Publications

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We designed, fabricated and measured the performance of nanoelectromechanical (NEMS) switches. Initial data are reported with one of the switch designs having a measured switching time of 400 ns and an operating voltage of 5 V. The switches operated laterally with unmeasurable leakage current in the 'off' state. Surface micromachining techniques were used to fabricate the switches. All processing was CMOS compatible. A single metal layer, defined by a single mask step, was used as the mechanical switch layer. The details of the modeling, fabrication and testing of the NEMS switches are reported.

There is significant interest in forming quantum bits (qubits) out of single electron devices for quantum information processing (QIP). Information can be encoded using properties like charge or spin. Spin is appealing because it is less strongly coupled to the solid-state environment so it is believed that the quantum state can better be preserved over longer times (i.e., that is longer decoherence times may be achieved). Long spin decoherence times would allow more complex qubit operations to be completed with higher accuracy. Recently spin qubits were demonstrated by several groups using electrostatically gated modulation doped GaAs double quantum dots (DQD) [1], which represented a significant breakthrough in the solid-state field. Although no Si spin qubit has been demonstrated to date, work on Si and SiGe based spin qubits is motivated by the observation that spin decoherence times can be significantly longer than in GaAs. Spin decoherence times in GaAs are in part limited by the random spectral diffusion of the non-zero nuclear spins of the Ga and As that couple to the electron spin through the hyperfine interaction. This effect can be greatly suppressed by using a semiconductor matrix with a near zero nuclear spin background. Near zero nuclear spin backgrounds can be engineered using Si by growing {sup 28}Si enriched epitaxy. In this talk, we will present fabrication details and electrical transport results of an accumulation mode double top gated Si metal insulator semiconductor (MIS) nanostructure, Fig 1 (a) & (b). We will describe how this single electron device structure represent a path towards forming a Si based spin qubit similar in design as that demonstrated in GaAs. Potential advantages of this novel qubit structure relative to previous approaches include the combination of: no doping (i.e., not modulation doped); variable two-dimensional electron gas (2DEG) density; CMOS compatible processes; and relatively small vertical length scales to achieve smaller dots. A primary concern in this structure is defects at the insulator-silicon interface. The Sandia National Laboratories 0.35 {micro}m fab line was used for critical processing steps including formation of the gate oxide to examine the utility of a standard CMOS quality oxide silicon interface for the purpose of fabricating Si qubits. Large area metal oxide silicon (MOS) structures showed a peak mobility of 15,000 cm{sup 2}/V-s at electron densities of {approx}1 x 10{sup 12} cm{sup -2} for an oxide thickness of 10 nm. Defect density measured using standard C-V techniques was found to be greater with decreasing oxide thickness suggesting a device design trade-off between oxide thickness and quantum dot size. The quantum dot structure is completed using electron beam lithography and poly-silicon etch to form the depletion gates, Fig 1 (a). The accumulation gate is added by introducing a second insulating Al{sub 2}O{sub 3} layer, deposited by atomic layer deposition, followed by an Al top gate deposition, Fig. 1 (b). Initial single electron transistor devices using SiO{sub 2} show significant disorder in structures with relatively large critical dimensions of the order of 200-300 nm, Fig 2. This is not uncommon for large silicon structures and has been cited in the literature [2]. Although smaller structures will likely minimize the effect of disorder and well controlled small Si SETs have been demonstrated [3], the design constraints presented by disorder combined with long term concerns about effects of defects on spin decoherence time (e.g., paramagnetic centers) motivates pursuit of a 2nd generation structure that uses a compound semiconductor approach, an epitaxial SiGe barrier as shown in Fig. 2 (c). SiGe may be used as an electron barrier when combined with tensilely strained Si. The introduction of strained-Si into the double top gated device structure, however, represents additional fabrication challenges. Thermal budget is potentially constrained due to concerns related to strain relaxation. Fabrication details related to the introduction of strained silicon on insulator and SiGe barrier formation into the Sandia National Laboratories 0.35 {micro}m fab line will also be presented.

