Mudstone mechanical testing is often limited by poor core recovery and sample size, preservation and preparation issues, which can lead to sampling bias, damage, and time-dependent effects. A micropillar compression technique, originally developed by Uchic et al. 2004, here is applied to elasto-plastic deformation of small volumes of mudstone, in the range of cubic microns. This study examines behavior of the Gothic shale, the basal unit of the Ismay zone of the Pennsylvanian Paradox Formation and potential shale gas play in southeastern Utah, USA. Precision manufacture of micropillars 5 microns in diameter and 10 microns in length are prepared using an ion-milling method. Characterization of samples is carried out using: dual focused ion - scanning electron beam imaging of nano-scaled pores and distribution of matrix clay and quartz, as well as pore-filling organics; laser scanning confocal (LSCM) 3D imaging of natural fractures; and gas permeability, among other techniques. Compression testing of micropillars under load control is performed using two different nanoindenter techniques. Deformation of 0.5 cm in diameter by 1 cm in length cores is carried out and visualized by a microscope loading stage and laser scanning confocal microscopy. Axisymmetric multistage compression testing and multi-stress path testing is carried out using 2.54 cm plugs. Discussion of results addresses size of representative elementary volumes applicable to continuum-scale mudstone deformation, anisotropy, and size-scale plasticity effects. Other issues include fabrication-induced damage, alignment, and influence of substrate.
Shock testing was performed on a selected commercial-off-the-shelf - MicroElectroMechanical System (COTS-MEMS) accelerometer to determine the margin between the published absolute maximum rating for shock and the 'measured' level where failures are observed. The purpose of this testing is to provide baseline data for isolating failure mechanisms under shock and environmental loading in a representative device used or under consideration for use within systems and assemblies of the DOD/DOE weapons complex. The specific device chosen for this study was the AD22280 model of the ADXL78 MEMS Accelerometer manufactured by Analog Devices Inc. This study focuses only on the shock loading response of the device and provides the necessary data for adding influence of environmental exposure to the reliability of this class of devices. The published absolute maximum rating for acceleration in any axis was 4000 G for this device powered or unpowered. Results from this study showed first failures at 8000 G indicating a margin of error of two. Higher shock level testing indicated that an in-plane, but off-axis acceleration was more damaging than one in the sense direction.
Shape memory alloys (SMAs) are metals that exhibit large recoverable strains and exert large forces with tremendous energy densities. The behavior of SMAs is thermomechanically coupled. Their response to temperature is sensitive to their loading condition and their response to loading is sensitive to their thermal condition. This coupled behavior is not to be circumvented, but to be confronted and understood, since it is what manifests SMA's superior clamping performance. To reasonably characterize the coupled behavior of SMA clamping rings used in safety mechanisms, we conduct a series of experiments on SMA samples. The results of the tests will allow increased fidelity in modeling and failure analysis of parts.
Instrumented indentation has yielded mixed results when used to measure surface residual stresses in metal films. Relative to metals, many glasses and ceramics have a low modulus-to-yield strength (E/σ y) ratio. The advantage of this characteristic for measuring residual stress using instrumented indentation is demonstrated by a series of comparative spherical and conical tip finite element simulations. Two cases are considered: (i) a material with E/σ y= 24 - similar to glass and (ii) a material with E /σy = 120 - similar to metal films. In both cases, compressive residual stress shifts the simulated load-displacement response toward increasing hardness, irrespective of tip geometry. This shift is shown to be entirely due to pile up for the "metal" case, but primarily due to the direct influence of the residual stress for the "glass" case. Hardness changes and load-displacement curve shifts are explained by using the spherical cavity model. Supporting experimental results on stressed glasses are provided.
Instrumented indentation has yielded mixed results when used to measure surface residual stresses in metal films. Relative to metals, many glasses and ceramics have a low modulus-to-yield strength (E/sy) ratio. The advantage of this characteristic for measuring residual stress using instrumented indentation is demonstrated by a series of comparative spherical and conical tip finite element simulations. Two cases are considered: (i) a material with E/s{sub y} = 24-similar to glass and (ii) a material with E/s{sub y} = 120-similar to metal films. In both cases, compressive residual stress shifts the simulated load-displacement response toward increasing hardness, irrespective of tip geometry. This shift is shown to be entirely due to pile up for the ''metal'' case, but primarily due to the direct influence of the residual stress for the ''glass'' case. Hardness changes and load-displacement curve shifts are explained by using the spherical cavity model. Supporting experimental results on stressed glasses are provided.
