Publications

Results 451–475 of 479

Search results

Jump to search filters

Experimental apparatus and software design for dynamic long-term reliability testing of a spring-mass MEMS device

Proceedings of SPIE - The International Society for Optical Engineering

Reu, Phillip L.; Tanner, Danelle M.; Epp, David S.; Parson, Ted B.; Boyce, Brad L.

Long-term reliability testing of Micro-Electro-Mechanical Systems (MEMS) is important to the acceptance of these devices for critical and high-impact applications. In order to make predictions on aging mechanisms, these validation experiments must be performed in controlled environments. Additionally, because the aging acceleration factors are not understood, the experiments can last for months. This paper describes the design and implementation of a long-term MEMS reliability test bed for accelerated life testing. The system is comprised of a small environmental chamber mounted on an electrodynamic shaker with a laser Doppler vibrometer (LDV) and digital camera for data collection. The humidity and temperature controlled chamber has capacity for 16 MEMS components in a 4×4 array. The shaker is used to dynamically excite the devices using broadband noise, chirp or any other programmed signal via the control software. Driving amplitudes can be varied to maintain the actuation of the test units at the desired level. The actuation is monitored optically via the LDV which can report the displacement or velocity information of the surface. A springmass accelerated aging experiment was started using a controlled environment of 5000 ppmv humidity (roughly 13% at room temperature), temperature of 29 °C, and ±80μm maximum displacement of the mass. During the first phase of the experiment, the resonant frequency was measured every 2 hours. From 114.5 to 450 hours under stress, measurements were taken every 12 hours and after that every 24 hours. Resonant frequency tracking indicates no changes in the structures for 4200 hours of testing.

More Details

The strain-rate sensitivity of high-strength high-toughness steels

Boyce, Brad L.; Crenshaw, Thomas B.

The present study examines the strain-rate sensitivity of four high strength, high-toughness alloys at strain rates ranging from 0.0002 s-1 to 200 s-1: Aermet 100, a modified 4340, modified HP9-4-20, and a recently developed Eglin AFB steel alloy, ES-1c. A refined dynamic servohydraulic method was used to perform tensile tests over this entire range. Each of these alloys exhibit only modest strain-rate sensitivity. Specifically, the strain-rate sensitivity exponent m, is found to be in the range of 0.004-0.007 depending on the alloy. This corresponds to a {approx}10% increase in the yield strength over the 7-orders of magnitude change in strain-rate. Interestingly, while three of the alloys showed a concominant {approx}3-10% drop in their ductility with increasing strain-rate, the ES1-c alloy actually exhibited a 25% increase in ductility with increasing strain-rate. Fractography suggests the possibility that at higher strain-rates ES-1c evolves towards a more ductile dimple fracture mode associated with microvoid coalescence.

More Details

Servohydraulic methods for mechanical testing in the Sub-Hopkinson rate regime up to strain rates of 500 1/s

Boyce, Brad L.; Crenshaw, Thomas B.

Tensile and compressive stress-strain experiments on metals at strain rates in the range of 1-1000 1/s are relevant to many applications such as gravity-dropped munitions and airplane accidents. While conventional test methods cover strain rates up to {approx}10 s{sup -1} and split-Hopkinson and other techniques cover strain rates in excess of {approx}1000 s{sup -1}, there are no well defined techniques for the intermediate or ''Sub-Hopkinson'' strain-rate regime. The current work outlines many of the challenges in testing in the Sub-Hopkinson regime, and establishes methods for addressing these challenges. The resulting technique for obtaining intermediate rate stress-strain data is demonstrated in tension on a high-strength, high-toughness steel alloy (Hytuf) that could be a candidate alloy for earth penetrating munitions and in compression on a Au-Cu braze alloy.

More Details

Nano-electromechanical oscillators (NEMOs) for RF technologies

Friedmann, Thomas A.; Boyce, Brad L.; Czaplewski, David A.; Dyck, Christopher; Webster, James R.; Carton, Andrew J.; Carr, Dustin W.; Keeler, Bianca E.N.; Wendt, Joel R.; Tallant, David R.

Nano-electromechanical oscillators (NEMOs), capacitively-coupled radio frequency (RF) MEMS switches incorporating dissipative dielectrics, new processing technologies for tetrahedral amorphous carbon (ta-C) films, and scientific understanding of dissipation mechanisms in small mechanical structures were developed in this project. NEMOs are defined as mechanical oscillators with critical dimensions of 50 nm or less and resonance frequencies approaching 1 GHz. Target applications for these devices include simple, inexpensive clocks in electrical circuits, passive RF electrical filters, or platforms for sensor arrays. Ta-C NEMO arrays were used to demonstrate a novel optomechanical structure that shows remarkable sensitivity to small displacements (better than 160 fm/Hz {sup 1/2}) and suitability as an extremely sensitive accelerometer. The RF MEMS capacitively-coupled switches used ta-C as a dissipative dielectric. The devices showed a unipolar switching response to a unipolar stimulus, indicating the absence of significant dielectric charging, which has historically been the major reliability issue with these switches. This technology is promising for the development of reliable, low-power RF switches. An excimer laser annealing process was developed that permits full in-plane stress relaxation in ta-C films in air under ambient conditions, permitting the application of stress-reduced ta-C films in areas where low thermal budget is required, e.g. MEMS integration with pre-existing CMOS electronics. Studies of mechanical dissipation in micro- and nano-scale ta-C mechanical oscillators at room temperature revealed that mechanical losses are limited by dissipation associated with mechanical relaxation in a broad spectrum of defects with activation energies for mechanical relaxation ranging from 0.35 eV to over 0.55 eV. This work has established a foundation for the creation of devices based on nanomechanical structures, and outstanding critical research areas that need to be addressed for the successful application of these technologies have been identified.

More Details
Results 451–475 of 479
Results 451–475 of 479
Top