Casing deformation in producing geothermal wells is a common problem in many geothermal fields, mainly due to the active geologic formations where these wells are typically located. Repairs to deformed well casings are necessary to keep the wells in production and to occasionally enter a well for approved plugging and abandonment procedures. The costly alternative to casing remediation is to drill a new well to maintain production and/or drill a well to intersect the old well casing below the deformation for abandonment purposes. The U.S. Department of Energy and the Geothermal Drilling Organization sponsored research and development work at Sandia National Laboratories in an effort to reduce these casing remediation expenditures. Sandia, in cooperation with Halliburton Energy Services, developed a low cost, bridge-plug-type, packer for use in casing remediation work in geothermal well environments. This report documents the development and testing of this commercially available petal-basket packer called the Special Application Coiled Tubing Applied Plug (SACTAP).
Chemically prepared Pb(Zr{sub 0.951}Ti{sub 0.949}){sub 0.982}Nb{sub 0.018}O{sub 3} ceramics were fabricated that were greater than 95% dense for sintering temperatures as low as 925 C. Achieving high density at low firing temperatures permitted isolation of the effects of grain size, from those due to porosity, on both dielectric and pressure induced transformation properties. Specifically, two samples of similar high density, but with grain sizes of 0.7 {micro}m and 8.5 {micro}m, respectively, were characterized. The hydrostatic ferroelectric (FE) to antiferroelectric (AFE) transformation pressure was substantially less (150 MPa) for the lower grain size material than for the larger grain size material. In addition, the dielectric constant increased and the Curie temperature decreased for the sample with lower grain size. All three properties: dielectric constant magnitude, Curie point shift, and FE to AFE phase transformation pressure were shown to be semi-quantitatively consistent with internal stress levels on the order of 100 MPa.
In this letter we discusses the first application of 3-dimensional nonlocal density functional calculations to the interactions of solvated rigid polymers. The three cases considered are cylindrical polymers, bead-chain polymers, and periodic polymers. We calculate potentials of mean force, and show that polymer surface structure plays a critical role in determining the solvation energy landscape which in turn controls routes to assembly of the macromolecules.
For optical fibers used in adverse environments, a carbon coating is frequently deposited on the fiber surface to prevent water and hydrogen ingression that lead respectively to strength degradation through fatigue and hydrogen-induced attenuation. The deposition of a hermetic carbon coating onto an optical fiber during the draw process holds a particular challenge when thermally-cured specialty coatings are subsequently applied because of the slower drawing rate. In this paper, we report on our efforts to improve the low-speed carbon deposition process by altering the composition and concentration of hydrocarbon precursor gases. The resulting carbon layers have been analyzed for electrical resistance, Raman spectra, coating thickness, and surface roughness, then compared to strength data and dynamic fatigue behavior.
We demonstrate for the first time anti-guided coupling of two adjacent vertical-cavity surface-emitting lasers (VCSEL's), obtaining a 1-by-2 phase-locked array at 869 nm. The lateral index modification required for anti-guiding is achieved by a patterned 3-rim etch performed between two epitaxial growths. In contrast with prior evanescently coupled VCSEL's, adjacent anti-guided VCSEL's can emit in-phase and produce a single on-axis lobe in the far field. Greater than 2 mW of in-phase output power is demonstrated with two VCSEL's separated by 8 {micro}m. Moreover, phase locking of two VCSEL's separated by 20 {micro}m is observed, indicating the possibility of a new class of optical circuits based upon VCSEL's that interact horizontally and emit vertically.
In this letter we report the growth (by MOVPE) and characterization of quaternary AlGaInN. A combination of PL, high-resolution XRD, and RBS characterizations enables us to explore and delineate the contours of equil-emission energy and lattice parameters as functions of the quaternary compositions. The observation of room temperature PL emission as short as 351nm (with 20% Al and 5% In) renders initial evidence that the quaternary could be used to provide confinement for GaInN (and possibly GaN). AlGaInN/GdnN MQW heterostructures have also been grown; both x-ray diffraction and PL measurement suggest the possibility of incorporating this quaternary into optoelectronic devices.
