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Microfabricated Ion Traps on Sapphire for Larger Trap Areas and Higher Qubit Count

Meinelt, Zachary K.; Bahr, Matthew; Finnegan, Patrick S.; Haltli, Raymond A.; Jordan, Matthew B.; Klitsner, Benjamin H.; Liebsch, Tyler; Mounce, Andrew M.; Weatherred, Scott E.; Stick, Daniel L.

Surface ion traps are a promising platform for quantum computing due to their potential to store large numbers of ions that can be addressed by electrical and optical control signals in order to implement quantum algorithms. Increasing the power of the quantum computer requires increasing the number of ions, but this poses a significant challenge in that it leads to a non-linear increase in on-chip power dissipation. The primary contributor to this power scaling in current devices is the capacitance between the radio frequency (RF) electrode and the metal plane that shields the silicon substrate from the RF signals applied to it. Silicon has traditionally been chosen for the substrate material for compatibility with the processing required for multi-metal-level traps. In this work, we address these capacitance and fabrication challenges by replacing the commonly used silicon substrate with an insulating sapphire substrate to fabricate a multi-metal-level ion trap, while still employing common semiconductor manufacturing techniques. This change in substrate allows the design to remove the metal shielding from the device design, reducing the capacitance of the RF electrode. The electrical characteristics of these traps were measured, specifically trap impedance, capacitance, and voltage breakdown, and compared to nearly identical silicon trap devices. Finally, we used laser cutting techniques to shape a sapphire wafer into bowtie shapes matching silicon traps previously fabricated at Sandia National Labs to explore solutions for integrating sapphire substrates into non-rectangular ion trap designs.

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Non-reciprocal acoustoelectric microwave amplifiers with net gain and low noise in continuous operation

Nature Electronics

Hackett, Lisa; Miller, Michael; Weatherred, Scott E.; Arterburn, Shawn C.; Storey, Matthew J.; Peake, Greg; Dominguez, Daniel; Finnegan, Patrick S.; Friedmann, Thomas A.; Eichenfield, Matt

Piezoelectric acoustic devices that are integrated with semiconductors can leverage the acoustoelectric effect, allowing functionalities such as gain and isolation to be achieved in the acoustic domain. This could lead to performance improvements and miniaturization of radio-frequency electronic systems. However, acoustoelectric amplifiers that offer a large acoustic gain with low power consumption and noise figure at microwave frequencies in continuous operation have not yet been developed. Here we report non-reciprocal acoustoelectric amplifiers that are based on a three-layer heterostructure consisting of an indium gallium arsenide (In0.53Ga0.47As) semiconducting film, a lithium niobate (LiNbO3) piezoelectric film, and a silicon substrate. The heterostructure can continuously generate 28.0 dB of acoustic gain (4.0 dB net radio-frequency gain) for 1 GHz phonons with an acoustic noise figure of 2.8 dB, while dissipating 40.5 mW of d.c. power. We also create a device with an acoustic gain of 37.0 dB (11.3 dB net gain) at 1 GHz with 19.6 mW of d.c. power dissipation and a non-reciprocal transmission of over 55 dB.

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Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

CLEO: Science and Innovations, CLEO:S and I 2023

Wood, Michael G.; Bahr, Matthew; Serkland, Darwin K.; Gutierrez, Jordan E.; Anderson, Evan M.; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Bays, Nathan R.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex T.; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon T.; Shank, Josh; Chumney, Daniel R.; Looker, Quinn M.

We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

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Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Wood, Michael G.; Bahr, Matthew; Gutierrez, Jordan E.; Anderson, Evan; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Bays, Nathan R.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex T.; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon; Shank, Josh; Chumney, Daniel R.; Looker, Quinn M.

Abstract not provided.

Analyzing Custom Proof Masses and Quantum Limits of a Manufacturable Cavity Optical Levitation Solution

Grine, Alejandro J.; Serkland, Darwin K.; Schultz, Justin; Wood, Michael G.; Finnegan, Patrick S.; Weatherred, Scott E.; Peake, Gregory M.; Sandoval, Annette; Alliman, Darrel; Li, Tongcang; Seberson, Troy

This report details results of a one-year LDRD to understand the dynamics, figures of merit, and fabrication possibilities for levitating a micro-scale, disk-shaped dielectric in an optical field. Important metrics are the stability, positional uncertainty, and required optical power to maintain levitation. Much of the results are contained in a publication written by our academic alliance collaborators. Initial structures were grown at Sandia labs and a test fabrication flow was executed. Owing to our strength in VCSEL lasers, we were particularly interested in calculations and fabrication flows that could be compatible with a VCSEL light source.

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Compact, Pull-in-Free Electrostatic MEMS Actuated Tunable Ring Resonator for Optical Multiplexing

Optics InfoBase Conference Papers

Ruyack, Alexander; Grine, Alejandro J.; Finnegan, Patrick S.; Serkland, Darwin K.; Robinson, Samuel; Weatherred, Scott E.; Frost, Megan; Nordquist, Christopher D.; Wood, Michael G.

We present an optical wavelength division multiplexer enabled by a ring resonator tuned by MEMS electrostatic actuation. Analytical analysis, simulation and fabrication are discussed leading to results showing controlled tuning greater than one FSR.

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Compact, Pull-in-Free Electrostatic MEMS Actuated Tunable Ring Resonator for Optical Multiplexing

Optics Infobase Conference Papers

Ruyack, Alexander; Grine, Alejandro J.; Finnegan, Patrick S.; Serkland, Darwin K.; Robinson, Samuel; Weatherred, Scott E.; Frost, Megan; Nordquist, Christopher D.; Wood, Michael G.

We present an optical wavelength division multiplexer enabled by a ring resonator tuned by MEMS electrostatic actuation. Analytical analysis, simulation and fabrication are discussed leading to results showing controlled tuning greater than one FSR.

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