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Power penalty measurement and frequency chirp extraction in silicon microdisk resonator modulators

2010 Conference on Optical Fiber Communication, Collocated National Fiber Optic Engineers Conference, OFC/NFOEC 2010

Zortman, William A.; Lentine, Anthony L.; Watts, Michael W.; Trotter, Douglas C.

We demonstrate 5Gbs and10Gbs error free operation of silicon photonic microdisk resonant modulators to a distance of 70km, measure dispersion power penalties and compare the experimental results with theoretically derived values. ©2009 Optical Society of America.

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Thermal Microphotonic Focal Plane Array (TM-FPA)

Shaw, Michael S.; Lentine, Anthony L.; Nielson, Gregory N.; Wright, Jeremy B.; Peters, D.W.; Zortman, William A.; McCormick, Frederick B.

The advent of high quality factor (Q) microphotonic-resonators has led to the demonstration of high-fidelity optical sensors of many physical phenomena (e.g. mechanical, chemical, and biological sensing) often with far better sensitivity than traditional techniques. Microphotonic-resonators also offer potential advantages as uncooled thermal detectors including significantly better noise performance, smaller pixel size, and faster response times than current thermal detectors. In particular, microphotonic thermal detectors do not suffer from Johnson noise in the sensor, offer far greater responsivity, and greater thermal isolation as they do not require metallic leads to the sensing element. Such advantages make the prospect of a microphotonic thermal imager highly attractive. Here, we introduce the microphotonic thermal detection technique, present the theoretical basis for the approach, discuss our progress on the development of this technology and consider future directions for thermal microphotonic imaging. Already we have demonstrated viability of device fabrication with the successful demonstration of a 20{micro}m pixel, and a scalable readout technique. Further, to date, we have achieved internal noise performance (NEP{sub Internal} < 1pW/{radical}Hz) in a 20{micro}m pixel thereby exceeding the noise performance of the best microbolometers while simultaneously demonstrating a thermal time constant ({tau} = 2ms) that is five times faster. In all, this results in an internal detectivity of D*{sub internal} = 2 x 10{sup 9}cm {center_dot} {radical}Hz/W, while roughly a factor of four better than the best uncooled commercial microbolometers, future demonstrations should enable another order of magnitude in sensitivity. While much work remains to achieve the level of maturity required for a deployable technology, already, microphotonic thermal detection has demonstrated considerable potential.

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Microphotonic thermal detectors and imagers

Proceedings of SPIE - The International Society for Optical Engineering

Shaw, Michael S.; Rakich, Peter T.; Lentine, Anthony L.; Nielson, Gregory N.; Wright, Jeremy B.; Zortman, William A.; McCormick, Frederick B.

We present the theory of operation along with detailed device designs and initial experimental results of a new class of uncooled thermal detectors. The detectors, termed microphotonic thermal detectors, are based on the thermo-optic effect in high quality factor (Q) micrometer-scale optical resonators. Microphotonic thermal detectors do not suffer from Johnson noise, do not require metallic connections to the sensing element, do not suffer from charge trapping effects, and have responsivities orders of magnitude larger than microbolometer-based thermal detectors. For these reasons, microphotonic thermal detectors have the potential to reach thermal phonon noise limited performance. © 2009 SPIE.

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Ultralow power silicon microdisk modulators and switches

2008 5th International Conference on Group IV Photonics, GFP

Watts, Michael W.; Trotter, Douglas C.; Young, Ralph W.; Lentine, Anthony L.

We demonstrate a 4μm silicon microdisk modulator with a power consumption of 85fJ/bit. The modulator utilizes a reverse-biased. vertical p-n junction to achieve 10Gb/s data transmission, with 3.5V drive voltage, BER<10-12, and without signal pre-emphasis. High-speed silicon bandpass switches are constructed from pairs of modulators. © 2008 IEEE Institute of Electrical and Electronics Engineers.

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Results 126–142 of 142
Results 126–142 of 142