Sweeping algorithms have become very mature and can create a semi-structured mesh on a large set of solids. However, these algorithms require that all linking surfaces be mappable or submappable. This restriction excludes solids with imprints or protrusions on the linking surfaces. The grafting algorithm allows these solids to be swept. It then locally modifies the position and connectivity of the nodes on the linking surfaces to align with the graft surfaces. Once a high-quality surface mesh is formed on the graft surface, it is swept along the branch creating a 2 3/4-D mesh.
We present a new shape measure for tetrahedral elements that is optimal in the sense that it gives the distance of a tetrahedron from the set of inverted elements. This measure is constructed from the condition number of the linear transformation between a unit equilateral tetrahedron and any tetrahedron with positive volume. We use this shape measure to formulate two optimization objective functions that are differentiated by their goal: the first seeks to improve the average quality of the tetrahedral mesh; the second aims to improve the worst-quality element in the mesh. Because the element condition number is not defined for tetrahedral with negative volume, these objective functions can be used only when the initial mesh is valid. Therefore, we formulate a third objective function using the determinant of the element Jacobian that is suitable for mesh untangling. We review the optimization techniques used with each objective function and present experimental results that demonstrate the effectiveness of the mesh improvement and untangling methods. We show that a combined optimization approach that uses both condition number objective functions obtains the best-quality meshes.
Objective functions for unstructured hexahedral and tetrahedral mesh optimization are analyzed using matrices and matrix norms. Mesh untangling objective functions that create valid meshes are used to initialize the optimization process. Several new objective functions to achieve element invertibility and quality are investigated, the most promising being the ''condition number''. The condition number of the Jacobian matrix of an element forms the basis of a barrier-based objective function that measures the distance to the set of singular matrices and has the ideal matrix as a stationary point. The method was implemented in the Cubit code, with promising results.
Considerable progress has been made on automatic hexahedral mesh generation in recent years. Several automatic meshing algorithms have proven to be very reliable on certain classes of geometry. While it is always worth pursuing general algorithms viable on more general geometry, a combination of the well-established algorithms is ready to take on classes of complicated geometry. By partitioning the entire geometry into meshable pieces matched with appropriate meshing algorithm the original geometry becomes meshable and may achieve better mesh quality. Each meshable portion is recognized as a meshing feature. This paper, which is a part of the feature based meshing methodology, presents the work on shape recognition and volume decomposition to automatically decompose a CAD model into meshable volumes. There are four phases in this approach: (1) Feature Determination to extinct decomposition features, (2) Cutting Surfaces Generation to form the ''tailored'' cutting surfaces, (3) Body Decomposition to get the imprinted volumes; and (4) Meshing Algorithm Assignment to match volumes decomposed with appropriate meshing algorithms. The feature determination procedure is based on the CLoop feature recognition algorithm that is extended to be more general. Results are demonstrated over several parts with complicated topology and geometry.
A new method for lessening skew in mapped meshes is presented. This new method involves progressive subdivision of a surface into loops consisting of four sides. Using these loops, constraints can then be set on the curves of the surface, which will propagate interval assignments across the surface, allowing a mesh with a better skew metric to be generated.
Current hexahedral mesh generation techniques rely on a set of meshing tools, which when combined with geometry decomposition leads to an adequate mesh generation process. Of these tools, sweeping tends to be the workhorse algorithm, accounting for at least 50% of most meshing applications. Constraints which must be met for a volume to be sweepable are derived, and it is proven that these constraints are necessary but not sufficient conditions for sweepability. This paper also describes a new algorithm for detecting extruded or sweepable geometries. This algorithm, based on these constraints, uses topological and local geometric information, and is more robust than feature recognition-based algorithms. A method for computing sweep dependencies in volume assemblies is also given. The auto sweep detect and sweep grouping algorithms have been used to reduce interactive user time required to generate all-hexahedral meshes by filtering out non-sweepable volumes needing further decomposition and by allowing concurrent meshing of independent sweep groups. Parts of the auto sweep detect algorithm have also been used to identify independent sweep paths, for use in volume-based interval assignment.
Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.
Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.
