Characterizing Electrical Device Behavior with Functional Tolerance Bounds
Abstract not provided.
Publications
Tolerance Bound Calculation for Compact Model Calibration Using Functional Data Analysis
4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
Measurements performed on a population of electronic devices reveal part-to-part variation due to manufacturing process variation. Corner models are a useful tool for the designers to bound the effect of this variation on circuit performance. To accurately simulate the circuit level behavior, compact model parameters for devices within a circuit must be calibrated to experimental data. However, determination of the bounding data for corner model calibration is difficult, primarily because available tolerance bound calculation methods only consider variability along one dimension and, do not adequately consider the variabilities across both the current and voltage axes. This paper presents the demonstration of a novel functional data analysis approach to generate tolerance bounds on these two types of variability separately and these bounds are then transformed to be used in corner model calibration.
Tolerance Bound Calculation for Compact Model Calibration Using Functional Data Analysis
Abstract not provided.
Selection of a nominal device using functional data analysis
Proceedings - 2018 IEEE 5th International Conference on Data Science and Advanced Analytics, DSAA 2018
Nominal behavior selection of an electronic device from a measured dataset is often difficult. Device characteristics are rarely monotonic and choosing the single device measurement which best represents the center of a distribution across all regions of operation is neither obvious nor easy to interpret. Often, a device modeler uses a degree of subjectivity when selecting nominal device behavior from a dataset of measurements on a group of devices. This paper proposes applying a functional data approach to estimate the mean and nominal device of an experimental dataset. This approach was applied to a dataset of electrical measurements on a set of commercially available Zener diodes and proved to more accurately represent the average device characteristics than a point-wise calculation of the mean. It also enabled an objective method for selecting a nominal device from a dataset of device measurements taken across the full operating region of the Zener diode.
Multiscale Modeling of Total Ionizing Dose Effects in Commercial-off-the-Shelf Parts in Bipolar Technologies
IEEE Transactions on Nuclear Science
A multiscale modeling platform that supports the 'virtual' qualification of commercial-off-the-shelf parts is presented. The multiscale approach is divided into two modules. The first module generates information related to the bipolar junction transistor gain degradation that is a function of fabrication process, operational, and environmental inputs. The second uses this information as inputs for radiation-enabled circuit simulations. The prototype platform described in this paper estimates the total ionizing dose and dose rate responses of linear bipolar integrated circuits for different families of components. The simulation and experimental results show good correlation and suggest this platform to be a complementary tool within the radiation-hardness assurance flow. The platform may reduce some of the costly reliance on testing for all systems.
COTS Device Reliability Technical Update: Joint Munitions Program TCG-XIV ? Munitions Reliability and Lifecycle Technology
Abstract not provided.
Selection of a Nominal Device Using Functional Data Analysis
Abstract not provided.
Device Reliability TCG-XIV ? Munitions Reliability and Lifecycle Technology - Spring update
Abstract not provided.
Zener Diode Compact Model Parameter Extraction Using Xyce-Dakota Optimization
This report presents a detailed process for compact model parameter extraction for DC circuit Zener diodes. Following the traditional approach of Zener diode parameter extraction, circuit model representation is defined and then used to capture the different operational regions of a real diode's electrical behavior. The circuit model contains 9 parameters represented by resistors and characteristic diodes as circuit model elements. The process of initial parameter extraction, the identification of parameter values for the circuit model elements, is presented in a way that isolates the dependencies between certain electrical parameters and highlights both the empirical nature of the extraction and portions of the real diode physical behavior which of the parameters are intended to represent. Optimization of the parameters, a necessary part of a robost parameter extraction process, is demonstrated using a 'Xyce-Dakota' workflow, discussed in more detail in the report. Among other realizations during this systematic approach of electrical model parameter extraction, non-physical solutions are possible and can be difficult to avoid because of the interdependencies between the different parameters. The process steps described are fairly general and can be leveraged for other types of semiconductor device model extractions. Also included in the report are recommendations for experiment setups for generating optimum dataset for model extraction and the Parameter Identification and Ranking Table (PIRT) for Zener diodes.
