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Stress Intensity Thresholds for Development of Reliable Brittle Materials

Rimsza, Jessica R.; Strong, Kevin T.; Buche, Michael R.; Jones, Reese E.; Nakakura, Craig Y.; Weyrauch, Noah M.; Brow, Richard K.; Duree, Jessica M.; Stephens, Kelly S.; Grutzik, Scott J.

Brittle material failure in high consequence systems can appear random and unpredictable at subcritical stresses. Gaps in our understanding of how structural flaws and environmental factors (humidity, temperature) impact fracture propagation need to be addressed to circumvent this issue. A combined experimental and computational approach composed of molecular dynamics (MD) simulations, numerical modeling, and atomic force microscopy (AFM) has been undertaken to identify mechanisms of slow crack growth in silicate glasses. AFM characterization of crack growth as slow as 10-13 m/s was observed, with some stepwise crack growth. MD simulations have identified the critical role of inelastic relaxation in crack propagation, including evolution of the structure during relaxation. A numerical model for the existence of a stress intensity threshold, a stress intensity below which a fracture will not propagate, was developed. This transferrable model for predicting slow crack growth is being incorporated into mission-based programs.

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