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SOI substrate removal for SEE characterization: Techniques and applications

IEEE Transactions on Nuclear Science

Shaneyfelt, Marty R.; Schwank, James R.; Dodd, Paul E.; Stevens, Jeffrey S.; Vizkelethy, Gyorgy V.; Swanson, Scot E.

Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated. © 2012 IEEE.

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Simulation of ion beam induced current in radiation detectors and microelectronic devices

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Vizkelethy, Gyorgy V.

Ion Beam Induced Charge (IBIC) is the basic mechanism of the operation of semiconductor detectors and it can lead to Single Event Effects (SEEs) in microelectronic devices. To be able to predict SEEs in ICs and detector responses one needs to be able to simulate the radiation-induced current as the function of time on the electrodes of the devices and detectors. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. Technology Computer Aided Design (TCAD) programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. Here a simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework, version 3.5. In the model, the induced current can be calculated both directly and in certain cases using the powerful adjoint method. A brief description of the model will be given in the paper with examples for detectors and microelectronic devices using both the direct and the adjoint method.

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Results 126–150 of 175
Results 126–150 of 175