The authors have developed a treatment process to improve the etch resistance of an electron beam lithography resist (ZEP 520A) to allow direct pattern transfer from the resist into a hard mask using plasma etching without a metal lift-off process. When heated to 90 C and exposed for 17 min to a dose of approximately 8 mW/cm{sup 2} at 248 nm, changes occur in the resist that are observable using infrared spectroscopy. These changes increase the etch resistance of ZEP 520A to a CF{sub 4}/O{sub 2} plasma. This article will document the observed changes in the improved etch resistance of the ZEP 520A electron beam resist.

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We have investigated the physics of Bloch oscillations (BO) of electrons, engineered in high mobility quantum wells patterned into lateral periodic arrays of nanostructures, i.e. two-dimensional (2D) quantum dot superlattices (QDSLs). A BO occurs when an electron moves out of the Brillouin zone (BZ) in response to a DC electric field, passing back into the BZ on the opposite side. This results in quantum oscillations of the electron--i.e., a high frequency AC current in response to a DC voltage. Thus, engineering a BO will yield continuously electrically tunable high-frequency sources (and detectors) for sensor applications, and be a physics tour-de-force. More than a decade ago, Bloch oscillation (BO) was observed in a quantum well superlattice (QWSL) in short-pulse optical experiments. However, its potential as electrically biased high frequency source and detector so far has not been realized. This is partially due to fast damping of BO in QWSLs. In this project, we have investigated the possibility of improving the stability of BO by fabricating lateral superlattices of periodic coupled nanostructures, such as metal grid, quantum (anti)dots arrays, in high quality GaAs/Al{sub x}Ga{sub 1-x}As heterostructures. In these nanostructures, the lateral quantum confinement has been shown theoretically to suppress the optical-phonon scattering, believed to be the main mechanism for fast damping of BO in QWSLs. Over the last three years, we have made great progress toward demonstrating Bloch oscillations in QDSLs. In the first two years of this project, we studied the negative differential conductance and the Bloch radiation induced edge-magnetoplasmon resonance. Recently, in collaboration with Prof. Kono's group at Rice University, we investigated the time-domain THz magneto-spectroscopy measurements in QDSLs and two-dimensional electron systems. A surprising DC electrical field induced THz phase flip was observed. More measurements are planned to investigate this phenomenon. In addition to their potential device applications, periodic arrays of nanostructures have also exhibited interesting quantum phenomena, such as a possible transition from a quantum Hall ferromagnetic state to a quantum Hall spin glass state. It is our belief that this project has generated and will continue to make important impacts in basic science as well as in novel solid-state, high frequency electronic device applications.

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We describe the development of a novel silicon quantum bit (qubit) device architecture that involves using materials that are compatible with a Sandia National Laboratories (SNL) 0.35 mum complementary metal oxide semiconductor (CMOS) process intended to operate at 100 mK. We describe how the qubit structure can be integrated with CMOS electronics, which is believed to have advantages for critical functions like fast single electron electrometry for readout compared to current approaches using radio frequency techniques. Critical materials properties are reviewed and preliminary characterization of the SNL CMOS devices at 4.2 K is presented.

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We developed techniques to design higher efficiency diffractive optical elements (DOEs) with large numerical apertures (NA) for quantum computing and quantum information processing. Large NA optics encompass large solid angles and thus have high collection efficiencies. Qubits in ion trap architectures are commonly addressed and read by lasers1. Large-scale ion-trap quantum computing2 will therefore require highly parallel optical interconnects. Qubit readout in these systems requires detecting fluorescence from the nearly isotropic radiation pattern of single ions, so efficient readout requires optical interconnects with high numerical aperture. Diffractive optical element fabrication is relatively mature and utilizes lithography to produce arrays compatible with large-scale ion-trap quantum computer architectures. The primary challenge of DOEs is the loss associated with diffraction efficiency. This is due to requirements for large deflection angles, which leads to extremely small feature sizes in the outer zone of the DOE. If the period of the diffractive is between λ (the free space wavelength) and 10λ, the element functions in the vector regime. DOEs in this regime, particularly between 1.5λ and 4λ, have significant coupling to unwanted diffractive orders, reducing the performance of the lens. Furthermore, the optimal depth of the zones with periods in the vector regime differs from the overall depth of the DOE. We will present results indicating the unique behaviors around the 1.5λ and 4λ periods and methods to improve the DOE performance.