A liquid crystal (LC) and a side-chain liquid crystalline polymer (SCLCP) were tested as surface acoustic wave (SAW) vapor sensor coatings for discriminating between pairs of isomeric organic vapors. Both exhibit room temperature smectic mesophases. Temperature, electric-field, and pretreatment with self-assembled monolayers comprising either a methyl-terminated or carboxylic acid-terminated alkane thiol anchored to a gold layer in the delay path of the sensor were explored as means of affecting the alignment and selectivity of the LC and SCLCP films. Results for the LC were mixed, while those for the SCLCP showed a consistent preference for the more rod-like isomer of each isomer pair examined.
Most engineering alloys contain numerous alloying elements and their solidification behavior can not typically be modeled with existing binary and ternary phase diagrams. There has recently been considerable progress in the development of thermodynamic software programs for calculating solidification parameters and phase diagrams of multi-component systems. These routines can potentially provide useful input data that are needed in multi-component solidification models. However, these thermodynamic routines require validation before they can be confidently applied to simulations of alloys over a wide range of composition. In this article, a preliminary assessment of the accuracy of the Thermo-Calc NiFe Superalloy database is presented. The database validation is conducted by comparing calculated phase diagram quantities to experimental measurements available in the literature. Comparisons are provided in terms of calculated and measured liquidus and solidus temperatures and slopes, equilibrium distribution coefficients, and multi-component phase diagrams. Reasonable agreement is observed among the comparisons made to date. Examples are provided which illustrate how the database can be used to approximate the solidification sequence and final segregation patterns in multi-component alloys. An additional example of the coupling of calculated phase diagrams to solute redistribution computations in a commercial eight component Ni base superalloy is also presented.
Analytical expressions used to optimize AR coatings for single junction solar cells are extended for use in monolithic, series interconnected multi-junction solar cell AR coating design. The result is an analytical expression which relates the solar cell performance (through J{sub sc}) directly to the AR coating design through the device reflectance. It is also illustrated how AR coating design be used to provide an additional degree of freedom for current matching multi-junction devices.
The C49 to C54 TiSi{sub 2} transformation temperature is shown to be reduced by increasing the ramp rate during rapid thermal processing and this effect is more pronounced for thinner initial Ti and Ti(Ta) films. Experiments were performed on blanket wafers and on wafers that had patterned polycrystalline Si lines with Si{sub 3}N{sub 4} sidewall spacers. Changing the ramp rate caused no change in the transformation temperature for 60 nm blanket Ti films. For blanket Ti films of 25 or 40 nm, however, increasing the ramp rate from 7 to 180 C/s decreased the transformation temperature by 15 C. Studies of patterned lines indicate that sheet resistance of narrow lines is reduced by increased ramp rates for both Ti and Ti(Ta) films, especially as the linewidths decrease below 0.4 {micro}m. This improvement is particularly pronounced for the thinnest Ti(Ta) films, which exhibited almost no linewidth effect after being annealed with a ramp rate of 75 C/s.
The design, fabrication and characterization of a low-voltage rotary stepper motor are presented in this work. Using a five-level polysilicon MEMS technology, steps were taken to increase the capacitance over previous stepper motor designs to generate high torque at low voltages. A low-friction hub was developed to minimize frictional loads due to rubbing surfaces, producing an estimated resistive torque of about 6 pN-m. This design also allowed investigations into the potential benefit of using hard materials such as silicon nitride for lining of both the stationary and rotating hub components. The result is an electrostatic stepper motor capable of operation at less than six volts.
Scanning capacitance microscopy (SCM) was used to study the cross section of an operating p-channel MOSFET. We discuss the novel test structure design and the modifications to the SCM hardware that enabled us to perform SCM while applying dc bias voltages to operate the device. The results are compared with device simulations performed with DAVINCI.
