K-means clustering analysis is applied to frequency-domain thermoreflectance (FDTR) hyperspectral image data to rapidly screen the spatial distribution of thermophysical properties at material interfaces. Performing FDTR while raster scanning a sample consisting of 8.6 μ m of doped-silicon (Si) bonded to a doped-Si substrate identifies spatial variation in the subsurface bond quality. Routine thermal analysis at select pixels quantifies this variation in bond quality and allows assignment of bonded, partially bonded, and unbonded regions. Performing this same routine thermal analysis across the entire map, however, becomes too computationally demanding for rapid screening of bond quality. To address this, K-means clustering was used to reduce the dimensionality of the dataset from more than 20 000 pixel spectra to just K = 3 component spectra. The three component spectra were then used to express every pixel in the image through a least-squares minimized linear combination providing continuous interpolation between the components across spatially varying features, e.g., bonded to unbonded transition regions. Fitting the component spectra to the thermal model, thermal properties for each K cluster are extracted and then distributed according to the weighting established by the regressed linear combination. Thermophysical property maps are then constructed and capture significant variation in bond quality over 25 μ m length scales. The use of K-means clustering to achieve these thermal property maps results in a 74-fold speed improvement over explicit fitting of every pixel.
3D integration of multiple microelectronic devices improves size, weight, and power while increasing the number of interconnections between components. One integration method involves the use of metal bump bonds to connect devices and components on a common interposer platform. Significant variations in the coefficient of thermal expansion in such systems lead to stresses that can cause thermomechanical and electrical failures. More advanced characterization and failure analysis techniques are necessary to assess the bond quality between components. Frequency domain thermoreflectance (FDTR) is a nondestructive, noncontact testing method used to determine thermal properties in a sample by fitting the phase lag between an applied heat flux and the surface temperature response. The typical use of FDTR data involves fitting for thermal properties in geometries with a high degree of symmetry. In this work, finite element method simulations are performed using high performance computing codes to facilitate the modeling of samples with arbitrary geometric complexity. A gradient-based optimization technique is also presented to determine unknown thermal properties in a discretized domain. Using experimental FDTR data from a GaN-diamond sample, thermal conductivity is then determined in an unknown layer to provide a spatial map of bond quality at various points in the sample.
This study presents a deep learning based methodology for both remote sensing and design of acoustic scatterers. The ability to determine the shape of a scatterer, either in the context of material design or sensing, plays a critical role in many practical engineering problems. This class of inverse problems is extremely challenging due to their high-dimensional, nonlinear, and ill-posed nature. To overcome these technical hurdles, we introduce a geometric regularization approach for deep neural networks (DNN) based on non-uniform rational B-splines (NURBS) and capable of predicting complex 2D scatterer geometries in a parsimonious dimensional representation. Then, this geometric regularization is combined with physics-embedded learning and integrated within a robust convolutional autoencoder (CAE) architecture to accurately predict the shape of 2D scatterers in the context of identification and inverse design problems. An extensive numerical study is presented in order to showcase the remarkable ability of this approach to handle complex scatterer geometries while generating physically-consistent acoustic fields. The study also assesses and contrasts the role played by the (weakly) embedded physics in the convergence of the DNN predictions to a physically consistent inverse design.
Radiation-hard high-voltage vertical GaN p-n diodes are being developed for use in power electronics subjected to ionizing radiation. We present a comparison of the measured and simulated photocurrent response of diodes exposed to ionizing irradiation with 70 keV and 20 MeV electrons at dose rates in the range of 1.4× 107 - 5.0× 108 rad(GaN)/s. The simulations correctly predict the trend in the measured steady-state photocurrent and agree with the experimental results within a factor of 2. Furthermore, simulations of the transient photocurrent response to dose rates with uniform and non-uniform ionization depth profiles uncover the physical processes involved that cannot be otherwise experimentally observed due to orders of magnitude larger RC time constant of the test circuit. The simulations were performed using an eXploratory Physics Development code developed at Sandia National Laboratories. The code offers the capability to include defect physics under more general conditions, not included in commercially available software packages, extending the applicability of the simulations to different types of radiation environments.
In this study, we develop an end-to-end deep learning-based inverse design approach to determine the scatterer shape necessary to achieve a target acoustic field. This approach integrates non-uniform rational B-spline (NURBS) into a convolutional autoencoder (CAE) architecture while concurrently leveraging (in a weak sense) the governing physics of the acoustic problem. By utilizing prior physical knowledge and NURBS parameterization to regularize the ill-posed inverse problem, this method does not require enforcing any geometric constraint on the inverse design space, hence allowing the determination of scatterers with potentially any arbitrary shape (within the set allowed by NURBS). A numerical study is presented to showcase the ability of this approach to identify physically-consistent scatterer shapes capable of producing user-defined acoustic fields.
A method is developed to calculate the length into a sample to which a Frequency Domain Thermoreflectance (FDTR) measurement is sensitive. Sensing depth and sensing radius are defined as limiting cases for the spherically spreading FDTR measurement. A finite element model for FDTR measurements is developed in COMSOL multiphysics and used to calculate sensing depth and sensing radius for silicon and silicon dioxide samples for a variety of frequencies and laser spot sizes. The model is compared to experimental FDTR measurements. Design recommendations for sample thickness are made for experiments where semi-infinite sample depth is desirable. For measurements using a metal transducer layer, the recommended sample thickness is three thermal penetration depths, as calculated from the lowest measurement frequency.