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AlGaN-channel high electron mobility transistors (HEMTs) are among a class of ultra wide-bandgap transistors that are promising candidates for RF and power applications. Long-channel Al_xGa_1-xN HEMTs with x = 0.7 in the channel have been built and evaluated across the -50°C to +200°C temperature range. These devices achieved room temperature drain current as high as 46 mA/mm and were absent of gate leakage until the gate diode forward bias turn-on at ~2.8 V, with a modest -2.2 V threshold voltage. A very large I_on/I_off current ratio, of 8 × 10⁹ was demonstrated. A near ideal subthreshold slope that is just 35% higher than the theoretical limit across the temperature range was characterized. The ohmic contact characteristics were rectifying from -50°C to +50°C and became nearly linear at temperatures above 100°C. An activation energy of 0.55 eV dictates the temperature dependence of off-state leakage.

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TYPE Journal Article YEAR 2017

DOI OSTI

Design optimization of GaN vertical power diodes and comparison to Si and SiC

2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2017

Flicker, Jack D.; Kaplar, Robert J.

In order to determine how material characteristics percolate up to system-level improvements in power dissipation for different material systems and device types, we have developed an optimization tool for power diodes. This tool minimizes power dissipation in a diode for a given system operational regime (reverse voltage, forward current density, frequency, duty cycle, and temperature) for a variety of device types and materials. We have carried out diode optimizations for a wide range of system operating points to determine the regimes for which certain power diode materials/devices are favored. In this work, we present results comparing state-of-the-art Si and SiC merged PiN Schottky (MPS) diodes to vertical GaN (v-GaN) PiN diodes and as-yet undeveloped v-GaN Schottky barrier diodes (SBDs). The results of this work show that for all conditions tested, SiC MPS and v-GaN PiN diodes are preferred over Si MPS diodes. v-GaN PiN diodes are preferred over SiC MPS diodes for high-voltage / moderate-frequency operation with the limits of the v-GaN PiN preferred regime, increasing with increasing forward current density. If a v-GaN SBD diode were available, it would be preferred over all other devices at low to moderate voltages, for all frequencies from 100 Hz to 1 MHz.

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TYPE Conference Poster YEAR 2017

DOI OSTI Scopus

Ultrafast reverse recovery time measurement for wide-bandgap diodes

IEEE Transactions on Power Electronics

Mauch, Daniel L.; Zutavern, Fred J.; Delhotal, Jarod J.; King, Michael P.; Neely, Jason C.; Kizilyalli, Isik C.; Kaplar, Robert J.

A system is presented that is capable of measuring subnanosecond reverse recovery times of diodes in wide-bandgap materials over a wide range of forward biases (0 - 1 A) and reverse voltages (0 - 10 kV). The system utilizes the step recovery technique and comprises a cable pulser based on a silicon (Si) Photoconductive Semiconductor Switch (PCSS) triggered with an Ultrashort Pulse Laser, a pulse charging circuit, a diode biasing circuit, and resistive and capacitive voltage monitors. The PCSS-based cable pulser transmits a 130 ps rise time pulse down a transmission line to a capacitively coupled diode, which acts as the terminating element of the transmission line. The temporal nature of the pulse reflected by the diode provides the reverse recovery characteristics of the diode, measured with a high bandwidth capacitive probe integrated into the cable pulser. This system was used to measure the reverse recovery times (including the creation and charging of the depletion region) for two Avogy gallium nitride diodes; the initial reverse recovery time was found to be 4 ns and varied minimally over reverse biases of 50-100 V and forward current of 1-100 mA.

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TYPE Journal Article YEAR 2017

DOI OSTI Scopus