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Effects of ionizing radiation on TaOx-based memristive devices

IEEE Aerospace Conference Proceedings

McLain, Michael L.; Hughart, David R.; Hanson, Donald J.; Marinella, Matthew J.

This paper evaluates the effects of ionizing radiation on tantalum oxide (TaOx) memristors. The data obtained from 60Co gamma ray and 10 keV X-ray ionizing radiation experiments indicate that it is possible for the devices to switch from a high resistance off-state to a low resistance on-state after a total ionizing dose (TID) step stress threshold has been surpassed. During irradiation, the devices were floating, grounded, or biased with a 1 Hz square wave with an amplitude of ±100 mV. While floating the terminals is not a typical bias condition within a circuit, it is speculated that this condition might be worst-case because of the lack of a discharge path. If a read measurement is performed prior to reaching the charge threshold, the devices 'reset' back to a pre-irradiation state. This suggests that the devices do not have a cumulative TID effect. However, it was observed that having a continuous bias on the device during the TID exposure did not always have the same effect. The TID threshold level at which the devices switch resistance states varies from device to device; the enhanced susceptibility observed in some devices is still under investigation. After a radiation-induced resistance change, all of the devices could be reset and still functioned properly. When the devices were set into a low resistance on-state prior to irradiation, there was not a significant variation in the resistance post-irradiation (i.e., the devices were still in the on-state). Overall, the memristor TID performance is promising and could potentially enable the discovery of a radiation-hardened nonvolatile memory technology to be used in space and aerospace applications. © 2014 IEEE.

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Development, characterization, and modeling of a TaOx ReRAM for a neuromorphic accelerator

ECS Transactions

Marinella, Matthew J.; Mickel, Patrick R.; Lohn, Andrew L.; Hughart, David R.; Bondi, Robert J.; Mamaluy, Denis M.; Hjalmarson, Harold P.; Stevens, James E.; Decker, Seth D.; Apodaca, Roger A.; Evans, Brian R.; Aimone, James B.; Rothganger, Fredrick R.; James, Conrad D.; DeBenedictis, Erik

Resistive random access memory (ReRAM), or memristors, may be capable of significantly improve the efficiency of neuromorphic computing, when used as a central component of an analog hardware accelerator. However, the significant electrical variation within a device and between devices degrades the maximum efficiency and accuracy which can be achieved by a ReRAMbased neuromorphic accelerator. In this report, the electrical variability is characterized, with a particular focus on that which is due to fundamental, intrinsic factors. Analytical and ab initio models are presented which offer some insight into the factors responsible for this variability.

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Development, characterization, and modeling of a TaOx ReRAM for a neuromorphic accelerator

ECS Transactions

Marinella, Matthew J.; Mickel, Patrick R.; Lohn, Andrew L.; Hughart, David R.; Bondi, Robert J.; Mamaluy, Denis M.; Hjalmarson, Harold P.; Stevens, James E.; Decker, Seth D.; Apodaca, Roger A.; Evans, Brian R.; Aimone, James B.; Rothganger, Fredrick R.; James, Conrad D.; DeBenedictis, Erik

Resistive random access memory (ReRAM), or memristors, may be capable of significantly improve the efficiency of neuromorphic computing, when used as a central component of an analog hardware accelerator. However, the significant electrical variation within a device and between devices degrades the maximum efficiency and accuracy which can be achieved by a ReRAMbased neuromorphic accelerator. In this report, the electrical variability is characterized, with a particular focus on that which is due to fundamental, intrinsic factors. Analytical and ab initio models are presented which offer some insight into the factors responsible for this variability.

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Sensitivity analysis of a technique for the extraction of interface trap density in SiC MOSFETs from subthreshold characteristics

IEEE International Reliability Physics Symposium Proceedings

Hughart, David R.; Flicker, Jack D.; Atcitty, Stanley A.; Marinella, Matthew J.; Kaplar, Robert K.

A method for extracting interface trap density (DIT) from subthreshold I-V characteristics is used to analyze data on a SiC MOSFET stressed for thirty minutes at 175°C with a gate bias of-20 V. Without knowing the channel doping, the change in DIT can be calculated when referenced to an energy level correlated with the threshold voltage. © 2014 IEEE.

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A CMOS Compatible, Forming Free TaOx ReRAM

ECS Transactions (Online)

Stevens, James E.; Mickel, Patrick R.; Hughart, David R.; Marinella, Matthew J.

Resistive random access memory (ReRAM) has become a promising candidate for next-generation high-performance non-volatile memory that operates by electrically tuning resistance states via modulating vacancy concentrations. Here, we demonstrate a wafer-scale process for resistive switching in tantalum oxide that is completely CMOS compatible. The resulting devices are forming-free and with greater than 1x105 cycle endurance.

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Results 101–125 of 134
Results 101–125 of 134