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Simulation and Design of Step-Etched Junction Termination Extensions for GaN Power Diodes

4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings

Dickerson, Jeramy R.; Binder, Andrew B.; Pickrell, Gregory P.; Gunning, Brendan P.; Kaplar, Robert K.

Proper edge termination is required to reach large blocking voltages in vertical power devices. Limitations in selective area p-type doping in GaN restrict the types of structures that can be used for this purpose. A junction termination extension (JTE) can be employed to reduce field crowding at the junction periphery where the charge in the JTE is designed to sink the critical electric field lines at breakdown. One practical way to fabricate this structure in GaN is by a step-etched single-zone or multi-zone JTE where the etch depths and doping levels are used to control the charge in the JTE. The multi-zone JTE is beneficial for increasing the process window and allowing for more variability in parameter changes while still maintaining a designed percentage of the ideal breakdown voltage. Impact ionization parameters reported in literature for GaN are compared in a simulation study to ascertain the dependence on breakdown performance. Two 3-zone JTE designs utilizing different impact ionization coefficients are compared. Simulations confirm that the choice of impact ionization parameters affects both the predicted breakdown of the device as well as the fabrication process variation tolerance for a multi-zone JTE. Regardless of the impact ionization coefficients utilized, a step-etched JTE has the potential to provide an efficient, controllable edge termination design.

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TYPE Conference Poster YEAR 2020
OSTIScopus

ITRW: Formulating a Roadmap for WBG and UWBG Materials and Devices

Veliadis, Victor; Kaplar, Robert K.; Zhang, Jon; Khalil, Sameh; Flicker, Jack D.; Neely, Jason C.; Binder, Andrew B.; Atcitty, Stanley A.; Moens, Peter; Bakowski, Mietek; Hollis, Mark

The purpose of the International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) Materials and Devices Working Group, which considers the materials science of Wide-and Ultra-Wide-Band-Gap (WBG and UWBG) semiconductors, in addition to device design, fabrication, and evaluation, is to formulate a long-term, international roadmap for WBG and UWBG materials and devices, consistent with the packaging and applications working groups of ITRW. The working group is co-chaired by Victor Veliadis (primarily representing silicon carbide (SiC) and related materials) and Robert Kaplar (primarily representing gallium nitride (GaN) and related materials, as well as emerging ultra-WBGs) and is split into four sub-working-groups, which are: 1) SiC materials and devices (co-chairs Jon Zhang and Mietek Bakowski). 2) Lateral GaN materials and devices (co-chairs Sameh Khalil and Peter Moens). 3) Vertical GaN materials and devices (co-chairs TBD). 4) Emerging UWBG materials and devices (co-chairs Mark Hollis). The first two subgroups represent technology that is far more mature than that of the latter two, and devices are available as commercial products in power applications. The primary focus of this article will be on developments in subgroups 1 and 2, with only brief descriptions of the latter two sub-groups, including future activities as they mature technologically.

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TYPE Other Report YEAR 2019
DOIOSTI
Results 51–71 of 71
Results 51–71 of 71