Publications Details

Modeling Heat Flow Across a Compression Bonded GaN-Diamond Interface for Vertical Power Devices

Cook, Esteban A.; Hodges, Wyatt; Jarzembski, Amun; Delmas, William; Bahr, Matthew N.; Piontkowski, Zachary T.; Treweek, Benjamin; Deitz, Julia I.; Mcdonald, Anthony; Antiporda, Logan; Lu, Ping; Yates, Luke

Abstract not provided.