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Pulsed power accelerator for material physics experiments

Physical Review Special Topics - Accelerators and Beams

Reisman, David R.; Stoltzfus, Brian S.; Stygar, William A.; Austin, Kevin N.; Waisman, Eduardo M.; Hickman, Randy J.; Davis, Jean-Paul D.; Haill, Thomas A.; Knudson, Marcus D.; Seagle, Christopher T.; Brown, Justin L.

We have developed the design of Thor: a pulsed power accelerator that delivers a precisely shaped current pulse with a peak value as high as 7 MA to a strip-line load. The peak magnetic pressure achieved within a 1-cm-wide load is as high as 100 GPa. Thor is powered by as many as 288 decoupled and transit-time isolated bricks. Each brick consists of a single switch and two capacitors connected electrically in series. The bricks can be individually triggered to achieve a high degree of current pulse tailoring. Because the accelerator is impedance matched throughout, capacitor energy is delivered to the strip-line load with an efficiency as high as 50%. We used an iterative finite element method (FEM), circuit, and magnetohydrodynamic simulations to develop an optimized accelerator design. When powered by 96 bricks, Thor delivers as much as 4.1 MA to a load, and achieves peak magnetic pressures as high as 65 GPa. When powered by 288 bricks, Thor delivers as much as 6.9 MA to a load, and achieves magnetic pressures as high as 170 GPa. We have developed an algebraic calculational procedure that uses the single brick basis function to determine the brick-triggering sequence necessary to generate a highly tailored current pulse time history for shockless loading of samples. Thor will drive a wide variety of magnetically driven shockless ramp compression, shockless flyer plate, shock-ramp, equation of state, material strength, phase transition, and other advanced material physics experiments.

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Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

International Journal of Adhesion and Adhesives

Kropka, Jamie M.; Adolf, Douglas B.; Spangler, Scott W.; Austin, Kevin N.; Chambers, Robert S.

The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted for by the glass transition temperature, Tg, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, Tref, by the same amount as the Tg depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive Tg depression, and joint strength is not recoverable by drying. A critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.

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Modeling interfacial fracture in Sierra

Brown, Arthur B.; Ohashi, Yuki O.; Lu, Wei-Yang L.; Nelson, Stacy M.; Austin, Kevin N.; Margolis, Stephen B.

This report summarizes computational efforts to model interfacial fracture using cohesive zone models in the SIERRA/SolidMechanics (SIERRA/SM) finite element code. Cohesive surface elements were used to model crack initiation and propagation along predefined paths. Mesh convergence was observed with SIERRA/SM for numerous geometries. As the funding for this project came from the Advanced Simulation and Computing Verification and Validation (ASC V&V) focus area, considerable effort was spent performing verification and validation. Code verification was performed to compare code predictions to analytical solutions for simple three-element simulations as well as a higher-fidelity simulation of a double-cantilever beam. Parameter identification was conducted with Dakota using experimental results on asymmetric double-cantilever beam (ADCB) and end-notched-flexure (ENF) experiments conducted under Campaign-6 funding. Discretization convergence studies were also performed with respect to mesh size and time step and an optimization study was completed for mode II delamination using the ENF geometry. Throughout this verification process, numerous SIERRA/SM bugs were found and reported, all of which have been fixed, leading to over a 10-fold increase in convergence rates. Finally, mixed-mode flexure experiments were performed for validation. One of the unexplained issues encountered was material property variability for ostensibly the same composite material. Since the variability is not fully understood, it is difficult to accurately assess uncertainty when performing predictions.

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Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses

Spangler, Scott W.; Austin, Kevin N.; Neidigk, Matthew N.; Neilsen, Michael K.; Chambers, Robert S.

Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analyses of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.

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Results 26–41 of 41
Results 26–41 of 41