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Determining the resolution of scanning microwave impedance microscopy using atomic-precision buried donor structures

Applied Surface Science

Scrymgeour, David S.; Baca, Ana B.; Fishgrab, Kira L.; Simonson, Robert J.; Marshall, Michael T.; Bussmann, Ezra B.; Nakakura, Craig Y.; Dyck, Meredith L.; Misra, Shashank M.

To quantify the resolution limits of scanning microwave impedance microscopy (sMIM), we created scanning tunneling microscope (STM)-patterned donor nanostructures in silicon composed of 10 nm lines of highly conductive silicon buried under a protective top cap of silicon, and imaged them with sMIM. This dopant pattern is an ideal test of the resolution and sensitivity of the sMIM technique, as it is made with nm-resolution and offers minimal complications from topography convolution. It has been determined that typical sMIM tips can resolve lines down to ∼80 nm spacing, while resolution is independent of tip geometry as extreme tip wear does not change the resolving power, contrary to traditional scanning capacitance microscopy (SCM). Going forward, sMIM is an ideal technique for qualifying buried patterned devices, potentially allowing for quantitative post-fabrication characterization of donor structures, which may be an important tool for the study of atomic-scale transistors and state of the art quantum computation schemes.

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Novel Applications of the Multi-Beam SEM [Abstract Only]

Nakakura, Craig Y.; Michael, Joseph R.; Dyck, Meredith L.; Sniegowski, Jeffry J.

The Zeiss Multi-Beam Scanning Electron Microscope (MultiSEM) was used to image a wide array samples using non-standard operating conditions. The ability of this new, high-throughput imaging technique to produce high-quality images was assessed during this one year LDRD. In addition to exploring new imaging conditions, sample preparation techniques, coupled with theoretical simulations, were explored to optimize the MultiSEM images. To obtain details about the devices imaged, as well as the experimental details, please refer to the classified report from the project manager, Bradley Gabel, or the Cyber IA lead, Justin Ford.

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The effect of embedded Pb on Cu diffusion on Pb/Cu(111) surface alloys

Proposed for publication in Surface Science.

Dyck, Meredith L.; Bartelt, Norman C.; Feibelman, Peter J.; Swartzentruber, Brian S.; Kellogg, Gary L.

We have used scanning tunneling microscopy and low-energy electron microscopy to measure the thermal decay of two-dimensional Cu, Pb-overlayer, and Pb-Cu alloy islands on Pb-Cu(1 1 1) surface alloys. Decay rates covering 6-7 orders of magnitude are accessible by applying the two techniques to the same system. We find that Cu adatom diffusion across the surface alloy is rate-limiting for the decay of both Pb and Pb-Cu islands on the surface alloy and that this rate decreases monotonically with increasing Pb concentration in the alloy. The decrease is attributed to repulsive interactions between Cu adatoms and embedded Pb atoms in the surface alloy. The measured temperature dependences of island decay rates are consistent with first-principles calculations of the Cu binding and diffusion energies related to this 'site-blocking' effect.

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8 Results
8 Results