Publications

18 Results

Search results

Jump to search filters

Development of “Dropkinson” bar for intermediate strain-rate testing

Conference Proceedings of the Society for Experimental Mechanics Series

Song, Bo S.; Sanborn, Brett S.; Heister, Jack D.; Everett, Randy L.; Martinez, Thomas L.; Groves, Gary E.; Johnson, Evan P.; Kenney, Dennis J.; Knight, Marlene E.; Spletzer, Matthew A.

A new apparatus – “Dropkinson Bar” – has been successfully developed for material property characterization at intermediate strain rates. This Dropkinson bar combines a drop table and a Hopkinson bar. The drop table was used to generate a relatively long and stable low-speed impact to the specimen, whereas the Hopkinson bar principle was applied to measure the load history with accounting for inertia effect in the system. Pulse shaping technique was also applied to the Dropkinson bar to facilitate uniform stress and strain as well as constant strain rate in the specimen. The Dropkinson bar was then used to characterize 304L stainless steel and 6061-T6 aluminum at a strain rate of ∼600 s−1. The experimental data obtained from the Dropkinson bar tests were compared with the data obtained from conventional Kolsky tensile bar tests of the same material at similar strain rates. Both sets of experimental results were consistent, showing the newly developed Dropkinson bar apparatus is reliable and repeatable.

More Details

Development of "dropkinson" Bar for Intermediate Strain-rate Testing

EPJ Web of Conferences

Song, Bo S.; Sanborn, Brett S.; Heister, Jack D.; Everett, Randy L.; Martinez, Thomas L.; Groves, Gary E.; Johnson, Evan P.; Kenney, Dennis J.; Knight, Marlene E.; Spletzer, Matthew A.

A new apparatus-"Dropkinson Bar"-has been successfully developed for material property characterization at intermediate strain rates. This Dropkinson bar combines a drop table and a Hopkinson bar. The drop table is used to generate a relatively long and stable low-speed impact to the tensile specimen, whereas the Hopkinson bar principle is applied to measure the load history with accounting for inertia effects in the system. In addition, pulse shaping techniques were applied to the Dropkinson bar to facilitate uniform stress and strain as well as constant strain rate in the specimen. The Dropkinson bar was used to characterize 304L stainless steel and 6061-T6 aluminum at a strain rate of ~600 s-1. The experimental data obtained from the Dropkinson bar tests were compared with the data obtained from conventional Kolsky tensile bar tests of the same material at similar strain rates. Both sets of experimental results were consistent, showing the newly developed Dropkinson bar apparatus is reliable and repeatable.

More Details

Properties of Syntactic Foam for Simulation of Mechanical Insults

Hubbard, Neal B.; Haulenbeek, Kimberly K.; Spletzer, Matthew A.; Ortiz, Lyndsy O.

Syntactic foam encapsulation protects sensitive components. The energy mitigated by the foam is calculated with numerical simulations. The properties of a syntactic foam consisting of a mixture of an epoxy-rubber adduct and glass microballoons are obtained from published literature and test results. The conditions and outcomes of the tests are discussed. The method for converting published properties and test results to input for finite element models is described. Simulations of the test conditions are performed to validate the inputs.

More Details

Effects of mechanical stress on thermal microactuator performance

Journal of Micromechanics and Microengineering

Phinney, Leslie M.; Spletzer, Matthew A.; Baker, Michael S.; Serrano, Justin R.

Mechanical stresses on microsystems die induced by packaging processes and varying environmental conditions can affect the performance and reliability of microsystems devices. Thermal microactuators and stress gauges were fabricated using the Sandia five-layer SUMMiT surface micromachining process and diced to fit in a four-point bending stage. The sample dies were tested under tension and compression at stresses varying from ?250 MPa, compressive, to 200 MPa, tensile. Stress values were validated by both on-die stress gauges and micro-Raman spectroscopy measurements. Thermal microactuator displacement is measured for applied currents up to 35 mA as the mechanical stress is systematically varied. Increasing tensile stress decreases the initial actuator displacement. In most cases, the incremental thermal microactuator displacement from the zero current value for a given applied current decreases when the die is stressed. Numerical model predictions of thermal microactuator displacement versus current agree with the experimental results. Quantitative information on the reduction in thermal microactuator displacement as a function of stress provides validation data for MEMS models and can guide future designs to be more robust to mechanical stresses. © 2010 IOP Publishing Ltd.

More Details
18 Results
18 Results