The additive manufacture of compositionally graded Al/Cu parts by laser engineered net shaping (LENS) is demonstrated. The use of a blue light build laser enabled deposition on a Cu substrate. The thermal gradient and rapid solidification inherent to selective laser melting enabled mass transport of Cu up to 4 mm from a Cu substrate through a pure Al deposition, providing a means of producing gradients with finer step sizes than the printed layer thicknesses. Divorcing gradient continuity from layer or particle size makes LENS a potentially enabling technology for the manufacture of graded density impactors for ramp compression experiments. Printing graded structures with pure Al, however, was prevented by the growth of Al2Cu3 dendrites and acicular grains amid a matrix of Al2Cu. A combination of adding TiB2 grain refining powder and actively varying print layer composition suppressed the dendritic growth mode and produced an equiaxed microstructure in a compositionally graded part. Material phase was characterized for crystal structure and nanoindentation hardness to enable a discussion of phase evolution in the rapidly solidifying melt pool of a LENS print.
Electrical polarization and defect transport are examined in 0.8BaTiO3–0.2BiZn0.5Ti0.5O3, an attractive capacitor material for high power electronics. Oxygen vacancies are suggested to be the majority charge carrier at or below 250°C with a grain conduction hopping activation energy of 0.97 eV and 0.92 eV for thermally stimulated depolarization current (TSDC) and impedance spectroscopy measurements, respectively. At higher temperature, thermally generated electronic conduction with an activation energy of 1.6 eV is dominant. Significant oxygen vacancy concentration is indicated (up to ~1%) due to cation vacancy formation (i.e., acceptor defects) from observed Bi (and likely Zn) volatility. Oxygen vacancy diffusivity is estimated to be 10-12.8 cm2/s at 250°C. Low diffusivity and high activation energies are indicative of significant defect interactions. Dipolar oxygen vacancy defects are also indicated, with an activation energy of 0.59 eV from TSDC measurements. In conclusion, the large oxygen vacancy content leads to a short lifetime during high voltage (30 kV/cm), high temperature (250°C) direct current (DC) electrical measurements.
Recent work on the development of integrated thermographic phosphors and digital image correlation (TP+DIC) for combined thermal–mechanical measurements has revealed the need for a flexible, stretchable phosphor coating for metal surfaces. Herein, we coat stainless steel substrates with a polymer-based phosphor ink in a DIC speckle pattern and demonstrate that the ink remains well bonded under substrate deformation. In contrast, a binderless phosphor DIC coating produced via aerosol deposition (AD) partially debonded from the substrate. DIC calculations reveal that the strain on the ink coating matches the strain on the substrate within 4% error at the highest substrate loads (0.05 mm/mm applied substrate strain), while the strain on the AD coating remains near 0 mm/mm as the substrate deforms. Spectrally resolved emission from the phosphor is measured through the transparent binder throughout testing, and the ratio method is used to infer temperature with an uncertainty of 1.7 °C. This phosphor ink coating will allow for accurate, non-contact strain and temperature measurements of a deforming surface.
Multimodal datasets of materials are rich sources of information which can be leveraged for expedited discovery of process–structure–property relationships and for designing materials with targeted structures and/or properties. For this data descriptor article, we provide a multimodal dataset of magnetron sputter-deposited molybdenum (Mo) thin films, which are used in a variety of industries including high temperature coatings, photovoltaics, and microelectronics. In this dataset we explored a process space consisting of 27 unique combinations of sputter power and Ar deposition pressure. Here, the phase, structure, surface morphology, and composition of the Mo thin films were characterized by x-ray diffraction, scanning electron microscopy, atomic force microscopy, and Rutherford backscattering spectrometry. Physical properties—namely, thickness, film stress and sheet resistance—were also measured to provide additional film characteristics and behaviors. Additionally, nanoindentation was utilized to obtain mechanical load-displacement data. The entire dataset consists of 2072 measurements including scalar values (e.g., film stress values), 2D linescans (e.g., x-ray diffractograms), and 3D imagery (e.g., atomic force microscopy images). An additional 1889 quantities, including film hardness, modulus, electrical resistivity, density, and surface roughness, were derived from the experimental datasets using traditional methods. Minimal analysis and discussion of the results are provided in this data descriptor article to limit the authors’ preconceived interpretations of the data. Overall, the data modalities are consistent with previous reports of refractory metal thin films, ensuring that a high-quality dataset was generated. The entirety of this data is committed to a public repository in the Materials Data Facility.
