Publications

Jordan, M., Foulk, J.W., Lepkowski, S., Ruyack, A., Wood, M.G., Nordquist, C.D., McDow, J., Anderson, J.L., & Hollowell, A.E. (2023). High Performance 2.5D interposer for RF Applications [Conference Presentation]. 10.2172/2431299

Foulk, J.W., Jordan, M., Hollowell, A.E., Wiwi, M., & Herrera, S. (2022). Fine Pitch Bonding for High Density Interconnects. 10.2172/1893991

McDow, J., Schmitt, R., Foulk, J.W., Baca, E., Menk, L., Hollowell, A.E., & Jordan, M. (2021). Copper Electrodeposition in Through Sillicon Vias: Scaling from Die Level to Wafer Level Plating [Conference Presentation]. 10.2172/1891753

Schmitt, R., Perez, C., Gonzales Kirkpatrick, C., McClain, J., McDow, J., Jordan, M., Baca, E., & Hollowell, A.E. (2021). D03-0658: (Invited) Through-Silicon Via Copper Plating and Endpoint Detection [Conference Presentation]. 10.2172/1890622

Schmitt, R., Menk, L., Baca, E., Jordan, M., Hollowell, A.E., Jackson, N., Romero, J.A., & Bower, J.E. (2021). Void-free copper electrodeposition in high aspect ratio, full wafer thickness through-silicon vias with endpoint detection. Journal of the Electrochemical Society, 167(16). https://doi.org/10.1149/1945-7111/abd56e

Jordan, M., Hollowell, A.E., Gutierrez, J.E., McClain, J., Nordquist, C.D., Michael, C., Wood, M.G., & Young, A.I. (2020). High Density Microbump Development for Multi-Project Wafer (MPW) Die [Conference Presentation]. 10.2172/1830984

Nordquist, C.D., Skogen, E.J., Fortuna, S.A., Hollowell, A.E., Hemmady, C.S., Foulk, J.W., Forbes, T., Wood, M.G., Jordan, M., Dallo, H.J., McClain, J., Lepkowski, S., Alford, C., Peake, G., Pomerene, A., Long, C.J., Serkland, D.K., & Dean, K.A. (2020). Heterogeneous Integration of Silicon Electronics and Compound Semiconductor Optoelectronics for Miniature RF Photonic Transceivers [Conference Poster]. https://www.osti.gov/biblio/1822308

Hollowell, A.E., Beers, K., & Claudet, A. (2020). Heterogeneous Integration Interconnects [Conference Poster]. https://www.osti.gov/biblio/1822642

Douglas, E.A., Hollowell, A.E., Jordan, M., Friedmann, T.A., Wood, M.G., Arrington, C.L., Musick, K.M., & McClain, J. (2020). Advancing Compound Semiconductors Through Heterogeneous Integration [Conference Poster]. https://www.osti.gov/biblio/1821083

Schmitt, R., Menk, L., Jordan, M., Christopher, J., Baca, E., McDow, J., Jackson, N., & Hollowell, A.E. (2020). Cu ECD in High Aspect Ratio Mesoscale TSVs: Scaling from Die Level to Wafer Level Plating [Conference Poster]. https://www.osti.gov/biblio/1830964

Hollowell, A.E., Beers, K., & Bahar Basim, G. (2020). Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies. MRS Advances, 5(37-38), pp. 1929-1935. 10.1557/adv.2020.309

Burkett, S.L., Jordan, M., Schmitt, R., Menk, L., & Hollowell, A.E. (2020). Tutorial on forming through-silicon vias. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 38(3). 10.1116/6.0000026

Schmitt, R., Menk, L., Jordan, M., Christopher, J., Baca, E., Jackson, N., & Hollowell, A.E. (2020). Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating [Conference Poster]. https://www.osti.gov/biblio/1786297

McClain, J., Hollowell, A.E., Menk, L., Schmitt, R., Mook, W.M., Musick, K.M., Grine, A.J., Serkland, D.K., Nordquist, C.D., & Wood, M.G. (2020). Heterogeneous Integration of 3D Photonic Integrated Circuits [Conference Poster]. https://www.osti.gov/biblio/1769564