The ability to integrate metal and semiconductor micro-systems to perform highly complex functions, such as RF-MEMS, will depend on developing freestanding metal structures that offer improved conductivity, reflectivity, and mechanical properties. Three issues have prevented the proliferation of these systems: (1) warpage of active components due to through-thickness stress gradients, (2) limited component lifetimes due to fatigue, and (3) low yield strength. To address these issues, we focus on developing and implementing techniques to enable the direct study of the stress and microstructural evolution during electrodeposition and mechanical loading. The study of stress during electrodeposition of metal thin films is being accomplished by integrating a multi-beam optical stress sensor into an electrodeposition chamber. By coupling the in-situ stress information with ex-situ microstructural analysis, a scientific understanding of the sources of stress during electrodeposition will be obtained. These results are providing a foundation upon which to develop a stress-gradient-free thin film directly applicable to the production of freestanding metal structures. The issues of fatigue and yield strength are being addressed by developing novel surface micromachined tensile and bend testers, by interferometry, and by TEM analysis. The MEMS tensile tester has a ''Bosch'' etched hole to allow for direct viewing of the microstructure in a TEM before, during, and after loading. This approach allows for the quantitative measurements of stress-strain relations while imaging dislocation motion, and determination of fracture nucleation in samples with well-known fatigue/strain histories. This technique facilitates the determination of the limits for classical deformation mechanisms and helps to formulate a new understanding of the mechanical response as the grain sizes are refined to a nanometer scale. Together, these studies will result in a science-based infrastructure to enhance the production of integrated metal--semiconductor systems and will directly impact RF MEMS and LIGA technologies at Sandia.
Micromachines have the potential to significantly impact future weapon component designs as well as other defense, industrial, and consumer product applications. For both electroplated (LIGA) and surface micromachined (SMM) structural elements, the influence of processing on structure, and the resultant effects on material properties are not well understood. The behavior of dynamic interfaces in present as-fabricated microsystem materials is inadequate for most applications and the fundamental relationships between processing conditions and tribological behavior in these systems are not clearly defined. We intend to develop a basic understanding of deformation, fracture, and surface interactions responsible for friction and wear of microelectromechanical system (MEMS) materials. This will enable needed design flexibility for these devices, as well as strengthen our understanding of material behavior at the nanoscale. The goal of this project is to develop new capabilities for sub-microscale mechanical and tribological measurements, and to exercise these capabilities to investigate material behavior at this size scale.
The purpose of microstructural control is to optimize materials properties. To that end, they have developed sophisticated and successful computational models of both microstructural evolution and mechanical response. However, coupling these models to quantitatively predict the properties of a given microstructure poses a challenge. This problem arises because most continuum response models, such as finite element, finite volume, or material point methods, do not incorporate a real length scale. Thus, two self-similar polycrystals have identical mechanical properties regardless of grain size, in conflict with theory and observations. In this project, they took a tiered risk approach to incorporate microstructure and its resultant length scales in mechanical response simulations. Techniques considered include low-risk, low-benefit methods, as well as higher-payoff, higher-risk methods. Methods studied include a constitutive response model with a local length-scale parameter, a power-law hardening rate gradient near grain boundaries, a local Voce hardening law, and strain-gradient polycrystal plasticity. These techniques were validated on a variety of systems for which theoretical analyses and/or experimental data exist. The results may be used to generate improved constitutive models that explicitly depend upon microstructure and to provide insight into microstructural deformation and failure processes. Furthermore, because mechanical state drives microstructural evolution, a strain-enhanced grain growth model was coupled with the mechanical response simulations. The coupled model predicts both properties as a function of microstructure and microstructural development as a function of processing conditions.