Although gold remains a preferred surface finish for components used in high-reliability electronics, rapid developments in this area have left a gap in the fundamental understanding of solder joint gold (Au) embrittlement. Furthermore, as electronic designs scale down in size, the effect of Au content is not well understood on increasingly smaller solder interconnections. As a result, previous findings may have limited applicability. The current study focused on addressing these gaps by investigating the interfacial microstructure that evolves in 63Sn-37Pb solder joints as a function of Au layer thickness. Those findings were correlated to the mechanical performance of the solder joints. Increasing the initial Au concentration decreased the mechanical strength of a joint, but only to a limited degree. Kirkendall voids were the primary contributor to low-strength joints, while brittle fracture within the intermetallic compounds (IMC) layers is less of a factor. The Au embrittlement mechanism appears to be self-limiting, but only once mechanical integrity is degraded. Sufficient void evolution prevents continued diffusion from the remaining Au.
Plasma formation from intensely ohmically heated conductors is known to be highly non-uniform, as local overheating can be driven by micron-scale imperfections. Detailed understanding of plasma formation is required to predict the performance of magnetically driven physics targets and magnetically-insulated transmission lines (MITLs). Previous LDRD-supported work (projects 178661 and 200269) developed the electrothermal instability (ETI) platform, on the Mykonos facility, to gather high-resolution images of the self-emission from the non-uniform ohmic heating of z-pinch rods. Experiments studying highly inhomogeneous alloyed aluminum captured complex heating topography. To enable detailed comparison with magnetohydrodynamic (MHD) simulation, 99.999% pure aluminum rods in a z-pinch configuration were diamond-turned to ~10nm surface roughness and then further machined to include well-characterized micron-scale "engineered" defects (ED) on the rod's surface (T.J. Awe, et al., Phys. Plasmas 28, 072104 (2021)). In this project, the engineered defect hardware and diagnostic platform were used to study ETI evolution and non-uniform plasma formation from stainless steel targets. The experimental objective was to clearly determine what, if any, role manufacturing, preparation, or alloy differences have in encouraging nonuniform heating and plasma formation from high-current density stainless steel. Data may identify improvements that may be implemented in the fabrication/preparation of electrodes used on the Z machine. Preliminary data shows that difference in manufacturer has no observed effect on ETI evolution, stainless alloy 304L heated more uniformly than alloy 310 at similar current densities, and that stainless steel undergoes the same evolutionary ETI stages as ultra-pure aluminum, with increased emission tied to areas of elevated surface roughness.
The composition and phase fraction of the intergranular phase of 94ND10 ceramic is determined and fabricated ex situ. The fraction of each phase is 85.96 vol% Al2O3 bulk phase, 9.46 vol% Mg-rich intergranular phase, 4.36 vol% Ca/Si-rich intergranular phase, and 0.22 vol% voids. The Ca/Si-rich phase consists of 0.628 at% Mg, 12.59 at% Si, 10.24 at% Ca, 17.23 at% Al, and balance O. The Mgrich phase consists of 14.17 at% Mg, 0.066 at% Si, 0.047 at% Ca, 28.69 at% Al, and balance O. XRD of the ex situ intergranular material made by mixed oxides consisting of the above phase and element fractions yielded 92 vol% MgAl2O4 phase and 8 vol% CaAl2Si2O8 phase. The formation of MgAl2O4 phase is consistent with prior XRD of 94ND10, while the CaAl2Si2O8 phase may exist in 94ND10 but at a concentration not readily detected with XRD. The MgAl2O4 and CaAl2Si2O8 phases determined from XRD are expected to have the elemental compositions for the Mg-rich and Ca/Si-rich phases above by cation substitutions (e.g., some Mg substituted for by Ca in the Mg-rich phase) and impurity phases not detectable with XRD.