Validation Assessment of a Glass-to-Metal Seal Finite-Element Model
Sealing glasses are ubiquitous in high pressure and temperature engineering applications, such as hermetic feed-through electrical connectors. A common connector technology are glass-to-metal seals where a metal shell compresses a sealing glass to create a hermetic seal. Though finite-element analysis has been used to understand and design glass-to-metal seals for many years, there has been little validation of these models. An indentation technique was employed to measure the residual stress on the surface of a simple glass-to-metal seal. Recently developed rate- dependent material models of both Schott 8061 and 304L VAR stainless steel have been applied to a finite-element model of the simple glass-to-metal seal. Model predictions of residual stress based on the evolution of material models are shown. These model predictions are compared to measured data. Validity of the finite- element predictions is discussed. It will be shown that the finite-element model of the glass-to-metal seal accurately predicts the mean residual stress in the glass near the glass-to-metal interface and is valid for this quantity of interest.
Stress Mapping in Glass-to-Metal Seals using Indentation Crack Lengths
Abstract not provided.
Stress Mapping in Glass-to-Metal Seals using Indentation Crack Lengths
Predicting the residual stress which develops during fabrication of a glass-to-metal compression seal requires material models that can accurately predict the effects of processing on the sealing glass. Validation of the predictions requires measurements on representative test geometries to accurately capture the interaction between the seal materials during a processing cycle required to form the seal, which consists of a temperature excursion through the glass transition temperature of the sealing glass. To this end, a concentric seal test geometry, referred to as a short cylinder seal, consisting of a stainless steel shell enveloping a commercial sealing glass disk has been designed, fabricated, and characterized as a model validation test geometry. To obtain data to test/validate finite element (FE) stress model predictions of this geometry, spatially-resolved residual stress was calculated from the measured lengths of the cracks emanating from radially positioned Vickers indents in the glass disk portion of the seal. The indentation crack length method is described, and the spatially-resolved residual stress determined experimentally are compared to FE stress predictions made using a nonlinear viscoelastic material model adapted to inorganic sealing glasses and an updated rate dependent material model for 304L stainless steel. The measurement method is a first to achieve a degree of success for measuring spatially resolved residual stress in a glass-bearing geometry and a favorable comparison between measurements and simulation was observed.
Power Spectrum Analysis (PSA)
Abstract not provided.
Characterizing and Predicting Stress and Structural Relaxation in Glass
Abstract not provided.
Full stress tensor measurement using fluorescence spectroscopy
Abstract not provided.
Charcterization and Modeling of Microstructural level Stresses in Brittle Materials
Abstract not provided.
Stress Mapping in Glass-to-Metal Seals using Indentation Crack Length Measurements
Abstract not provided.
Full stress tensor measurement using flourescence spectroscopy
Abstract not provided.
Power spectrum analysis (PSA)
Conference Proceedings from the International Symposium for Testing and Failure Analysis
We present a new, non-destructive electrical technique, Power Spectrum Analysis (PSA). PSA as described here uses off-normal biasing, an unconventional way of powering microelectronics devices. PSA with off-normal biasing can be used to detect subtle differences between microelectronic devices. These differences, in many cases, cannot be detected by conventional electrical testing. In this paper, we highlight PSA applications related to aging and counterfeit detection.
Characterization of residual stress at the microscale using photoluminescence spectroscopy
Abstract not provided.
Micro-structural Stress Modeling of Brittle Materials for Enhanced Performance and Reliability
Abstract not provided.
Predicting Fragmentation of Ion-Exchanged Glass
Abstract not provided.
Micro-structural Stress Modeling of Brittle Materials for Enhanced Performance and Reliability
Abstract not provided.
Quantifying Grain-Scale Deformation for Direct Comparison to Crystal
Abstract not provided.
EXPERIMENTAL DATA UNCERTAINTY CALIBRATION AND VALIDATION OF A VISCOELASTIC POTENTIAL ENERGY CLOCK MODEL FOR INORGANIC SEALING GLASSES
Abstract not provided.
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