This report summarizes materials issues associated with advanced micromachines development at Sandia. The intent of this report is to provide a perspective on the scope of the issues and suggest future technical directions, with a focus on computational materials science. Materials issues in surface micromachining (SMM), Lithographic-Galvanoformung-Abformung (LIGA: lithography, electrodeposition, and molding), and meso-machining technologies were identified. Each individual issue was assessed in four categories: degree of basic understanding; amount of existing experimental data capability of existing models; and, based on the perspective of component developers, the importance of the issue to be resolved. Three broad requirements for micromachines emerged from this process. They are: (1) tribological behavior, including stiction, friction, wear, and the use of surface treatments to control these, (2) mechanical behavior at microscale, including elasticity, plasticity, and the effect of microstructural features on mechanical strength, and (3) degradation of tribological and mechanical properties in normal (including aging), abnormal and hostile environments. Resolving all the identified critical issues requires a significant cooperative and complementary effort between computational and experimental programs. The breadth of this work is greater than any single program is likely to support. This report should serve as a guide to plan micromachines development at Sandia.
Computational materials simulations have traditionally focused on individual phenomena: grain growth, crack propagation, plastic flow, etc. However, real materials behavior results from a complex interplay between phenomena. In this project, the authors explored methods for coupling mesoscale simulations of microstructural evolution and micromechanical response. In one case, massively parallel (MP) simulations for grain evolution and microcracking in alumina stronglink materials were dynamically coupled. In the other, codes for domain coarsening and plastic deformation in CuSi braze alloys were iteratively linked. this program provided the first comparison of two promising ways to integrate mesoscale computer codes. Coupled microstructural/micromechanical codes were applied to experimentally observed microstructures for the first time. In addition to the coupled codes, this project developed a suite of new computational capabilities (PARGRAIN, GLAD, OOF, MPM, polycrystal plasticity, front tracking). The problem of plasticity length scale in continuum calculations was recognized and a solution strategy was developed. The simulations were experimentally validated on stockpile materials.
The behavior of MEMS devices is limited by the strength of critical features such as thin ligaments, oxide cuts joining layers, pin joints and hinges. Devices fabricated at Sandia's Microelectronic Development Laboratory have been successfully tested to investigate these features. A series of measurements were performed on samples with gage lengths of 15 to 1000 microns, using conventional and tungsten coated samples as well as samples that include the critical features of standard components in the test section. Specimens have a freely moving pin joint on one end that anchors the sample to the silicon die to allow rotation to reduce effects of bending. Each sample is loaded in uniaxial tension by pulling laterally with a flat tipped diamond in a computer-controlled Nanoindenter. Load is calculated by resolving the measured lateral and normal forces into the applied tensile force and frictional losses. The specimen cross section and gage length dimensions were verified by measuring against a standard in the SEM. Multiple tests can be programmed at one time and performed without operator assistance allowing the collection of significant populations of data.
Direct metal deposition technologies produce complex, near net shape components from Computer Aided Design (CAD) solid models. Most of these techniques fabricate a component by melting powder in a laser weld pool, rastering the weld bead to form a layer, and additively constructing subsequent layers. This report will describe anew direct metal deposition process, known as WireFeed, whereby a small diameter wire is used instead of powder as the feed material to fabricate components. Currently, parts are being fabricated from stainless steel alloys. Microscopy studies show the WireFeed parts to be filly dense with fine microstructural features. Mechanical tests show stainless steel parts to have high strength values with retained ductility. A model was developed to simulate the microstructural evolution and coarsening during the WireFeed process. Simulations demonstrate the importance of knowing the temperature distribution during fabrication of a WireFeed part. The temperature distribution influences microstructural evolution and, therefore, must be controlled to tailor the microstructure for optimal performance.
LIGA fabricated materials and components exhibit several processing issues affecting their metallurgical and mechanical properties, potentially limiting their usefulness for MEMS applications. For example, LIGA processing by metal electrodeposition is very sensitive to deposition conditions which causes significant processing lot variations of mechanical and metallurgical properties. Furthermore, the process produces a material with a highly textured lenticular rnicrostructural morphology suggesting an anisotropic material response. Understanding and controlling out-of-plane anisotropy is desirable for LIGA components designed for out-of-plane flexures. Previous work by the current authors focused on results from a miniature servo-hydraulic mechanical test frame constructed for characterizing LIGA materials. Those results demonstrated microstructural and mechanical properties dependencies with plating bath current density in LIGA fabricated nickel (LIGA Ni). This presentation builds on that work and fosters a methodology for controlling the properties of LIGA fabricated materials through processing. New results include measurement of mechanical properties of LIGA fabricated copper (LIGA Cu), out-of-plane and localized mechanical property measurements using compression testing and nanoindentation of LIGA Ni and LIGA Cu.