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Wafer-level packaging of aluminum nitride RF MEMS filters

Proceedings - Electronic Components and Technology Conference

Henry, Michael D.; Young, Travis R.; Hollowell, Andrew E.; Eichenfield, Matthew S.; Olsson, Roy H.

Aluminum nitride (AlN) radio frequency (RF) MEMS filters utilize piezoelectric coupling for high-performance electrical filters with frequency diversity in a small form factor. Furthermore, the compatibility of AlN with CMOS fabrication makes AlN extremely attractive from a commercial standpoint. A technological hurdle has been the ability to package these suspended resonator devices at a wafer level with high yield. In this work, we describe wafer-level packaging (WLP) of AlN MEMS RF filters in an all silicon package with solder balls on nickel vanadium / gold (NiV/Au) bond pads that are subsequently ready for flip chip bonding. For this integration scheme, we utilize a 150 mm device wafer, fabricated in a CMOS foundry, and bond at the wafer level to a cavity silicon wafer, which hermetically encapsulates each device. The cavity wafer is then uniformly plasma etched back using a deep reactive ion etcher resulting in a 100 μm thick hermetic silicon lid encapsulating each die, balled with 250 μm 90/10 Pb/Sn solder balls and finally diced into individually packaged dies. Each die can be frequency-trimmed to an exact frequency by rapid temperature annealing the stress of the metallization layers of each resonator. The resulting technology yields a completely packaged wafer of 900 encapsulated die (14 mm2 by 800 μm thick) with multiple resonators and filters at various frequencies in each package.

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TYPE Conference Poster YEAR 2015
OSTIScopus

Micro-fabricated ion traps for Quantum Information Processing

Maunz, Peter L.; Hollowell, Andrew E.; Lobser, Daniel L.; Nordquist, Christopher N.; Benito, Francisco M.; Clark, Craig R.; Clark, Susan M.; Colombo, Anthony P.; Fortier, Kevin M.; Haltli, Raymond A.; Heller, Edwin J.; Resnick, Paul J.; Rembetski, John F.; Sterk, Jonathan D.; Stick, Daniel L.; Tabakov, Boyan T.; Tigges, Chris P.; Van Der Wall, Jay W.; Dagel, Amber L.; Blain, Matthew G.; Scrymgeour, David S.

Abstract not provided.

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TYPE Presentation YEAR 2015
OSTI

Scalable micro-fabricated ion traps for Quantum Information Processing

Maunz, Peter L.; Benito, Francisco M.; Berry, Christopher W.; Blain, Matthew G.; Haltli, Raymond A.; Clark, Craig R.; Clark, Susan M.; Heller, Edwin J.; Hollowell, Andrew E.; Mizrahi, Jonathan; Nordquist, Christopher N.; Resnick, Paul J.; Rembetski, John F.; Scrymgeour, David S.; Sterk, Jonathan D.; Tabakov, Boyan T.; Tigges, Chris P.; Van Der Wall, Jay W.; Dagel, Amber L.

Abstract not provided.

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TYPE Presentation YEAR 2015
OSTI

Sandia Micro-fabricated Ion Traps for the MUSIQC architecture

Maunz, Peter L.; Heller, Edwin J.; Hollowell, Andrew E.; Kemme, S.A.; Loviza, Becky G.; Mizrahi, Jonathan A.; Ortega, Anathea C.; Scrymgeour, David S.; Sterk, Jonathan D.; Tigges, Chris P.; Dagel, Amber L.; Clark, Craig R.; Stick, Daniel L.; Blain, Matthew G.; Clark, Susan M.; Resnick, Paul J.; Arrington, Christian L.; Benito, Francisco M.; Boye, Robert B.; Ellis, A.R.; Haltli, Raymond A.

Abstract not provided.

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TYPE Conference YEAR 2013
OSTI
Results 76–95 of 95
Results 76–95 of 95