Nordquist, C.D., Skogen, E.J., Fortuna, S.A., Hollowell, A.E., Hemmady, C.S., Foulk, J.W., Forbes, T., Wood, M.G., Jordan, M., McClain, J., Lepkowski, S., Alford, C., Peake, G., Pomerene, A., Long, C., Serkland, D.K., & Dean, K.A. (2020). Heterogeneous integration of silicon electronics and compound semiconductor optoelectronics for miniature rf photonic transceivers [Conference Poster]. ECS Transactions. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85092800260&origin=inward

Schmitt, R., Hollowell, A.E., Menk, L., Sadler, C.L., & Jordan, M. (2019). Void-Free Copper Electrodeposition in Full Wafer Thickness Through-Silicon Vias (TSVs) [Conference Poster]. https://www.osti.gov/biblio/1643521

Menk, L., Schmitt, R., Han, S.S., Jordan, M., Sadler, C.L., & Hollowell, A.E. (2019). Development of a Scalable Two-Additive Electrodeposition System for Bottom-Up Copper Filling of Sub-Millimeter Through Silicon Vias [Conference Poster]. 10.1149/MA2020-01181151mtgabs

Hollowell, A.E., Finnegan, P.S., Arrington, C.L., Josell, D., Moffat, T., Young, T., Baca, K., Grover, S.M., Thompson, K., & Dagel, A. (2019). Novel Plating Approaches for Grating Fabrication: Conformal Deposition Through Mask Filling and Superfilled Electrodeposition [Conference Poster]. https://www.osti.gov/biblio/1642849

Finnegan, P.S., Hollowell, A.E., Arrington, C.L., Young, T., Baca, K., Grover, S.M., Menk, L., Thompson, K., & Dagel, A. (2019). High aspect ratio silicon template fabrication for 100 keV X-ray phase contrast imaging [Conference Poster]. https://www.osti.gov/biblio/1642850

Hollowell, A.E., McDow, J., McClain, J., Young, A.I., & Dallo, H.J. (2019). Evaluating Surface Tension Self-Alignment of Flip Chip Bonded Die [Conference Poster]. https://www.osti.gov/biblio/1643634

Hollowell, A.E. (2019). Utilizing Electroplating for High Aspect Ratio Mesoscale Fabrication - Filling Forming and Coating [Conference Poster]. https://www.osti.gov/biblio/1641707

Beers, K., & Hollowell, A.E. (2019). Summer Presentation [Conference Poster]. https://www.osti.gov/biblio/1641685

Finnegan, P.S., Hollowell, A.E., Arrington, C.L., Young, T., Baca, K., Menk, L., Thompson, K., & Dagel, A. (2019). Fabrication of extreemly high aspect ratio diffraction gratings for X-ray phase contrast imaging [Presentation]. https://www.osti.gov/biblio/1645320

Hollowell, A.E. (2019). Utilizing Electroplating for 2.5D and 3D Integration [Presentation]. https://www.osti.gov/biblio/1644869

Finnegan, P.S., Hollowell, A.E., Arrington, C.L., & Dagel, A. (2019). High aspect ratio anisotropic silicon etching for x-ray phase contrast imaging grating fabrication. Materials Science in Semiconductor Processing, 92(C), pp. 80-85. 10.1016/j.mssp.2018.06.013

Hollowell, A.E., Arrington, C.L., Resnick, P., Volk, S., Finnegan, P.S., Musick, K.M., & Dagel, A. (2019). Double sided grating fabrication for high energy X-ray phase contrast imaging. Materials Science in Semiconductor Processing, 92(2019), pp. 86-90. 10.1016/j.mssp.2018.04.016

Arrington, C.L., Dagel, A., Hollowell, A.E., Finnegan, P.S., Perez, C., Baca, K., Coleman, J., & st John, C. (2019). LIGA based very HAR Gratings for XPCI Fabrication enabled by Electrochemical Technique [Conference Poster]. https://www.osti.gov/biblio/1639604

Arrington, C.L., Hollowell, A.E., Finnegan, P.S., & st John, C. (2019). CAMD user meeting Stylus Trap Fabrication Update [Presentation]. https://www.osti.gov/biblio/1644806

Arrington, C.L., Finnegan, P.S., Maunz, P.L.W., & Hollowell, A.E. (2019). Extreme Performance Ion Cavity System Ion Trap Microfabrication [Conference Poster]. https://www.osti.gov/biblio/1639603