Understanding internal dissipation in resonant mechanical systems at the micro- and nanoscale is of great technological and fundamental interest. Resonant mechanical systems are central to many sensor technologies, and microscale resonators form the basis of a variety of scanning probe microscopies. Furthermore, coupled resonant mechanical systems are of great utility for the study of complex dynamics in systems ranging from biology to electronics to photonics. In this work, we report the detailed experimental study of internal dissipation in micro- and nanomechanical oscillators fabricated from amorphous and crystalline diamond materials, atomistic modeling of dissipation in amorphous, defect-free, and defect-containing crystalline silicon, and experimental work on the properties of one-dimensional and two-dimensional coupled mechanical oscillator arrays. We have identified that internal dissipation in most micro- and nanoscale oscillators is limited by defect relaxation processes, with large differences in the nature of the defects as the local order of the material ranges from amorphous to crystalline. Atomistic simulations also showed a dominant role of defect relaxation processes in controlling internal dissipation. Our studies of one-dimensional and two-dimensional coupled oscillator arrays revealed that it is possible to create mechanical systems that should be ideal for the study of non-linear dynamics and localization.

Sandia National Laboratories and Mytek, LLC have collaborated to develop a monolithically-integrated vertical-cavity surface-emitting laser (VCSEL) assembly with controllable polarization states suitable for use in chip-scale atomic clocks. During the course of this work, a robust technique to provide polarization control was modeled and demonstrated. The technique uses deeply-etched surface gratings oriented at several different rotational angles to provide VCSEL polarization stability. A rigorous coupled-wave analysis (RCWA) model was used to optimize the design for high polarization selectivity and fabrication tolerance. The new approach to VCSEL polarization control may be useful in a number of defense and commercial applications, including chip-scale atomic clocks and other low-power atomic sensors.

We demonstrate a robust approach to VCSEL polarization control using deeply-etched surface gratings oriented at several different rotational angles. A RCWA model is used to optimize the design for high polarization selectivity and fabrication tolerance. © 2006 Optical Society of America.

The goal of this project is to fabricate a four-state pixelated subwavelength optical device that enables mid-wave infrared (MWIR) or long-wave infrared (LWIR) snapshot polarimetric imaging. The polarization information can help to classify imaged materials and identify objects of interest for numerous remote sensing and military applications. While traditional, sequential polarimetric imaging produces scenes with polarization information through a series of assembled images, snapshot polarimetric imaging collects the spatial distribution of all four Stokes parameters simultaneously. In this way any noise due to scene movement from one frame to the next is eliminated. We fabricated several arrays of subwavelength components for MWIR polarization imaging applications. Each pixel unit of the array consists of four elements. These elements are micropolarizers with three or four different polarizing axis orientations. The fourth element sometimes has a micro birefringent waveplate on the top of one of the micropolarizers. The linear micropolarizers were fabricated by patterning nano-scale metallic grids on a transparent substrate. A large area birefringent waveplate was fabricated by deeply etching a subwavelength structure into a dielectric substrate. The principle of making linear micropolarizers for long wavelengths is based upon strong anisotropic absorption of light in the nano-metallic grid structures. The nano-metallic grid structures are patterned with different orientations; therefore, the micropolarizers have different polarization axes. The birefringent waveplate is a deeply etched dielectric one-dimensional subwavelength grating; therefore two orthogonally polarized waves have different phase delays. Finally, in this project, we investigated the near field and diffractive effects of the subwavelength element apertures upon detection. The fabricated pixelated polarizers had a measured extinction ratios larger than 100:1 for pixel sizes in the order of 15 {micro}m by 15 {micro}m that exceed by 7 times previously reported devices. The fabricated birefringent diffractive waveplates had a total variation of phase delay rms of 9.41 degrees with an average delay of 80.6 degrees across the MWIR spectral region. We found that diffraction effects change the requirement for separation between focal plane arrays (FPA) micropolarizer arrays and birefringent waveplates arrays, originally in the order of hundreds of microns (which are the typical substrate thickness) to a few microns or less. This new requirement leads us to propose new approaches to fabricate these devices.