Analytic relations that describe crack growth are vital for modeling experiments and building a theoretical understanding of fracture. Upon constructing an idealized model system for the crack and applying the principles of statistical thermodynamics, it is possible to formulate the rate of thermally activated crack growth as a function of load, but the result is analytically intractable. Here, an asymptotically correct theory is used to obtain analytic approximations of the crack growth rate from the fundamental theoretical formulation. These crack growth rate relations are compared to those that exist in the literature and are validated with respect to Monte Carlo calculations and experiments. The success of this approach is encouraging for future modeling endeavors that might consider more complicated fracture mechanisms, such as inhomogeneity or a reactive environment.
Fracture prognosis and characterization efforts require knowledge of crack tip position and the Stress Intensity Factors (SIFs) acting in the vicinity of the crack. Here, we present an efficient numerical approach to infer both of these characteristics under a consistent theoretical framework from noisy, unstructured displacement data. The novel approach utilizes the separability of the asymptotic linear elastic fracture mechanics fields to expedite the search for crack tip position and is particularly useful for noisy displacement data. The manuscript begins with an assessment of the importance of accurately locating crack tip position when quantifying the SIFs from displacement data. Next, the proposed separability approach for quickly inferring crack tip position is introduced. Comparing to the widely used displacement correlation approach, the performance of the separability approach is assessed. Cases involving both noisy data and systematic deviation from the asymptotic linear elastic fracture mechanics model are considered, e.g. inelastic material behavior and finite geometries. An open source python implementation of the proposed approach is available for use by those doing field and laboratory work involving digital image correlation and simulations, e.g. finite element, discrete element, molecular dynamics and peridynamics, where the crack tip position is not explicitly defined.
In this project, we demonstrated stable nanoscale fracture in single-crystal silicon using an in-situ wedge-loaded double cantilever beam (DCB) specimen. The fracture toughness KIC was calculated directly from instrumented measurement of force and displacement via finite element analysis with frictional corrections. Measurements on multiple test specimens were used to show KIC = 0.72 ± 0.07 MPa m1/2 on {111} planes and observe the crack-growth resistance curve in <500 nm increments. The exquisite stability of crack growth, instrumented measurement of material response, and direct visual access to observe nanoscale fracture processes in an ideally brittle material differentiate this approach from prior DCB methods.
Brittle material failure in high consequence systems can appear random and unpredictable at subcritical stresses. Gaps in our understanding of how structural flaws and environmental factors (humidity, temperature) impact fracture propagation need to be addressed to circumvent this issue. A combined experimental and computational approach composed of molecular dynamics (MD) simulations, numerical modeling, and atomic force microscopy (AFM) has been undertaken to identify mechanisms of slow crack growth in silicate glasses. AFM characterization of crack growth as slow as 10-13 m/s was observed, with some stepwise crack growth. MD simulations have identified the critical role of inelastic relaxation in crack propagation, including evolution of the structure during relaxation. A numerical model for the existence of a stress intensity threshold, a stress intensity below which a fracture will not propagate, was developed. This transferrable model for predicting slow crack growth is being incorporated into mission-based programs.
Analytical relations for the mechanical response of single polymer chains are valuable for modeling purposes, on both the molecular and the continuum scale. These relations can be obtained using statistical thermodynamics and an idealized single-chain model, such as the freely jointed chain model. To include bond stretching, the rigid links in the freely jointed chain model can be made extensible, but this almost always renders the model analytically intractable. Here, an asymptotically correct statistical thermodynamic theory is used to develop analytic approximations for the single-chain mechanical response of this model. The accuracy of these approximations is demonstrated using several link potential energy functions. This approach can be applied to other single-chain models, and to molecular stretching in general.
Background:: Subcritical crack growth can occur in a brittle material when the stress intensity factor is smaller than the fracture toughness if an oxidizing agent (such as water) is present at the crack tip. Objective:: We present a novel bi-material beam specimen which can measure environmentally assisted crack growth rates. The specimen is “self-loaded” by residual stress and requires no external loading. Methods:: Two materials with different coefficient of thermal expansion are diffusion bonded at high temperature. After cooling to room temperature a subcritical crack is driven by thermal residual stresses. A finite element model is used to design the specimen geometry in terms of material properties in order to achieve the desired crack tip driving force. Results:: The specimen is designed so that the crack driving force decreases as the crack extends, thus enabling the measurement of the crack velocity versus driving force relationship with a single test. The method is demonstrated by measuring slow crack growth data in soda lime silicate glass and validated by comparison to previously published data. Conclusions:: The self-loaded nature of the specimen makes it ideal for measuring the very low crack velocities needed to predict brittle failure at long lifetimes.