not provided. More Details TYPE Conference YEAR 2011 OSTI