Hollowell, A.E., Baca, E., Jordan, M., Pillars, J.R., & Michael, C. (2019). Die Level Microbumping and Flip Chip Bonding for MPW Die [Conference Poster]. https://www.osti.gov/biblio/1639613

Arrington, C.L., Langlois, E., Pillars, J.R., Pfeifer, K.B., Hollowell, A.E., & Stick, D. (2019). High Aspect Ratio Metal Microfabrication [Presentation]. https://www.osti.gov/biblio/1644581

Hollowell, A.E., Josell, D., Menk, L., Blain, M., & Moffat, T.P. (2019). Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias. Journal of the Electrochemical Society, 166(1). https://doi.org/10.1149/2.0321901jes

Menk, L., Baca, E., Blain, M., Smith, A., Dominguez, J., McClain, J., Yeh, P.D., & Hollowell, A.E. (2019). Bottom-up copper filling of large scale through silicon vias for MEMS technology. Journal of the Electrochemical Society, 166(1), pp. D3066-D3071. 10.1149/2.0091901jes

Hollowell, A.E., Arrington, C.L., Josell, D., Ambrozik, S., Williams, M.E., & Muramoto, S. (2019). Exploring the limits of bottom-up gold filling to fabricate diffraction gratings. Journal of the Electrochemical Society, 166(16), pp. D898-D907. 10.1149/2.1131915jes

Hollowell, A.E., Menk, L., Baca, E., Blain, M., McClain, J., Dominguez, J., & Smith, A. (2018). Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs. Journal of the Electrochemical Society, 166(1). 10.1149/2.0271901jes

Jordan, M., Baca, E., Pillars, J.R., Michael, C., & Hollowell, A.E. (2018). Batch Level Electroless Under Bump Metallization for Singulated Semiconductor Die [Conference Poster]. https://www.osti.gov/biblio/1592561

Soudachanh, A.L., Grine, A.J., Serkland, D.K., Wood, M.G., Hains, C., Hollowell, A.E., Koch, L., Musick, K.M., Ruiz, L., & Bischoff, J. (2018). Effect of Scaling on the Optical Q of SiN Optomechanical Oscillators [Conference Poster]. https://www.osti.gov/biblio/1889790

Hollowell, A.E., Arrington, C.L., Finnegan, P.S., McClain, J., Musick, K.M., Resnick, P., Volk, S., & Dagel, A. (2018). Double Sided Aligned Si Grating for High Energy X-ray Phase Contrast Imaging [Presentation]. https://www.osti.gov/biblio/1568979

Finnegan, P.S., Hollowell, A.E., Arrington, C.L., & Dagel, A. (2018). Electroformed Fabrication of Extremely High Aspect Ratio Diffraction Gratings for X-ray Phase Contrast Imaging [Conference Poster]. https://www.osti.gov/biblio/1569111

Baca, K., Arrington, C.L., Hollowell, A.E., Finnegan, P.S., Pillars, J.R., Dagel, A., Singh, V., & Nguyen, Q. (2018). Lithographic Development Endpoint Detection Using Electrochemical Techniques [Conference Poster]. https://www.osti.gov/biblio/1594666

Grine, A.J., Serkland, D.K., Wood, M.G., Soudachanh, A.L., Hollowell, A.E., Koch, L., Hains, C., Siddiqui, A., Eichenfield, M., Dagel, D., Grossetete, G., & Matins, B. (2018). Frequency Noise of Silicon Nitride Optomechanical Oscillators with Integrated Waveguides [Conference Poster]. 10.1109/OMN.2018.8454597

Dagel, A., Arrington, C.L., Finnegan, P.S., Goodner, R.N., Hollowell, A.E., & Thompson, K. (2018). Defect detection in foams and encapsulants using grating-based x-ray phase contrast imaging [Conference Poster]. https://www.osti.gov/biblio/1510565

Revelle, M.C., Blain, M., Haltli, R.A., Hollowell, A.E., Nordquist, C.D., Maunz, P.L.W., Lobser, D., Rembetski, J.F., Resnick, P., Proctor, T.J., & Young, K. (2018). Microfabricated Microwave-Integrated Surface Ion Trap [Conference Poster]. https://www.osti.gov/biblio/1525616

