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Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Wood, Michael G.; Bahr, Matthew; Serkland, Darwin K.; Gutierrez, Jordan E.; Anderson, Evan M.; Finnegan, Patrick S.; Weatherred, Scott E.; Martinez, William M.; Laros, James H.; Reyna, Robert; Arterburn, Shawn C.; Friedmann, Thomas A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex; Klem, John F.; Long, Christopher M.; Olesberg, Jonathon T.; Shank, Joshua S.; Chumney, Daniel R.; Looker, Quinn M.

We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.