Publications

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This report describes the features of monolithic, series connected silicon (Si) photovoltaic (PV) cells which have been developed for applications requiring higher voltages than obtained with conventional single junction solar cells. These devices are intended to play a significant role in micro / mini firing systems and fuzing systems for DOE and DOD applications. They are also appropriate for other applications (such as micro-electro-mechanical-systems (MEMS) actuation as demonstrated by Bellew et. al.) where electric power is required in remote regions and electrical connection to the region is unavailable or deemed detrimental for whatever reason. Our monolithic device consists of a large number of small PV cells, combined in series and fabricated using standard CMOS processing on silicon-on-insulator (SOI) wafers with 0.4 to 3 micron thick buried oxide (BOX) and top Si thickness of 5 and 10 microns. Individual cell isolation is achieved using the BOX layer of the SOI wafer on the bottom. Isolation along the sides is produced by trenching the top Si and subsequently filling the trench by deposition of dielectric films such as oxide, silicon nitride, or oxynitride. Multiple electrically isolated PV cells are connected in series to produce voltages ranging from approximately 0.5 volts for a single cell to several thousands of volts for strings of thousands of cells.

Retinal prosthesis projects around the world have been pursuing a functional replacement system for patients with retinal degeneration. In this paper, the concept for a micromachined conformal electrode array is outlined. Individual electrodes are designed to float on micromachined springs on a substrate that will enable the adjustment of spring constants-and therefore contact force-by adjusting the dimensions of the springs at each electrode. This also allows the accommodation of the varying curvature/topography of the retina. We believe that this approach provides several advantages by improving the electrode/tissue interface as well as generating some new options for in-situ measurements and overall system design.

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The role of the alumina particle phase and size on polish rate and process temperature was studied to elucidate removal mechanisms involved in tungsten CMP using potassium iodate-based slurries. Additional work including polishing of blanket PETEOS and titanium films, and polishing of M1 to V1 to M2 electrical test structures was performed to determine the performance of the various aluminas in production CMP. The polish rate of tungsten was highest with alpha alumina. Delta/theta and gamma alumina showed lower polish rates. Tungsten and PETEOS polish rates increased with particle size. Only alpha alumina was able to clear the titanium barrier stack. The size of the alpha alumina did not effect the electrical characteristics of short loop electrical test structures.

Several techniques to predict pad failure during tungsten CMP were investigated for a specific consumable set. These techniques include blanket polish rate measurements and metrics derived from two endpoint detection schemes. Blanket polish rate decreased significantly near pad failure. Metrics from the thermal endpoint technique included change in peak temperature, change in the time to reach peak temperature, and the change in the slope of the temperature trace just prior to peak temperature all as a function of pad life. Average carrier motor current before endpoint was also investigated. Changes in these metrics were observed however these changes, excluding time to peak process temperature, were either not consistent between pads or too noisy to be reliable predictors of pad failure.