Hollowell, A.E., Arrington, C.L., Coleman, J., Finnegan, P.S., Perez, C., Resnick, P., & Dagel, A. (2017). Precision Alignment of Analyzer Gratings for High Energy X-Ray Phase Contrast Imaging [Conference Poster]. https://www.osti.gov/biblio/1484945

Baca, K., Coleman, J., Pillars, J.R., Finnegan, P.S., Perez, C., Seazzu, M.E., Dyer, I.D., st John, C., Hollowell, A.E., Dagel, A., & Arrington, C.L. (2017). Enhanced Lithography Using an Electrochemical Technique to Monitor the Endpoint [Conference Poster]. https://www.osti.gov/biblio/1478155

Maunz, P.L.W., Lobser, D., Haltli, R.A., Hogle, C.W., Hollowell, A.E., Revelle, M.C., Stick, D., Yale, C.G., & Blain, M. (2017). Microfabricated traps for Logical Qubits [Conference Poster]. https://www.osti.gov/biblio/1471818

Finnegan, P.S., Arrington, C.L., Coleman, J., Dagel, A., Hollowell, A.E., & Perez, C. (2017). Extending the Aspect Ratio of Etched Silicon for Precision Electro-coating with Gold to Fabricate XPCI Analyzer Gratings [Conference Poster]. https://www.osti.gov/biblio/1470919

Maunz, P.L.W., Blain, M., Lobser, D., Revelle, M.C., Yale, C.G., Haltli, R.A., Hogle, C.W., Hollowell, A.E., & Stick, D. (2017). High-fidelity qubit operations in microfabricated surface ion traps [Conference Poster]. https://www.osti.gov/biblio/1464719

Blain, M., Haltli, R.A., Hogle, C.W., Hollowell, A.E., Nordquist, C.D., Lepkowski, S., Lobser, D., Yale, C.G., & Maunz, P.L.W. (2017). Microfabrication of Ion Traps for Quantum Science [Conference Poster]. https://www.osti.gov/biblio/1465092

Revelle, M.C., Blain, M., Haltli, R.A., Hogle, C.W., Hollowell, A.E., Lobser, D., Nordquist, C.D., Rembetski, J.F., Resnick, P., Yale, C.G., & Maunz, P.L.W. (2017). Microfabricated Microwave-Integrated Surface Ion Trap [Conference Poster]. https://www.osti.gov/biblio/1465021

Menk, L., & Hollowell, A.E. (2017). Copper Electrodeposition in Mesoscale Through-Silicon-Vias [Presentation]. 10.1149/MA2018-02/22/823

Menk, L., & Hollowell, A.E. (2017). Copper Electrodeposition in Mesoscale Through-Silicon-Vias. https://www.osti.gov/biblio/1876731

Hogle, C.W., Blain, M., Hollowell, A.E., Lobser, D., Revelle, M.C., Yale, C.G., Haltli, R.A., Maunz, P.L.W., Leibfried, D., Todaro, S., McCormick, K., Slichter, D., Wilson, A., & Wineland, D. (2017). Characterization of Microfabricated Surface Ion Traps [Conference Poster]. https://www.osti.gov/biblio/1458282

Revelle, M.C., Blain, M., Haltli, R.A., Hogle, C.W., Hollowell, A.E., Lobser, D., Nordquist, C.D., Rembetski, J.F., Resnick, P., Yale, C.G., & Maunz, P.L.W. (2017). Microfabricated Microwave-Integrated Surface Ion Trap [Conference Poster]. https://www.osti.gov/biblio/1458185

Lobser, D., Blain, M., Haltli, R.A., Hogle, C.W., Hollowell, A.E., Revelle, M.C., Stick, D., Yale, C.G., & Maunz, P.L.W. (2017). A high performance microfabricated surface ion trap [Conference Poster]. https://www.osti.gov/biblio/1458178

Finnegan, P.S., Langlois, E., Arrington, C.L., Hollowell, A.E., Pillars, J.R., Monson, T., & st John, C. (2017). Process Integration of Electroformed MEMS Variable Capacitor for magneto striction measurements [Conference Poster]. https://www.osti.gov/biblio/1456463

Menk, L., Arrington, C.L., & Hollowell, A.E. (2017). Copper Electrodeposition in Mesoscale Through-Silicon-Vias [Presentation]. https://www.osti.gov/biblio/1455136

