Publications

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We show that olefin metathesis can be used in an extremely simple process to rapidly alter the morphology of self-assembled poly(butadiene-b-ethylene oxide) (PB-PEO) dispersions in situ. The addition of a water-insoluble Hoveyda-Grubbs catalyst to aqueous assemblies of PB-PEO leads to degradation of the hydrophobic PB block by well-established metathesis pathways and a concomitant change in the composition of the block copolymer. This phenomenon drives morphological transitions characterized by rapidly decreasing sizes of the self-assembled aggregates, the ultimate extent of which is readily controlled by catalyst concentration. Exemplary cases are presented in which transitions from worm-like micelles to spherical micelles or from vesicles to worm-like micelles can be accomplished within minutes.

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This report catalogues the results of a project exploring the incorporation of organometallic compounds into thermosetting polymers as a means to reduce their residual stress. Various syntheses of polymerizable ferro cene derivatives were attempted with mixed success. Ultimately, a diamine derivative of ferrocene was used as a curing agen t for a commercial epoxy resin, where it was found to give similar cure kinetics and mechanical properties in comparison to conventional curing agents. T he ferrocen e - based material is uniquely able to relax stress above the glass transition, leading to reduced cure stress. We propose that this behavior arises from the fluxional capacity of ferrocene. In support of this notion, nuclear magnetic resonance spectroscopy indicates a substantial increase in chain flexibility in the ferrocene - containing network. Although t he utilization of fluxionality is a novel approach to stress management in epoxy thermosets, it is anticipated to have greater impact in radical - cured ther mosets and linear polymers.

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Physical stress relaxation in rubbery, thermoset polymers is limited by cross-links, which impede segmental motion and restrict relaxation to network defects, such as chain ends. In parallel, the cure shrinkage associated with thermoset polymerizations leads to the development of internal residual stress that cannot be effectively relaxed. Recent strategies have reduced or eliminated such cure stress in thermoset polymers largely by exploiting chemical relaxation processes, wherein temporary cross-links or otherwise transient bonds are incorporated into the polymer network. Here, we explore an alternative approach, wherein physical relaxation is enhanced by the incorporation of organometallic sandwich moieties into the backbone of the polymer network. A standard epoxy resin is cured with a diamine derivative of ferrocene and compared to conventional diamine curing agents. The ferrocene-based thermoset is clearly distinguished from the conventional materials by reduced cure stress with increasing cure temperature as well as unique stress relaxation behavior above its glass transition in the fully cured state. The relaxation experiments exhibit features characteristic of a physical relaxation process. Furthermore, the cure stress is observed to vanish precipitously upon deliberate introduction of network defects through an increasing imbalance of epoxy and amine functional groups. We postulate that these beneficial properties arise from fluxional motion of the cyclopentadienyl ligands on the polymer backbone.

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Preparation of sodium zirconium silicate phosphate (NaSICon), Na1+ xZr2SixP3− xO12(0.25 ≤ x ≤ 1.0), thin films has been investigated via a chemical solution approach on platinized silicon substrates. Increasing the silicon content resulted in a reduction in the crystallite size and a reduction in the measured ionic conductivity. Processing temperature was also found to affect microstructure and ionic conductivity with higher processing temperatures resulting in larger crystallite sizes and higher ionic conductivities. The highest room temperature sodium ion conductivity was measured for an x = 0.25 composition at 2.3 × 10−5 S/cm. The decreasing ionic conductivity trends with increasing silicon content and decreasing processing temperature are consistent with grain boundary and defect scattering of conducting ions.

Fiber Bragg gratings (FBGs) are well-suited for embedded sensing of interfacial phenomena in materials systems, due to the sensitivity of their spectral response to locally non-uniform strain fields. Over the last 15 years, FBGs have been successfully employed to sense delamination at interfaces, with a clear emphasis on planar events induced by transverse cracks in fiber-reinforced plastic laminates. We have built upon this work by utilizing FBGs to detect circular delamination events at the interface between epoxy films and alumina substrates. Two different delamination processes are examined, based on stress relief induced by indentation of the epoxy film or by cooling to low temperature. We have characterized the spectral response pre-and post-delamination for both simple and chirped FBGs as a function of delamination size. We show that delamination is readily detected by the evolution of a non-uniform strain distribution along the fiber axis that persists after the stressing condition is removed. These residual strain distributions differ substantially between the delamination processes, with indentation and cooling producing predominantly tensile and compressive strain, respectively, that are well-captured by Gaussian profiles. More importantly, we observe a strong correlation between spectrally-derived measurements, such as spectral widths, and delamination size. Our results further highlight the unique capabilities of FBGs as diagnostic tools for sensing delamination in materials systems.

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