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Creep behavior of a Sn-Ag-Bi Pb-free solder

Materials

Vianco, Paul; Rejent, Jerome A.; Grazier, J.M.; Kilgo, Alice C.

Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: -25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air aging conditions: 24 hours at either 125 °C or 150 °C. The strain-time curves exhibited frequent occurrences of negative creep and small-scale fluctuations, particularly at the slower strain rates, that were indicative of dynamic recrystallization (DRX) activity. The source of tertiary creep behavior at faster strain rates was likely to also be DRX rather than a damage accumulation mechanism. Overall, the strain-time curves did not display a consistent trend that could be directly attributed to the aging condition. The sinh law equation satisfactorily represented the minimum strain rate as a function of stress and temperature so as to investigate the deformation rate kinetics: dε/dtmin = Asinhn (ασ) exp (-ΔH/RT). The values of α, n, and ΔH were in the following ranges (±95% confidence interval): α, 0.010-0.015 (±0.005 1/MPa); n, 2.2-3.1 (±0.5); and ΔH, 54-66 (±8 kJ/mol). The rate kinetics analysis indicated that short-circuit diffusion was a contributing mechanism to dislocation motion during creep. The rate kinetics analysis also determined that a minimum creep rate trend could not be developed between the as-fabricated versus aged conditions. This study showed that the elevated temperature aging treatments introduced multiple changes to the Sn-Ag-Bi microstructure that did not result in a simple loss ("softening") of its mechanical strength. © 2012 by Sandia Corporation.

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TYPE Journal Article YEAR 2012
ScopusOSTIDOI

An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

Vianco, Paul T.; Kilgo, Alice C.; Zender, Gary L.; Rejent, Jerome A.; Grazier, J.M.

The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in inconsistent proportions of metal and glassy phase particles present during the subsequent firing process. The consequences were subtle, intermittent changes to the thick film microstructure that gave rise to the reaction layer and, thus, the low pull strength phenomenon. A mitigation strategy would be the use of physical vapor deposition (PVD) techniques to create thin film bond pads; this is multi-chip module, deposited (MCM-D) technology.

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TYPE SAND Report YEAR 2008
OSTIDOI

The mechanics of soft biological composites

Boyce, Brad B.; Grazier, J.M.

Biological tissues are uniquely structured materials with technologically appealing properties. Soft tissues such as skin, are constructed from a composite of strong fibrils and fluid-like matrix components. This was the first coordinated experimental/modeling project at Sandia or in the open literature to consider the mechanics of micromechanically-based anisotropy and viscoelasticity of soft biological tissues. We have exploited and applied Sandia's expertise in experimentation and mechanics modeling to better elucidate the behavior of collagen fibril-reinforced soft tissues. The purpose of this project was to provide a detailed understanding of the deformation of ocular tissues, specifically the highly structured skin-like tissue in the cornea. This discovery improved our knowledge of soft/complex materials testing and modeling. It also provided insight into the way that cornea tissue is bio-engineered such that under physiologically-relevant conditions it has a unique set of properties which enhance functionality. These results also provide insight into how non-physiologic loading conditions, such as corrective surgeries, may push the cornea outside of its natural design window, resulting in unexpected non-linear responses. Furthermore, this project created a clearer understanding of the mechanics of soft tissues that could lead to bio-inspired materials, such as highly supple and impact resistant body armor, and improve our design of human-machine interfaces, such as micro-electrical-mechanical (MEMS) based prosthetics.

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TYPE SAND Report YEAR 2007
OSTIDOI

Mechanical properties and shear failure surfaces of two alumina powders in triaxial compression

Journal of Materials Science

Zeuch, David H.; Grazier, J.M.; Arguello, Jose G.; Ewsuk, Kevin G.

In the manufacture of ceramic components, near-net-shape parts are commonly formed by uniaxially pressing granulated powders in rigid dies. Density gradients that are introduced into a powder compact during press-forming often increase the cost of manufacturing, and can degrade the performance and reliability of the finished part. Finite element method (FEM) modeling can be used to predict powder compaction response, and can provide insight into the causes of density gradients in green powder compacts; however, accurate numerical simulations require accurate material properties and realistic constitutive laws. To support an effort to implement an advanced cap plasticity model within the finite element framework to realistically simulate powder compaction, the authors have undertaken a project to directly measure as many of the requisite powder properties for modeling as possible. A soil mechanics approach has been refined and used to measure the pressure dependent properties of ceramic powders up to 68.9 MPa (10,000 psi). Due to the large strains associated with compacting low bulk density ceramic powders, a two-stage process was developed to accurately determine the pressure-density relationship of a ceramic powder in hydrostatic compression, and the properties of that same powder compact under deviatoric loading at the same specific pressures. Using this approach, the seven parameters that are required for application of a modified Drucker-Prager cap plasticity model were determined directly. The details of the experimental techniques used to obtain the modeling parameters and the results for two different granulated alumina powders are presented.

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TYPE Journal Article YEAR 2000
OSTI
Results 1–25 of 26
Results 1–25 of 26