NIST and Sandia have developed a procedure for producing and calibrating critical dimension (CD), or linewidth, reference materials. These reference materials will be used to calibrate metrology instruments used in semiconductor manufacturing. The artifacts, with widths down to 100 nm, are produced in monocrystalline silicon with all feature edges aligned to specific crystal planes. A two-part calibration of these linewidths is used: the primary calibration, with accuracy to within a few lattice plane thicknesses, is accomplished by counting the lattice planes across the sample as-imaged through use of high-resolution transmission electron microscopy (HRTEM). The secondary calibration is the high-precision electrical CD technique. NIST and Sandia are developing critical dimension (CD), or linewidth, reference materials for use by the semiconductor industry. To meet the current requirements of this rapidly changing industry, the widths of the reference features must be at or below the widths of the finest features in production and/or development. Further, these features must produce consistent results no matter which metrology tool (e.g., scanning electron microscope, scanned probe microscope, electrical metrology) is used to make the measurement. This leads to a requirement for the samples to have planar surfaces, known sidewall angles, and uniform material composition. None of the production techniques in use in semiconductor manufacturing can produce features with all these characteristics. In addition, requirements specified in the National Technology Roadmap for Semiconductors indicate that the width of the feature must be accurately calibrated to approximately 1-2 nm, a value well beyond the current capabilities of the instruments used for semiconductor metrology.
Concerning the mitigation of high pressure core melt scenarios, the design objective for future PWRS is to transfer high pressure core melt to low pressure core melt sequences, by means of pressure relief valves at the primary circuit, with such a discharge capacity to limit the pressure in the reactor coolant system to less than 20 bar. Studies have shown that in late in-vessel reflooding scenarios there may be a time window where the pressure is indeed in this range, at the moment of the reactor vessel rupture. It has to be verified that large quantities of corium released from the vessel after failure at pressures <20 bar cannot be carried out of the reactor pit, because the melt collecting and cooling concept of future PWRs would be rendered useless. Existing experiments investigated the melt dispersal phenomena in the context of the DCH resolution for existing power plants in the USA, most of them having cavities with large instrument tunnels leading into subcompartments. For such designs, breaches with small cross sections at high vessel failure pressures had been studied. However, some present and future European PWRs have an annular cavity design without a large pathway out of the cavity other than through the narrow annular gap between the RPV and the cavity wall. Therefore, an experimental program was launched, focusing on the annular cavity design and low pressure vessel failure. The first part of the program comprises two experiments which were performed with thermite melt steam and a prototypic atmosphere in the containment in a scale 1:10. The initial pressure in the RPV-model was 11 and 15 bars, and the breach was a hole at the center of the lower head with a scaled diameter of 100 cm and 40 cm, respectively. The main results were: 78% of melt mass were ejected out of the cavity with the large hole and 21% with the small hole; the maximum pressures in the model containment were 6 bar and 4 bar, respectively. In the second part of the experimental program a detailed investigation of geometry effects is being carried out. The test facility DISCO-C has been built for performing dispersion experiments with cold simulant materials in a 1/18 scale. The fluids are water or bismuth alloy instead of melt, and nitrogen or helium instead of steam.
The couplings among chemical reaction rates, advective and diffusive transport in fractured media or soils, and changes in hydraulic properties due to precipitation and dissolution within fractures and in rock matrix are important for both nuclear waste disposal and remediation of contaminated sites. This paper describes the development and application of LEHGC2.0, a mechanistically-based numerical model for simulation of coupled fluid flow and reactive chemical transport including both fast and slow reactions invariably saturated media. Theoretical bases and numerical implementations are summarized, and two example problems are demonstrated. The first example deals with the effect of precipitation-dissolution on fluid flow and matrix diffusion in a two-dimensional fractured media. Because of the precipitation and decreased diffusion of solute from the fracture into the matrix, retardation in the fractured medium is not as large as the case wherein interactions between chemical reactions and transport are not considered. The second example focuses on a complicated but realistic advective-dispersive-reactive transport problem. This example exemplifies the need for innovative numerical algorithms to solve problems involving stiff geochemical reactions.
We report the growth of InSb on GaAs using InAlSb buffers of high interest for magnetic field sensors. We have grown samples by metal-organic chemical vapor deposition consisting of {approximately} 0.55 {micro}m thick InSb layers with resistive InAlSb buffers on GaAs substrates with measured electron nobilities of {approximately}40,000 cm{sup 2}/V.s. We have investigated the In{sub 1{minus}x}Al{sub x}Sb buffers for compositions x{le}0.22 and have found that the best results are obtained near x=0.12 due to the tradeoff of buffer layer bandgap and lattice mismatch.