Maunz, P.L.W., Haltli, R.A., Hollowell, A.E., Lepkowski, S., Lobser, D., Nordquist, C.D., Rembetski, J.F., Revelle, M.C., Yale, C.G., & Blain, M. (2017). Ion traps for logical qubits [Conference Poster]. https://www.osti.gov/biblio/1455329

Menk, L., Arrington, C.L., Hollowell, A.E., & Josell, D. (2017). Copper Electrodeposition in Mesoscale Through-Silicon-Vias [Presentation]. https://www.osti.gov/biblio/1455323

Lobser, D., Blain, M., Haltli, R.A., Hogle, C.W., Hollowell, A.E., Revelle, M.C., Stick, D., Yale, C.G., & Maunz, P.L.W. (2017). Ion Traps For Logical Qubits [Presentation]. https://www.osti.gov/biblio/1458320

Hollowell, A.E., Arrington, C.L., Bauer, T.M., Blain, M., Dagel, A., Dominguez, J., Goeke, R.S., Heller, E.J., Jarecki, R., Loviza, B.G., McClain, J., Menk, L., Ortega, A.C., Pillars, J.R., Resnick, P., & Timon, R. (2016). Utilizing Electroplating for High Aspect Ratio Mesoscale Fabrication - Filling Forming and Coating [Presentation]. https://www.osti.gov/biblio/1416704

st John, C., Arrington, C.L., Pillars, J.R., Langlois, E., Finnegan, P.S., Hollowell, A.E., & Thorpe, A. (2016). Lifecycle Characterization of a High Magnetostriction Cobalt Iron Electroplating Chemistry [Conference Poster]. https://www.osti.gov/biblio/1401908

Perez, C., Pillars, J.R., Hollowell, A.E., Arrington, C.L., & Yelton, W.G. (2016). Understanding Inclusion Mechanisms and Effects in Hardened Gold Electrodeposits [Conference Poster]. https://www.osti.gov/biblio/1401909

Menk, L., Arrington, C.L., Bauer, T.M., Blain, M., Dominguez, J., Dyer, I.D., Goeke, R.S., Han, S.M., Heller, E.J., Hollowell, A.E., Jarecki, R., Loviza, B.G., McClain, J., Pillars, J.R., Resnick, P., st John, C., & Timon, R. (2016). ALD Platinum Surface Preparation and Copper Electrodeposition in Blind Mesoscale Through-Silicon-Vias [Conference Poster]. https://www.osti.gov/biblio/1505438

Hollowell, A.E., Arrington, C.L., Bauer, T.M., Blain, M., Dominguez, J., Goeke, R.S., Heller, E.J., Jarecki, R., Loviza, B.G., McClain, J., Menk, L., Ortega, A.C., Pillars, J.R., Resnick, P., & Timon, R. (2016). A Unique 3D Integration Approach for SOI Substrates [Conference Poster]. https://www.osti.gov/biblio/1397106

Langlois, E., Finnegan, P.S., Ballance, M., Pillars, J.R., Monson, T., Hollowell, A.E., Arrington, C.L., Pearce, C.J., & st John, C. (2016). Modeling and Characterization of Electroformed MEMS Variable Capacitors for Cobalt Iron Magnetostriction Measurements [Conference Poster]. https://www.osti.gov/biblio/1506185

Lobser, D., Blain, M., Fortier, K., Haltli, R.A., Hollowell, A.E., Mizrahi, J., Sterk, J.D., & Maunz, P.L.W. (2016). A Demonstration of the HOA Trap a Versatile Microfabricated Surface Ion Trap [Conference Poster]. https://www.osti.gov/biblio/1376810

Goeke, R.S., Chakmakian, E., Arrington, C.L., Dagel, A., & Hollowell, A.E. (2016). High Aspect Ratio X-Ray Gratings Enabled by Pt ALD [Conference Poster]. https://www.osti.gov/biblio/1505264

Lobser, D., Blain, M., Fortier, K., Haltli, R.A., Hollowell, A.E., Mizrahi, J., Sterk, J.D., & Maunz, P.L.W. (2016). Demonstration of the HOA Trap a Versatile Microfabricated Surface Ion Trap [Conference Poster]. https://www.osti.gov/biblio/1372173

