Product designs from a wide range of industries such as aerospace, automotive, biomedical, and others can benefit from new metamaterials for mechanical energy dissipation. In this study, we explore a novel new class of metamaterials with unit cells that absorb energy via sliding Coulombic friction. Remarkably, even materials such as metals and ceramics, which typically have no intrinsic reversible energy dissipation, can be architected to provide dissipation akin to elastomers. The concept is demonstrated at different scales (centimeter to micrometer), with different materials (metal and polymer), and in different operating environments (high and low temperatures), all showing substantial dissipative improvements over conventional non-contacting lattice unit cells. Further, as with other ‘programmable’ metamaterials, the degree of Coulombic absorption can be tailored for a given application. An analytic expression is derived to allow rapid first-order optimization. This new class of Coulombic friction energy absorbers can apply broadly to many industrial sectors such as transportation (e.g. monolithic shock absorbers), biomedical (e.g. prosthetics), athletic equipment (e.g. skis, bicycles, etc.), defense (e.g. vibration tolerant structures), and energy (e.g. survivable electrical grid components).
The first batches of ion traps patterned and coated were processed per the standard 3-step clean, air fire, and metallization processes. The third or fourth lot using this process resulted in poorly adhering metallization. Up until this point, the standard process was used to metallize and pattern ceramic ion traps without fail. At about the 4th batch of parts something changed. After the 5th batch, the ceramic ion traps received generally came with some unknown contamination that does not come off in a standard 3-step clean (Lenium Vapor Degreaser, Acetone, IPA) and air fire (860C for 1 hour) for which this process removes the vast majority of all contamination for most ceramic metallization. This is highly unusual. Using HF + Boiling H2O2 is extreme for cleaning the ceramic ion traps. The contamination was never identified and is stubborn to effectively clean. Standard as-fired ceramic should be very easy to clean as if s fired at temperatures greater than 1400°C and not much in terms of contamination should exist at these temperatures, so there must be an intermediate step/process which is imparting this contamination. It is likely a polishing compound or previous polishing contaminant, but also not easily visually distinguishable until after metallization. The halo marks observed on parts might be fingerprints (less likely) or potential polishing marks (more likely) as metallization typically doesn't cover/hide any damage or contamination, but rather quite clearly the opposite, it accentuates it. Blotchy appearances in the metallization usually indicated an adhesion issue. As a result of the fragility of the parts (yield loss due to handling) and difficulty in identifying the contamination during cleaning, we have taken a conservative approach of HF + H2O2 cleaning for all batches after the contamination and adhesion issues were identified.
The reports of 35 J/cc energy density in thinned alkali-free glasses make it a top candidate for next generation high energy density capacitors. In this article, we demonstrate a scalable process to take currently available commercial glass and fabricate fully packaged capacitors. These prototypes have 0.086 J/cc energy density at 1000 V, making them competitive with some commercially available ceramic capacitors. This was achieved while focusing on developing a process for thinning and handling the glass and without minimization of the inactive volume of the capacitor. These results portend the achievement of significantly higher energy densities in devices made from alkali-free glass.
Alkali-free glasses show immense promise for the development of high-energy density capacitors. The high breakdown strengths on single-layer sheets of glass suggest the potential for improved energy densities over existing state-of-the art polymer capacitors. In this paper, we demonstrate the ability to package thin glass to make solid-state capacitors. Individual layers are bonded using epoxy, leading to capacitors that exhibit stable operation over the temperature range -55 °C to +65 °C. This fabrication approach is scalable and allows for proof testing individual layers prior to incorporation of the stack, providing a blueprint for the fabrication of high-energy density capacitors.
We have developed and characterized novel in-situ corrosion sensors to monitor and quantify the corrosive potential and history of localized environments. Embedded corrosion sensors can provide information to aid health assessments of internal electrical components including connectors, microelectronics, wires, and other susceptible parts. When combined with other data (e.g. temperature and humidity), theory, and computational simulation, the reliability of monitored systems can be predicted with higher fidelity.
We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm3 in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, it was sealed with a copper pinch-off and was subsequently pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of 171Y b+. The fractional frequency stability of the clock was measured to be 2 × 10-11/τ1/2.