This SAND report fulfills the final report requirement for the Born Qualified Grand Challenge LDRD. Born Qualified was funded from FY16-FY18 with a total budget of ~$13M over the 3 years of funding. Overall 70+ staff, Post Docs, and students supported this project over its lifetime. The driver for Born Qualified was using Additive Manufacturing (AM) to change the qualification paradigm for low volume, high value, high consequence, complex parts that are common in high-risk industries such as ND, defense, energy, aerospace, and medical. AM offers the opportunity to transform design, manufacturing, and qualification with its unique capabilities. AM is a disruptive technology, allowing the capability to simultaneously create part and material while tightly controlling and monitoring the manufacturing process at the voxel level, with the inherent flexibility and agility in printing layer-by-layer. AM enables the possibility of measuring critical material and part parameters during manufacturing, thus changing the way we collect data, assess performance, and accept or qualify parts. It provides an opportunity to shift from the current iterative design-build-test qualification paradigm using traditional manufacturing processes to design-by-predictivity where requirements are addressed concurrently and rapidly. The new qualification paradigm driven by AM provides the opportunity to predict performance probabilistically, to optimally control the manufacturing process, and to implement accelerated cycles of learning. Exploiting these capabilities to realize a new uncertainty quantification-driven qualification that is rapid, flexible, and practical is the focus of this effort.
The permittivity, dielectric loss, and DC dielectric breakdown strength of additively manufactured, solvent-cast, and commercial polyimide films are reported As expected, commercial films performed better than both AM and solvent-cast lab-made films. Solvent-cast films generally performed better than AM films, although performance depended on the optimization of the material for the specific deposition technique. The most significant degradation of performance in all the lab-made films was in the dispersion of both the x/Df measurements and the dielectric breakdown strength (Weibull β). Commercial films had a breakdown strength of 4891 kV/cm and β = 13.0 whereas the highest performing lab-made films had a breakdown strength of 4072 kV/cm and β = 3.8. Furthermore, this increase in dispersion in all the lab-made samples is attributed to higher variability in the preparation, a higher defect level related to fabrication in the lab environment and, for some AM samples, to morphology/topology features resulting from the deposition technique.