Lobser, D., Blain, M., Haltli, R.A., Hollowell, A.E., Mizrahi, J., Rembetski, J.F., Resnick, P., Sterk, J.D., Stick, D., & Maunz, P.L.W. (2016). A Scalable Microfabricated Ion Trap for Quantum Information Processing [Conference Poster]. https://www.osti.gov/biblio/1420865

Monson, T., Langlois, E., Pillars, J.R., Arrington, C.L., Rodriguez, M.A., Finnegan, P.S., & Hollowell, A.E. (2016). Highly magnetostrictive electrodeposited CoFe for smart tags and sensors [Conference Poster]. https://www.osti.gov/biblio/1347168

Monson, T., Langlois, E., Arrington, C.L., Pillars, J.R., Finnegan, P.S., Hollowell, A.E., st John, C., Pearce, C.J., & Rodriguez, M.A. (2015). Highly magnetostrictive electrodeposited CoFe materials and devices [Conference Poster]. https://www.osti.gov/biblio/1339597

Monson, T., Langlois, E., Pillars, J.R., Arrington, C.L., Hollowell, A.E., Finnegan, P.S., Diantonio, C., Chavez, T.P., Zheng, B., Zhou, Y., & Lavernia, E.J. (2015). Magnetic and ferroelectric materials for power electronics sensing and energy storage [Conference Poster]. https://www.osti.gov/biblio/1335550

Pillars, J.R., Langlois, E., Arrington, C.L., Monson, T., Hollowell, A.E., & Rodriguez, M.A. (2015). Electrodeposition of a High Magnetostriction CoFe Film. Journal of the Electrochemical Society. https://www.osti.gov/biblio/1427218

Arrington, C.L., Pillars, J.R., Langlois, E., Monson, T., & Hollowell, A.E. (2015). Electrochemical Deposition of Samarium Cobalt [Conference Poster]. https://www.osti.gov/biblio/1326344

Hollowell, A.E., Arrington, C.L., Coleman, J., Finnegan, P.S., Rowen, A.M., & Dagel, A. (2015). Extensively Long High Aspect Ratio Gold Analyzer Gratings [Conference Poster]. https://www.osti.gov/biblio/1321813

Henry, M.D., Young, T., Hollowell, A.E., Eichenfield, M., & Olsson, R.H. (2015). Wafer-level packaging of aluminum nitride RF MEMS filters [Conference Poster]. Proceedings - Electronic Components and Technology Conference. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84942094045&origin=inward

Maunz, P.L.W., Berry, C., Clark, C.R., Clark, S.M., Haltli, R.A., Hollowell, A.E., Mizrahi, J., Nordquist, C.D., Resnick, P., Rembetski, J.F., Sterk, J.D., Stick, D., Tabakov, B., Tigges, C.P., van der Wall, J.W., & Blain, M. (2015). Scalable micro-fabricated ion traps for Quantum Information Processing [Conference Poster]. https://www.osti.gov/biblio/1344144

Maunz, P.L.W., Hollowell, A.E., Lobser, D., Nordquist, C.D., Benito, F.M., Clark, C.R., Clark, S.M., Colombo, A., Fortier, K., Haltli, R.A., Heller, E.J., Resnick, P., Rembetski, J.F., Sterk, J.D., Stick, D., Tabakov, B., Tigges, C.P., van der Wall, J.W., Dagel, A., … Scrymgeour, D. (2015). Micro-fabricated ion traps for Quantum Information Processing [Presentation]. https://www.osti.gov/biblio/1268167

Hollowell, A.E., Arrington, C.L., Coleman, J., Finnegan, P.S., Rowen, A.M., & Dagel, A. (2015). Extensively Long High Aspect Ratio Gold Analyzer Gratings [Conference Poster]. https://www.osti.gov/biblio/1260374

Nordquist, C.D., Berry, C.W., Rembetski, J.F., Hollowell, A.E., Resnick, P., Blain, M., McClain, J., Sterk, J.D., Heller, E.J., Haltli, R.A., Fortier, K., & Maunz, P.L.W. (2015). A Microfabricated Ion Trap for Microwave Induced Ion Interactions [PowerPoint] [Presentation]. https://www.osti.gov/biblio/1331615

