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2.5D HI Packaging of the Power Converter using TSV interposer

Chung, Hyunim; Young, Andrew I.; Klein, Brianna A.; Mcdonough, Matthew; Neely, Jason C.

Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.

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TYPE Conference Presenation YEAR 2023
DOIOSTI
2 Results
2 Results