Atomic precision advanced manufacturing (APAM) offers creation of donor devices in an atomically thin layer doped beyond the solid solubility limit, enabling unique device physics. This presents an opportunity to use APAM as a pathfinding platform to investigate digital electronics at the atomic limit. Scaling to smaller transistors is increasingly difficult and expensive, necessitating the investigation of alternative fabrication paths that extend to the atomic scale. APAM donor devices can be created using a scanning tunneling microscope (STM). However, these devices are not currently compatible with industry standard fabrication processes. There exists a tradeoff between low thermal budget (LT) processes to limit dopant diffusion and high thermal budget (HT) processes to grow defect-free layers of epitaxial Si and gate oxide. To this end, we have developed an LT epitaxial Si cap and LT deposited Al2O3 gate oxide integrated with an atomically precise single-electron transistor (SET) that we use as an electrometer to characterize the quality of the gate stack. The surface-gated SET exhibits the expected Coulomb blockade behavior. However, the gate’s leverage over the SET is limited by defects in the layers above the SET, including interfaces between the Si and oxide, and structural and chemical defects in the Si cap. We propose a more sophisticated gate stack and process flow that is predicted to improve performance in future atomic precision devices.
Richardson, Christopher J.K.; Lordi, Vincenzo; Misra, Shashank M.; Shabani, Javad
Quantum computing, sensing, and communications are emerging technologies that may circumvent known limitations of their existing traditional counterparts. While the promises of these technologies are currently narrow in scope, it is possible that they will broadly impact our lives by revolutionizing the capabilities of data centers and medical diagnostics, for example. At the heart of these technologies is the use of a quantum object to contain information, called a quantum bit or qubit. Current realizations of qubits exist in a broad variety of material systems, including individual spins in semiconductors or insulators, superconducting circuits, and trapped ions. Further advancement of qubits requires significant contributions from materials science in areas of materials selection, synthesis, fabrication, simulation and characterization. Here, we discuss some of the needs and opportunities for contributions to advance the fundamental understanding of materials used in quantum information applications.
The attachment of dopant precursor molecules to depassivated areas of hydrogen-terminated silicon templated with a scanning tunneling microscope (STM) has been used to create electronic devices with sub-nanometer precision, typically for quantum physics demonstrations, and to dope silicon past the solid-solubility limit, with potential applications in microelectronics and plasmonics. However, this process, which we call atomic precision advanced manufacturing (APAM), currently lacks the throughput required to develop sophisticated applications because there is no proven scalable hydrogen lithography pathway. Here, we demonstrate and characterize an APAM device workflow where STM lithography has been replaced with photolithography. An ultraviolet laser is shown to locally heat silicon controllably above the temperature required for hydrogen depassivation. STM images indicate a narrow range of laser energy density where hydrogen has been depassivated, and the surface remains well-ordered. A model for photothermal heating of silicon predicts a local temperature which is consistent with atomic-scale STM images of the photo-patterned regions. Finally, a simple device made by exposing photo-depassivated silicon to phosphine is found to have a carrier density and mobility similar to that produced by similar devices patterned by STM.
Quantum materials have long promised to revolutionize everything from energy transmission (high temperature superconductors) to both quantum and classical information systems (topological materials). However, their discovery and application has proceeded in an Edisonian fashion due to both an incomplete theoretical understanding and the difficulty of growing and purifying new materials. This project leverages Sandia's unique atomic precision advanced manufacturing (APAM) capability to design small-scale tunable arrays (designer materials) made of donors in silicon. Their low-energy electronic behavior can mimic quantum materials, and can be tuned by changing the fabrication parameters for the array, thereby enabling the discovery of materials systems which can't yet be synthesized. In this report, we detail three key advances we have made towards development of designer quantum materials. First are advances both in APAM technique and underlying mechanisms required to realize high-yielding donor arrays. Second is the first-ever observation of distinct phases in this material system, manifest in disordered 2D sheets of donors. Finally are advances in modeling the electronic structure of donor clusters and regular structures incorporating them, critical to understanding whether an array is expected to show interesting physics. Combined, these establish the baseline knowledge required to manifest the strongly-correlated phases of the Mott-Hubbard model in donor arrays, the first step to deploying APAM donor arrays as analogues of quantum materials.