Henry, M.D., Olsson, R.H., Eichenfield, M., Hollowell, A.E., & Young, T. (2015). Wafer-Level Packaging of Aluminum Nitride RF MEMS Filters [Conference Poster]. https://www.osti.gov/biblio/1255760

Maunz, P.L.W., Benito, F.M., Berry, C.W., Blain, M., Haltli, R.A., Clark, C.R., Clark, S.M., Heller, E.J., Hollowell, A.E., Mizrahi, J., Nordquist, C.D., Resnick, P., Rembetski, J.F., Scrymgeour, D., Sterk, J.D., Tabakov, B., Tigges, C.P., van der Wall, J.W., & Dagel, A. (2015). Scalable micro-fabricated ion traps for Quantum Information Processing [Presentation]. https://www.osti.gov/biblio/1531041

Maunz, P.L.W., Clark, C.R., Haltli, R.A., Hollowell, A.E., Rembetski, J.F., Resnick, P., Sterk, J.D., Stick, D., Tabakov, B., & Blain, M. (2015). Characterization of a High-Optical-Access surface trap optimized for quantum information processing [Conference Poster]. https://www.osti.gov/biblio/1239095

Nordquist, C.D., Berry, C.W., Maunz, P.L.W., Rembetski, J.F., Hollowell, A.E., Resnick, P., Blain, M., Sterk, J.D., & Heller, E.J. (2014). A Microfabricated Ion Trap Designed for Microwave Induced Ion Interactions [Presentation]. https://www.osti.gov/biblio/1504195

Hollowell, A.E., Chakmakian, E., & Arrington, C.L. (2014). High Aspect Ratio 'Infinitely' Long Gold Gratings [Presentation]. https://www.osti.gov/biblio/1242050

Maunz, P.L.W., Heller, E.J., Hollowell, A.E., Kemme, S.A., Loviza, B.G., Mizrahi, J.A., Ortega, A.C., Scrymgeour, D., Sterk, J.D., Tigges, C.P., Dagel, A., Clark, C.R., Stick, D., Blain, M., Clark, S.M., Resnick, P., Arrington, C.L., Benito, F.M., Boye, R., … Haltli, R.A. (2013). Sandia Micro-fabricated Ion Traps for the MUSIQC architecture [Conference]. https://www.osti.gov/biblio/1108210

Hollowell, A.E. (2013). Micromachined stylus ion traps through high aspect ratio lithography and electrochemical deposition [Conference]. https://www.osti.gov/biblio/1078608

Hollowell, A.E. (2013). Micromachined stylus ion traps through high aspect ratio lithography and electrochemical deposition [Conference]. https://www.osti.gov/biblio/1116065

Hollowell, A.E. (2013). Gas Permeable Nanowire Grid Polarizers Integrated into Contact Lenses through Nanoimprint Lithography [Conference]. https://www.osti.gov/biblio/1063584

Hollowell, A.E. (2012). Angle-Insensitive Structural Colours based on metallic nanocavities and Coloured Pixels beyond the Diffraction Limit. Proposed for publication in Nature Scientific Reports.. https://www.osti.gov/biblio/1063506

Hollowell, A.E. (2012). Metallic Gratings and Nanocavities for Display Systems - Design and Fabrication of Polarized Contact Lenses and Angle-Insensitive Structural Color Filters. Proposed for publication in Submitted to the University of Michigan Rackham Graduate School.. https://www.osti.gov/biblio/1063343

Hollowell, A.E., Coleman, J., Rowen, A.M., & Arrington, C.L. (2011). Fabrication of GaAs Micromechanical Resonator Arrays for Single Molecule Detection [Conference]. https://www.osti.gov/biblio/1120284

Rowen, A.M., Moya, X.A., Casias, A.L., Yelton, W.G., Limmer, S.J., Gillen, J.R., Strauch, J.E., Hollowell, A.E., & Coleman, J. (2010). Electrochemical Deposition for Through Via Filling with Solid Metal [Conference]. https://www.osti.gov/biblio/1280966

Rowen, A.M., Hollowell, A.E., Gillen, J.R., Mani, S., & Yelton, W.G. (2010). Indium electrodeposition for finer and denser features flip chip arrays [Conference]. https://www.osti.gov/biblio/1122520