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SOI substrate removal for SEE characterization: Techniques and applications

IEEE Transactions on Nuclear Science

Shaneyfelt, Marty R.; Schwank, James R.; Dodd, Paul E.; Stevens, Jeffrey; Vizkelethy, Gyorgy; Swanson, Scot E.

Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated. © 2012 IEEE.

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TYPE Conference YEAR 2012
OSTIScopus

Simulation of ion beam induced current in radiation detectors and microelectronic devices

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Vizkelethy, Gyorgy

Ion Beam Induced Charge (IBIC) is the basic mechanism of the operation of semiconductor detectors and it can lead to Single Event Effects (SEEs) in microelectronic devices. To be able to predict SEEs in ICs and detector responses one needs to be able to simulate the radiation-induced current as the function of time on the electrodes of the devices and detectors. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. Technology Computer Aided Design (TCAD) programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. Here a simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework, version 3.5. In the model, the induced current can be calculated both directly and in certain cases using the powerful adjoint method. A brief description of the model will be given in the paper with examples for detectors and microelectronic devices using both the direct and the adjoint method.

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TYPE Conference YEAR 2011
OSTIScopus

Simulation of ion beam induced current in radiation detectors and microelectronic devices

Vizkelethy, Gyorgy

Ionizing radiation is known to cause Single Event Effects (SEE) in a variety of electronic devices. The mechanism that leads to these SEEs is current induced by the radiation in these devices. While this phenomenon is detrimental in ICs, this is the basic mechanism behind the operation of semiconductor radiation detectors. To be able to predict SEEs in ICs and detector responses we need to be able to simulate the radiation induced current as the function of time. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. On the other end, TCAD programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. A simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework.

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TYPE SAND Report YEAR 2009
DOIOSTI

Radiation microscope for SEE testing using GeV ions

Vizkelethy, Gyorgy; Villone, Janelle; Hattar, Khalid M.; Doyle, B.L.; Knapp, J.A.

Radiation Effects Microscopy is an extremely useful technique in failure analysis of electronic parts used in radiation environment. It also provides much needed support for development of radiation hard components used in spacecraft and nuclear weapons. As the IC manufacturing technology progresses, more and more overlayers are used; therefore, the sensitive region of the part is getting farther and farther from the surface. The thickness of these overlayers is so large today that the traditional microbeams, which are used for REM are unable to reach the sensitive regions. As a result, higher ion beam energies have to be used (> GeV), which are available only at cyclotrons. Since it is extremely complicated to focus these GeV ion beams, a new method has to be developed to perform REM at cyclotrons. We developed a new technique, Ion Photon Emission Microscopy, where instead of focusing the ion beam we use secondary photons emitted from a fluorescence layer on top of the devices being tested to determine the position of the ion hit. By recording this position information in coincidence with an SEE signal we will be able to indentify radiation sensitive regions of modern electronic parts, which will increase the efficiency of radiation hard circuits.

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TYPE SAND Report YEAR 2009
DOIOSTI
Results 151–175 of 189
Results 151–175 of 189