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Using MRED to Screen Multiple-Node Charge-Collection Mitigated SOI Layouts

IEEE Transactions on Nuclear Science

Black, Jeffrey B.; Dame, Jeff A.; Black, Dolores A.; Dodd, Paul E.; Shaneyfelt, Marty R.; Teifel, John T.; Salas, Joseph G.; Steinbach, Robert; Davis, Matthew; Reed, Robert A.; Weller, Robert A.; Trippe, James M.; Warren, Kevin M.; Tonigan, Andrew M.; Schrimpf, Ronald D.; Marquez, Richard S.

Silicon-on-insulator latch designs and layouts that are robust to multiple-node charge collection are introduced. A general Monte Carlo radiative energy deposition (MRED) approach is used to identify potential single-event susceptibilities associated with different layouts prior to fabrication. MRED is also applied to bound single-event testing responses of standard and dual interlocked cell latch designs. Heavy ion single-event testing results validate new latch designs and demonstrate bounds for standard latch layouts.

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Using MRED to Screen Multiple-Node Charge-Collection Mitigated SOI Layouts

IEEE Transactions on Nuclear Science

Black, Jeffrey B.; Dame, Jeff A.; Black, Dolores A.; Dodd, Paul E.; Shaneyfelt, Marty R.; Teifel, John T.; Salas, Joseph G.; Steinbach, Robert; Davis, Matthew; Reed, Robert A.; Weller, Robert A.; Trippe, James M.; Warren, Kevin M.; Tonigan, Andrew M.; Schrimpf, Ronald D.; Marquez, Richard S.

Silicon-on-insulator latch designs and layouts that are robust to multiple-node charge collection are introduced. A general Monte Carlo radiative energy deposition (MRED) approach is used to identify potential single-event susceptibilities associated with different layouts prior to fabrication. MRED is also applied to bound single-event testing responses of standard and dual interlocked cell latch designs. Heavy ion single-event testing results validate new latch designs and demonstrate bounds for standard latch layouts.

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A quick-turn 3D structured ASIC platform for cost-sensitive applications

Proceedings - Electronic Components and Technology Conference

Teifel, John T.; Flores, Richard S.; Jarecki, Robert L.; Bauer, Todd B.; Shinde, Subhash L.

This paper presents a novel 3D structured ASIC platform that lowers the development effort required to deploy 3D integration technologies in cost sensitive, low-volume applications. The key advantage of this structured 3D ASIC architecture, over custom 3D ASICs, is a fixed vertical interconnect pattern that is programmed by a single 2D metal-via mask, allowing individual die levels to be rapidly designed, fabricated, and assembled. The first silicon realization of this architecture is a 3D-stackable 12×12mm structured ASIC die with 42K interconnects, which is resource compatible with an existing 2D structured ASIC device of the same size. 3D die stacks built using this platform are also intended to be a less costly and more flexible replacement for a large 20×20mm monolithically integrated structured ASIC device. This 3D structured ASIC platform was des igned and fabricated in Sandia's 0.35-μm foundry, and high-density front-end-of-line through silicon vias (TSVs) were developed to implement the 3D vertical interconnects.1 © 2013 IEEE.

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Self-voting dual-modular-redundancy circuits for single-event-transient mitigation

IEEE Transactions on Nuclear Science

Teifel, John T.

Dual-modular-redundancy (DMR) architectures use duplication and self-voting asynchronous circuits to mitigate single event transients (SETs). The area and performance of DMR circuitry is evaluated against conventional triple-modular-redundancy (TMR) logic. Benchmark ASIC circuits designed with DMR logic show a 1024% area improvement for flip-flop designs, and a 33% improvement for latch designs. © 2006 IEEE.

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Asynchronous cryptographic hardware design

Proceedings - International Carnahan Conference on Security Technology

Teifel, John T.

Asynchronous integrated circuit technology provides low-power and low-noise operation for portable electronic security applications. Rather than using a global clock, asynchronous circuits employ a system of distributed handshake signals that control on-chip dataflow; reducing power consumption to only those parts of a chip actively involved in computation. Sandia has developed an automated asynchronous design flow that enables the rapid development of these asynchronous ASICs. This paper describes the design of asynchronous DES encryption circuits using this flow, and evaluates their performance against standard synchronous implementations. © 2006 IEEE.

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Results 1–25 of 28
Results 1–25 of 28