Publications

This article presents a comparative analysis of total ionizing dose (TID) response in GlobalFoundries’ (GF) 12 low-power (LP) and 12LP+12-nm bulk fin field effect transistor (FinFET) technologies using 10-keV X-rays. Our findings show that 12LP+ n-type transistors demonstrate higher sensitivity to TID degradation of the off-state leakage drain current compared to 12LP. Data indicate that for both 12LP and 12LP+, transistors with higher threshold voltages (VTs) exhibit lower off-state drain-source leakage postirradiation compared to transistors with lower VTs. Data consistently show that transistors with fewer fins per transistor show superior TID tolerance, in both 12LP and 12LP+ technologies. Lower VT transistors in both technologies display similar preirradiation leakage currents. On the other hand, higher VT transistors in 12LP+ show lower preirradiation leakage currents than those in 12LP, highlighting that the front-end-of-line of 12LP+ technology has been modified compared to 12LP. p-type devices in 12LP+ presented negligible degradation. Larger TID sensitivity in 12LP+ might be attributed to the implementation of dual-metal gate work functions, reduced halo doping, deeper source/drain (S/D) doping profiles, and/or 12LP+ having narrower fins compared to 12LP.

This abstract presents a comprehensive analysis of total ionizing dose (TID) response in GlobalFoundries' (GFs) 12LP 12 nm bulk Fin-based field effect transistor (FinFET) technology using 10 keV X-rays. Devices with higher threshold voltages (VTs) demonstrated lower increases in OFF-state leakage current (I_ DS, OFF ) post-irradiation, highlighting the mitigating role of high VT in TID response. Our data show that transistors with fewer fins exhibit superior TID resistance, implying lower susceptibility to radiation effects. Our study also probed two bias conditions, 'Gate-On' and 'Pass-Gate,' with the former displaying more severe TID degradation. Interestingly, p-type devices displayed negligible degradation, underscoring their inherent resilience to TID effects. Additionally, medium thick n-type devices echoed the fin-count-dependent TID response observed in other transistor types, further strengthening our findings. These results underscore the importance of strategic transistor selection and design for enhancing the TID resilience of future complementary metal-oxide semiconductor (CMOS) FinFET architectures, particularly critical in radiation-intense environments.

During this LDRD project, our team developed a technology which enables the fabrication of novel nanostructures replicating seashell – “nature’s toughest material”. The resulting coatings exhibit high thermal stability up to 1650°C, which exceeds the hardness of Spectra® by ~44%, as well as the compressive strength of aluminum by ~57%. Coatings made with this technology are stronger, environmentally friendly, more sustainable, and more versatile than other comparable materials. Beryllium wafers, the current, most favorable shielding material in terms of thermal and mechanical properties, are very toxic and cost hundreds of times more than the new material developed in this project. The coatings on silicon wafer and stainless steel, respectively, have been tested as ride-along on the Z machine and clearly outperform the bare substrate. Use of this technology will have a profound global impact for pulsed power and fusion energy development, debris mitigation for spacecraft and satellites, durability of drill bits used in deep well drilling and tunnel boring operations, thermal protection of aircraft and manned spacecraft, and various other thermal and mechanical protection applications.

Abstract not provided.